Membership
Tour
Register
Log in
involving one or more buried masks
Follow
Industry
CPC
H01L21/7681
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/7681
involving one or more buried masks
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
Patent number
11,967,527
Issue date
Apr 23, 2024
Applied Materials, Inc.
He Ren
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inter block for recessed contacts and methods forming same
Patent number
11,967,622
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Te-Chih Hsiung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
Patent number
11,967,556
Issue date
Apr 23, 2024
Biow Hiem Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Source/drain contact having a protruding segment
Patent number
11,968,817
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jui-Lin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective tungsten deposition at low temperatures
Patent number
11,967,525
Issue date
Apr 23, 2024
Applied Materials, Inc.
Yi Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuitry, memory circuitry comprising strings of memory...
Patent number
11,961,801
Issue date
Apr 16, 2024
Micron Technology, Inc.
Lifang Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Staircase formation in three-dimensional memory device
Patent number
11,961,760
Issue date
Apr 16, 2024
Yangtze Memory Technologies Co., Ltd.
Yu Ting Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
Patent number
11,961,767
Issue date
Apr 16, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including through-electrodes
Patent number
11,961,788
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Hyoukyung Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,955,383
Issue date
Apr 9, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Jie Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
Patent number
11,955,424
Issue date
Apr 9, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
Patent number
11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures for bonding elements including conductive interface feat...
Patent number
11,955,393
Issue date
Apr 9, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
Patent number
11,955,534
Issue date
Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etch damage and ESL free dual damascene metal interconnect
Patent number
11,955,376
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sunil Kumar Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Two-stage bake photoresist with releasable quencher
Patent number
11,955,343
Issue date
Apr 9, 2024
Intel Corporation
Robert L. Bristol
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
Patent number
11,955,426
Issue date
Apr 9, 2024
Intel Corporation
Huong Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device and manufacturing method thereof
Patent number
11,955,429
Issue date
Apr 9, 2024
SK hynix Inc.
Chan Ho Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device and semiconductor devices
Patent number
11,955,430
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Differential hardmasks for modulation of electrobucket sensitivity
Patent number
11,955,377
Issue date
Apr 9, 2024
Intel Corporation
Kevin L. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective deposition of barrier layer
Patent number
11,948,834
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structure with anti-adhesion layer
Patent number
11,948,835
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Che-Cheng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for forming dual metal interconnects
Patent number
11,948,885
Issue date
Apr 2, 2024
Applied Materials, Inc.
Suketu A Parikh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench contact structures for advanced integrated circuit structure...
Patent number
11,948,997
Issue date
Apr 2, 2024
Intel Corporation
Subhash M. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor device with p-contact and doped insulation bloc...
Patent number
11,949,006
Issue date
Apr 2, 2024
Infineon Technologies Dresden GmbH & Co. KG
Markus Beninger-Bina
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device
Patent number
11,948,889
Issue date
Apr 2, 2024
Kioxia Corporation
Go Oike
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via patterning for integrated circuits
Patent number
11,942,424
Issue date
Mar 26, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface modification layer for conductive feature formation
Patent number
11,942,362
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jian-Jou Lian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective deposition of a protective layer to reduce interconnect s...
Patent number
11,942,364
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsi-Wen Tien
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
Publication number
20240128152
Publication date
Apr 18, 2024
Intel Corporation
Elizabeth NOFEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
Publication number
20240120313
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Yao YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURES
Publication number
20240120237
Publication date
Apr 11, 2024
Lodestar Licensing Group LLC
Ken Tokashiki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES
Publication number
20240114687
Publication date
Apr 4, 2024
Yangtze Memory Technologies Co., Ltd.
Kun Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH...
Publication number
20240112953
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Jeffrey Alan West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE
Publication number
20240113018
Publication date
Apr 4, 2024
International Business Machines Corporation
Oscar van der Straten
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
Publication number
20240113013
Publication date
Apr 4, 2024
International Business Machines Corporation
Huai Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
Publication number
20240113012
Publication date
Apr 4, 2024
Micron Technology, Inc.
Collin Howder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE WITH INCREASED DECOUPLING CAPACITANCE
Publication number
20240105583
Publication date
Mar 28, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240105507
Publication date
Mar 28, 2024
SK HYNIX INC.
Nam Jae LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABR...
Publication number
20240105520
Publication date
Mar 28, 2024
Intel Corporation
Anthony ST. AMOUR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED FET CONTACT FORMATION
Publication number
20240105590
Publication date
Mar 28, 2024
International Business Machines Corporation
Koichi Motoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MIDDLE OF LINE DIELECTRIC LAYER ENGINEERING FOR VIA VOID PREVENTION
Publication number
20240105505
Publication date
Mar 28, 2024
Applied Materials, Inc.
Nicolas Louis BREIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING SYS...
Publication number
20240105456
Publication date
Mar 28, 2024
SEMES CO., LTD.
Hanglim LEE
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA
Publication number
20240105506
Publication date
Mar 28, 2024
International Business Machines Corporation
Brent A. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
Publication number
20240105598
Publication date
Mar 28, 2024
Intel Corporation
Leonard P. GULER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
Publication number
20240105604
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Sung-Hun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE
Publication number
20240096796
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Yongjin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS
Publication number
20240096698
Publication date
Mar 21, 2024
QUALCOMM Incorporated
Junjing BAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER
Publication number
20240096785
Publication date
Mar 21, 2024
Intel Corporation
June Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
Publication number
20240096595
Publication date
Mar 21, 2024
TOKYO ELECTRON LIMITED
Kazuhide HASEBE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
Publication number
20240096627
Publication date
Mar 21, 2024
TESSERA LLC
Sean D. Burns
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...
Publication number
20240096668
Publication date
Mar 21, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Stefan LANDIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...
Publication number
20240096802
Publication date
Mar 21, 2024
NVIDIA Corporation
Shawn Xiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CO...
Publication number
20240096692
Publication date
Mar 21, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240096691
Publication date
Mar 21, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Mingming MA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
Publication number
20240096693
Publication date
Mar 21, 2024
TESSERA LLC
Christopher J. Penny
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTI-OXIDATION LAYER TO PREVENT DIELECTRIC LOSS FROM PLANARIZATION...
Publication number
20240087906
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Zhen Yu Guan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
Publication number
20240088031
Publication date
Mar 14, 2024
Micron Technology, Inc.
Lifang Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MELT ANNEAL SOURCE AND DRAIN REGIONS
Publication number
20240088225
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Su-Hao Liu
H01 - BASIC ELECTRIC ELEMENTS