involving the material of the bonding area

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CPC
H01L2224/83889

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83889involving the material of the bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device package having an underfill barrier
- Patent number 10,217,649
- Issue date Feb 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding structure and wafer bonding method
- Patent number 10,121,762
- Issue date Nov 6, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 9,613,930
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming electrical interconnecti...
- Patent number 8,574,964
- Issue date Nov 5, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER
- Publication number 20180358238
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING STRUCTURE AND WAFER BONDING METHOD
- Publication number 20180151535
- Publication date May 31, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20150287694
- Publication date Oct 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20150115458
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20140011324
- Publication date Jan 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electrical Interconnecti...
- Publication number 20140008783
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electrical Interconnecti...
- Publication number 20110254146
- Publication date Oct 20, 2011
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS

involving the material of the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid bonding systems and methods for semiconductor wafers

Semiconductor device package having an underfill barrier

Wafer bonding structure and wafer bonding method

Hybrid bonding systems and methods for semiconductor wafers

Hybrid bonding systems and methods for semiconductor wafers

Semiconductor device and method for manufacturing a semiconductor d...

Semiconductor device and method of forming electrical interconnecti...

Patents Applicationslast 30 patents

Hybrid Bonding Systems and Methods for Semiconductor Wafers

SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER

WAFER BONDING STRUCTURE AND WAFER BONDING METHOD

Hybrid Bonding Systems and Methods for Semiconductor Wafers

Hybrid Bonding Systems and Methods for Semiconductor Wafers

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

Hybrid Bonding Systems and Methods for Semiconductor Wafers

Semiconductor Device and Method of Forming Electrical Interconnecti...

Semiconductor Device and Method of Forming Electrical Interconnecti...