involving one or more buried masks

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CPC
H01L21/7681

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7681involving one or more buried masks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Vertical edge blocking (VEB) technique for increasing patterning pr...
- Patent number 12,249,541
- Issue date Mar 11, 2025
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with an interconnect structure in a...
- Patent number 12,249,542
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line structures and method of forming same
- Patent number 12,243,821
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with L-shape conductive feature and methods of...
- Patent number 12,243,781
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacutring Co., Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask removal without damaging top epitaxial layer
- Patent number 12,243,770
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a three-dimensional memory device using composite...
- Patent number 12,243,776
- Issue date Mar 4, 2025
- SanDisk Technologies, Inc.
- Roshan Jayakhar Tirukkonda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective patterning of vias with hardmasks
- Patent number 12,243,771
- Issue date Mar 4, 2025
- Interational Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures using directed self-assembly fo...
- Patent number 12,237,223
- Issue date Feb 25, 2025
- Intel Corporation
- Paul A. Nyhus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled guided hole and via patterning over grating
- Patent number 12,230,536
- Issue date Feb 18, 2025
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of integrated circuit semiconductor device
- Patent number 12,230,568
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jungha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binning system
- Patent number 12,225,312
- Issue date Feb 11, 2025
- Himax Imaging Limited
- Po-Chang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic devices including active contacts and support conta...
- Patent number 12,224,240
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 12,225,740
- Issue date Feb 11, 2025
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal heterojunction structure with capping metal layer
- Patent number 12,224,179
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Sheng Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing a via and a metal wiring for a semiconducto...
- Patent number 12,224,237
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,184
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Lin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 12,217,971
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with a polysilicon structure above a stairc...
- Patent number 12,218,081
- Issue date Feb 4, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via formation using spacers
- Patent number 12,218,007
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an individualization zone of an integrated circuit
- Patent number 12,218,083
- Issue date Feb 4, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nicolas Posseme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,219,763
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jisung Cheon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 12,218,003
- Issue date Feb 4, 2025
- Adeia Semiconductor Solutions LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning chamber for metal oxide removal
- Patent number 12,211,737
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors with airgap electrical isolation
- Patent number 12,211,886
- Issue date Jan 28, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Prateek Kumar Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 12,213,317
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard-cell layout structure with horn power and smart metal cut
- Patent number 12,211,793
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor devices
- Patent number 12,205,816
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure and semiconductor structure
- Patent number 12,205,893
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tianlei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250079315
- Publication date Mar 6, 2025
- WINBOND ELECTRONICS CORP.
- Jian-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250081505
- Publication date Mar 6, 2025
- ARK MICROELECTRONIC CORP. LTD.
- Chin-Fu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250079237
- Publication date Mar 6, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-How Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED LINES AND RELATED FABRICATION TECHNIQUES
- Publication number 20250072118
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Hernan Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...
- Publication number 20250069947
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...
- Publication number 20250070029
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PHOTOMASK AND METHOD FOR FABRICATING SEMICON...
- Publication number 20250069946
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIH-HSUAN YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS
- Publication number 20250070026
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING DIFFERENT TIER PITCHES
- Publication number 20250063733
- Publication date Feb 20, 2025
- Lodestar Licensing Group LLC
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20250062126
- Publication date Feb 20, 2025
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICES
- Publication number 20250056801
- Publication date Feb 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE
- Publication number 20250046716
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS
- Publication number 20250048658
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250046625
- Publication date Feb 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTURE
- Publication number 20250048714
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHODS REGARDI...
- Publication number 20250038045
- Publication date Jan 30, 2025
- Micron Technology, Inc.
- Lorenzo Fratin
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FORMING ISOLATION TRENCH, AND ISOLATION TRENCH
- Publication number 20250040203
- Publication date Jan 30, 2025
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xufeng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20250038046
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiangning Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED ELECTRON...
- Publication number 20250038109
- Publication date Jan 30, 2025
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
- Publication number 20250038044
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yingcheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Resistance and High Reliability Metallization Module
- Publication number 20250029874
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTUR...
- Publication number 20250029871
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...
- Publication number 20250029876
- Publication date Jan 23, 2025
- Tahoe Research, Ltd.
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...
- Publication number 20250029945
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INTERCONNECT VIA
- Publication number 20250029872
- Publication date Jan 23, 2025
- IMEC vzw
- Anshul Gupta
- H01 - BASIC ELECTRIC ELEMENTS

involving one or more buried masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vertical edge blocking (VEB) technique for increasing patterning pr...

Semiconductor device structure with an interconnect structure in a...

Conductive line structures and method of forming same

Semiconductor device with L-shape conductive feature and methods of...

Hard mask removal without damaging top epitaxial layer

Method of making a three-dimensional memory device using composite...

Selective patterning of vias with hardmasks

Contact over active gate structures using directed self-assembly fo...

Self-assembled guided hole and via patterning over grating

Interconnection structure of integrated circuit semiconductor device

Binning system

Microelectronic devices including active contacts and support conta...

Dual metal silicide structures for advanced integrated circuit stru...

Metal heterojunction structure with capping metal layer

Method of manufacturing a via and a metal wiring for a semiconducto...

Semiconductor structure and method for forming the same

Method of forming an integrated circuit device having an etch-stop...

Method for forming semiconductor device

Microelectronic devices with a polysilicon structure above a stairc...

Self-aligned via formation using spacers

Method of making an individualization zone of an integrated circuit

Integrated circuit device

Selective ILD deposition for fully aligned via with airgap

Cleaning chamber for metal oxide removal

Inductors with airgap electrical isolation

Memory arrays and methods used in forming a memory array comprising...

Standard-cell layout structure with horn power and smart metal cut

Interconnect structure for semiconductor devices

Method for forming semiconductor structure and semiconductor structure

Three-dimensional memory device having staircase structure and meth...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME

BURIED LINES AND RELATED FABRICATION TECHNIQUES

SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

METHOD FOR FABRICATING PHOTOMASK AND METHOD FOR FABRICATING SEMICON...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS

MEMORY DEVICES INCLUDING DIFFERENT TIER PITCHES

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

VERTICAL MEMORY DEVICES

FORMING LARGE CHIPS THROUGH STITCHING

MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE

CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTURE

ARCHITECTURE OF THREE-DIMENSIONAL MEMORY DEVICE AND METHODS REGARDI...

METHOD FOR FORMING ISOLATION TRENCH, AND ISOLATION TRENCH

METHODS FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY DEVICES

MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED ELECTRON...

MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES

Low Resistance and High Reliability Metallization Module

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTUR...

SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...

SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...

STAIRCASE STRUCTURE FOR MEMORY DEVICE

METHOD FOR PRODUCING AN INTERCONNECT VIA