involving one or more buried masks

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CPC
H01L21/7681

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7681involving one or more buried masks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Contact features of semiconductor device and method of forming same
- Patent number 12,272,600
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,272,596
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Junghyuck Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal removal with flowable polymer
- Patent number 12,272,551
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,272,561
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removing polymer through treatment
- Patent number 12,272,595
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,274,053
- Issue date Apr 8, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yaoguang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a barrier layer in an interconnect structure of s...
- Patent number 12,266,567
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,266,539
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with an etch-stop layer forming a cavity
- Patent number 12,266,565
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom barrier free interconnects without voids
- Patent number 12,266,607
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Textile patterning for subtractively-patterned self-aligned interco...
- Patent number 12,261,057
- Issue date Mar 25, 2025
- Tahoe Research, LTD.
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with stacked semiconductor dies
- Patent number 12,255,155
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D memory structure and method of forming the same
- Patent number 12,255,093
- Issue date Mar 18, 2025
- Macronix International Co., Ltd.
- Kuan-Yuan Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ PECVD cap layer
- Patent number 12,252,782
- Issue date Mar 18, 2025
- Lam Research Corporation
- Jeremy David Fields
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for forming semiconductor device
- Patent number 12,256,535
- Issue date Mar 18, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Sheng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,255,173
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of back end of line via to metal line margin improvement
- Patent number 12,255,134
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,255,094
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyuk Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical edge blocking (VEB) technique for increasing patterning pr...
- Patent number 12,249,541
- Issue date Mar 11, 2025
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with an interconnect structure in a...
- Patent number 12,249,542
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line structures and method of forming same
- Patent number 12,243,821
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with L-shape conductive feature and methods of...
- Patent number 12,243,781
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacutring Co., Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask removal without damaging top epitaxial layer
- Patent number 12,243,770
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a three-dimensional memory device using composite...
- Patent number 12,243,776
- Issue date Mar 4, 2025
- SanDisk Technologies, Inc.
- Roshan Jayakhar Tirukkonda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective patterning of vias with hardmasks
- Patent number 12,243,771
- Issue date Mar 4, 2025
- Interational Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures using directed self-assembly fo...
- Patent number 12,237,223
- Issue date Feb 25, 2025
- Intel Corporation
- Paul A. Nyhus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled guided hole and via patterning over grating
- Patent number 12,230,536
- Issue date Feb 18, 2025
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of integrated circuit semiconductor device
- Patent number 12,230,568
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jungha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binning system
- Patent number 12,225,312
- Issue date Feb 11, 2025
- Himax Imaging Limited
- Po-Chang Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...
- Publication number 20250118664
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118594
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT
- Publication number 20250118674
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...
- Publication number 20250118667
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ASSEMBLIES HAVING ONE OR MORE MODIFYING SUBSTANCES DISTR...
- Publication number 20250107089
- Publication date Mar 27, 2025
- Lodestar Licensing Group LLC
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING DECOUPLING CAPACITORS
- Publication number 20250105138
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Xuan Huang
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF VIA FILLING
- Publication number 20250105059
- Publication date Mar 27, 2025
- TOKYO ELECTRON LIMITED
- Ryota Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Buried Interconnect Structure
- Publication number 20250096037
- Publication date Mar 20, 2025
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
- Publication number 20250096135
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sung-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL PLANARIZATION OF NON-METALLIC MATERIALS
- Publication number 20250091176
- Publication date Mar 20, 2025
- CHEMPOWER CORPORATION
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20250098258
- Publication date Mar 20, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250087578
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087579
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sanghyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250089377
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20250087531
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sangjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING
- Publication number 20250089306
- Publication date Mar 13, 2025
- Kabushiki Kaisha Toshiba
- Shingo SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250079315
- Publication date Mar 6, 2025
- WINBOND ELECTRONICS CORP.
- Jian-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250081505
- Publication date Mar 6, 2025
- ARK MICROELECTRONIC CORP. LTD.
- Chin-Fu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250079237
- Publication date Mar 6, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-How Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED LINES AND RELATED FABRICATION TECHNIQUES
- Publication number 20250072118
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Hernan Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...
- Publication number 20250069947
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...
- Publication number 20250070029
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PHOTOMASK AND METHOD FOR FABRICATING SEMICON...
- Publication number 20250069946
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIH-HSUAN YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS
- Publication number 20250070026
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING DIFFERENT TIER PITCHES
- Publication number 20250063733
- Publication date Feb 20, 2025
- Lodestar Licensing Group LLC
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20250062126
- Publication date Feb 20, 2025
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICES
- Publication number 20250056801
- Publication date Feb 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS

involving one or more buried masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact features of semiconductor device and method of forming same

Method of manufacturing semiconductor devices

Selective metal removal with flowable polymer

Method for manufacturing semiconductor device

Removing polymer through treatment

Semiconductor structure and method for forming the same

Method of forming a barrier layer in an interconnect structure of s...

Method of manufacturing semiconductor devices

Integrated chip with an etch-stop layer forming a cavity

Bottom barrier free interconnects without voids

Textile patterning for subtractively-patterned self-aligned interco...

Package structure with stacked semiconductor dies

3D memory structure and method of forming the same

Trench contact structures for advanced integrated circuit structure...

In-situ PECVD cap layer

Semiconductor device and method for forming semiconductor device

Chip package structure

Method of back end of line via to metal line margin improvement

Semiconductor device

Vertical edge blocking (VEB) technique for increasing patterning pr...

Semiconductor device structure with an interconnect structure in a...

Conductive line structures and method of forming same

Semiconductor device with L-shape conductive feature and methods of...

Hard mask removal without damaging top epitaxial layer

Method of making a three-dimensional memory device using composite...

Selective patterning of vias with hardmasks

Contact over active gate structures using directed self-assembly fo...

Self-assembled guided hole and via patterning over grating

Interconnection structure of integrated circuit semiconductor device

Binning system

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT

SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...

INTEGRATED ASSEMBLIES HAVING ONE OR MORE MODIFYING SUBSTANCES DISTR...

SEMICONDUCTOR DEVICES INCLUDING DECOUPLING CAPACITORS

METHOD OF VIA FILLING

Method for Forming a Buried Interconnect Structure

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE

CHEMICAL PLANARIZATION OF NON-METALLIC MATERIALS

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR CHIP STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME

BURIED LINES AND RELATED FABRICATION TECHNIQUES

SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

METHOD FOR FABRICATING PHOTOMASK AND METHOD FOR FABRICATING SEMICON...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS

MEMORY DEVICES INCLUDING DIFFERENT TIER PITCHES

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

VERTICAL MEMORY DEVICES

FORMING LARGE CHIPS THROUGH STITCHING