involving one or more buried masks

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CPC
H01L21/7681

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7681involving one or more buried masks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,369,292
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
- Patent number 12,368,097
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diagonal vias in semiconductor structures
- Patent number 12,368,106
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,362,229
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM structure
- Patent number 12,362,271
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun huan Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,362,234
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,362,177
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 12,362,188
- Issue date Jul 15, 2025
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure and semiconductor s...
- Patent number 12,363,882
- Issue date Jul 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xinman Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,354,882
- Issue date Jul 8, 2025
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure including probe marked test pads
- Patent number 12,354,921
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) employing multi-pattern metallization to...
- Patent number 12,354,952
- Issue date Jul 8, 2025
- QUALCOMM Incorporated
- Bed Raj Kandel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures
- Patent number 12,354,953
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching metals in semiconductor devices
- Patent number 12,354,881
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,354,913
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer stacking wafer bonding structure and method of manufactu...
- Patent number 12,354,870
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 12,354,899
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor memory device
- Patent number 12,349,340
- Issue date Jul 1, 2025
- United Microelectronics Corp.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with a protection cap at an end port...
- Patent number 12,347,722
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,723
- Issue date Jul 1, 2025
- Kioxia Corporation
- Yumiko Miyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification layer for conductive feature formation
- Patent number 12,347,724
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (PoP) arch...
- Patent number 12,347,743
- Issue date Jul 1, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for cutting dense line patterns using self-ali...
- Patent number 12,347,684
- Issue date Jul 1, 2025
- Yangtze Memory Technologies Co., Ltd.
- Lu Ming Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including metal lines spaced apart from...
- Patent number 12,347,774
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Janggeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked FET contact formation
- Patent number 12,347,767
- Issue date Jul 1, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory stack structure with source line including...
- Patent number 12,349,347
- Issue date Jul 1, 2025
- Kioxia Corporation
- Daigo Ichinose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter block for recessed contacts and methods forming same
- Patent number 12,349,395
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for preparing the same
- Patent number 12,347,686
- Issue date Jul 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...
- Publication number 20250239519
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure with a deep trench capacitor structures and...
- Publication number 20250240985
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-Fan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Via Power Delivery Structure for Stacked Chips
- Publication number 20250233054
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233071
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-TA LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL SELECTIVE PATTERNING FOR STACKED DEVICE CREATION
- Publication number 20250233019
- Publication date Jul 17, 2025
- Geminatio, Inc.
- Brennan Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20250233014
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALABASH-SHAPED MIM CAPACITOR STRUCTURE AND FABRICATING METHOD OF T...
- Publication number 20250234569
- Publication date Jul 17, 2025
- UNITED MICROELECTRONICS CORP.
- Yao-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENTIONAL SEMICONDUCTOR DEVICE
- Publication number 20250233065
- Publication date Jul 17, 2025
- SK HYNIX INC.
- Sung Lae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250233084
- Publication date Jul 17, 2025
- KIOXIA Corporation
- Kyosuke NANAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE DEVICE WITH FIELD PLATE STRUCTURE AND METHOD OF MAN...
- Publication number 20250226261
- Publication date Jul 10, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure For Semiconductor Device
- Publication number 20250226263
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
- Publication number 20250226177
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Kazuhide HASEBE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTERCONNECT LINES WITH LINE WIDTH PROFILE
- Publication number 20250226313
- Publication date Jul 10, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT VIA WITH INDUCED ASYMMETRIC PROFILE
- Publication number 20250218931
- Publication date Jul 3, 2025
- Intel Corporation
- Angelo W. Kandas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA REVEAL PROCESSING AND STRUCTURES
- Publication number 20250218903
- Publication date Jul 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Manufacture
- Publication number 20250218877
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CATALYTIC CONDUCTIVE LAYER AND METHOD FOR...
- Publication number 20250218791
- Publication date Jul 3, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-YU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250221049
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Yong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL
- Publication number 20250218863
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210523
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Jongsoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BACK END OF LINE VIA TO METAL LINE MARG...
- Publication number 20250210513
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250201576
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Gun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS
- Publication number 20250201598
- Publication date Jun 19, 2025
- SCREEN Holdings Co., Ltd.
- Yukifumi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH L-SHAPE CONDUCTIVE FEATURE AND METHODS OF...
- Publication number 20250204020
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONTSIDE-TO-BACKSIDE CONNECTION WITH CUT FOR STACKED TRANSISTOR
- Publication number 20250203974
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH CAVITY STRUCTURE
- Publication number 20250191971
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURABLE PACKAGE INTEGRATED ELECTRO MAGNETIC INTERFERENCE SHI...
- Publication number 20250192068
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Ghaleb Saleh Ghaleb Al-Duhni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIAS USING A HARDMASK AND ANTISPACERS
- Publication number 20250191970
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- David Power
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250192025
- Publication date Jun 12, 2025
- RENESAS ELECTRONICS CORPORATION
- Yuki SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS

involving one or more buried masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming semiconductor device

Memory device

Contact structures for reducing electrical shorts and methods of fo...

Diagonal vias in semiconductor structures

Partial barrier free vias for cobalt-based interconnects and method...

Semiconductor device structures

MIM structure

Contact structure for semiconductor device

Method of manufacturing semiconductor devices

Method for preventing line bending during metal fill process

Method of manufacturing semiconductor structure and semiconductor s...

Semiconductor structure and method for forming the same

Wafer structure including probe marked test pads

Integrated circuits (ICs) employing multi-pattern metallization to...

Via structures

Methods of etching metals in semiconductor devices

Contact structure for semiconductor device

Multilayer stacking wafer bonding structure and method of manufactu...

Semiconductor devices and methods of manufacturing the same

Method of forming semiconductor memory device

Semiconductor device structure with a protection cap at an end port...

Semiconductor device

Surface modification layer for conductive feature formation

Microelectronics package comprising a package-on-package (PoP) arch...

Method and structure for cutting dense line patterns using self-ali...

Integrated circuit devices including metal lines spaced apart from...

Stacked FET contact formation

Three-dimensional memory stack structure with source line including...

Inter block for recessed contacts and methods forming same

Semiconductor device structure and method for preparing the same

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...

Semiconductor structure with a deep trench capacitor structures and...

Through Via Power Delivery Structure for Stacked Chips

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-LEVEL SELECTIVE PATTERNING FOR STACKED DEVICE CREATION

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME

CALABASH-SHAPED MIM CAPACITOR STRUCTURE AND FABRICATING METHOD OF T...

THREE-DIMENTIONAL SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

GALLIUM NITRIDE DEVICE WITH FIELD PLATE STRUCTURE AND METHOD OF MAN...

Contact Structure For Semiconductor Device

FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING

INTERCONNECT LINES WITH LINE WIDTH PROFILE

INTERCONNECT VIA WITH INDUCED ASYMMETRIC PROFILE

VIA REVEAL PROCESSING AND STRUCTURES

Semiconductor Structure and Method of Manufacture

SEMICONDUCTOR DEVICE WITH CATALYTIC CONDUCTIVE LAYER AND METHOD FOR...

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING BACK END OF LINE VIA TO METAL LINE MARG...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS

SEMICONDUCTOR DEVICE WITH L-SHAPE CONDUCTIVE FEATURE AND METHODS OF...

FRONTSIDE-TO-BACKSIDE CONNECTION WITH CUT FOR STACKED TRANSISTOR

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

INTEGRATED CHIP WITH CAVITY STRUCTURE

RECONFIGURABLE PACKAGE INTEGRATED ELECTRO MAGNETIC INTERFERENCE SHI...

FULLY SELF-ALIGNED VIAS USING A HARDMASK AND ANTISPACERS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME