involving movement of a part of the bonding apparatus

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CPC
H01L2224/83148

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83148involving movement of a part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Pressurized underfill cure
- Patent number 8,008,122
- Issue date Aug 30, 2011
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS