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involving the material of the bonding area

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  • CPC
  • H01L2224/11526
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11526involving the material of the bonding area
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bump structure of the semiconductor package
    • Patent number 11,362,055
    • Issue date Jun 14, 2022
    • Powertech Technology Inc.
    • Chih-Yen Su
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 10,872,863
    • Issue date Dec 22, 2020
    • Samsung Electronics Co. Ltd.
    • Joo Young Choi
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents