involving the transfer of heat by flowing fluids

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H01L23/46

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/46involving the transfer of heat by flowing fluids

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Computer system with external bypass air plenum
- Patent number 12,369,281
- Issue date Jul 22, 2025
- Amazon Technologies, Inc.
- David Edward Bryan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Management of heat on a semiconductor device and methods for produc...
- Patent number 12,362,259
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- James S. Rehmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,341,081
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computing system with cooling for controlling temperature of electr...
- Patent number 12,342,454
- Issue date Jun 24, 2025
- Microsoft Technology Licensing, LLC
- Unnikrishnan Vadakkanmaru Veedu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package including stress-reduction structures and met...
- Patent number 12,327,772
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid channel geometry optimizations to improve cooling efficiency
- Patent number 12,322,677
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Ron Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 12,308,364
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride multilayer power module interposer and method
- Patent number 12,300,578
- Issue date May 13, 2025
- TriPent Power LLC
- Stephen P. Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic cooling embedded packaging substrate and manufacturing metho...
- Patent number 12,300,576
- Issue date May 13, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integrated multi-chip cooler module
- Patent number 12,300,577
- Issue date May 13, 2025
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimization of the thermal performance of the 3D ICs utilizing the...
- Patent number 12,293,957
- Issue date May 6, 2025
- Kambix Innovations II, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-fractal heatsink system and method
- Patent number 12,288,731
- Issue date Apr 29, 2025
- FRACTAL HEATSINK TECHNOLOGIES LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,283,490
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Exhaust blending for piezoelectric cooling systems
- Patent number 12,274,020
- Issue date Apr 8, 2025
- Frore Systems Inc.
- Prabhu Sathyamurthy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Choked flow cooling
- Patent number 12,266,591
- Issue date Apr 1, 2025
- SK Hynix NAND Product Solutions Corp.
- Mark Forsnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Embedded cooling systems with coolant channel for device packaging
- Patent number 12,261,099
- Issue date Mar 25, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with turbulent structures
- Patent number 12,255,117
- Issue date Mar 18, 2025
- Google LLC
- Xu Zuo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling heatshield for clamshell BGA rework
- Patent number 12,243,804
- Issue date Mar 4, 2025
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20250239504
- Publication date Jul 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COOLING AND HEATING DEVICE
- Publication number 20250235347
- Publication date Jul 24, 2025
- Xiamen Ubest Electronic Technology Co., Ltd.
- Kunlin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CHIP MODULE DIRECT ATTACH COOLING
- Publication number 20250233051
- Publication date Jul 17, 2025
- International Business Machines Corporation
- Mark D. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COOLING DEVICE
- Publication number 20250233052
- Publication date Jul 17, 2025
- MIBA SINTER AUSTRIA GMBH
- Daniel RIEMER
- B22 - CASTING POWDER METALLURGY
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250233053
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY
- Publication number 20250226288
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AIRFLOW GENERATING PACKAGE
- Publication number 20250223151
- Publication date Jul 10, 2025
- xMEMS Labs, Inc.
- Jemm Yue Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250221320
- Publication date Jul 3, 2025
- Hyundai Motor Company
- Suk Hyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE INCLUDING HEAT RADIATION SYSTEM
- Publication number 20250218894
- Publication date Jul 3, 2025
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active Cooling for Heterogenous Packages
- Publication number 20250210456
- Publication date Jun 26, 2025
- Intel Corporation
- Eduardo De Mesa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20250210458
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module For An Electronic Computing Device
- Publication number 20250201666
- Publication date Jun 19, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Jörg Strogies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250201691
- Publication date Jun 19, 2025
- Hyundai Motor Company
- Nam Sik KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND METHOD FOR ASSEMBLING A POWER DEVICE
- Publication number 20250201665
- Publication date Jun 19, 2025
- Hitachi Energy Ltd
- Milad MALEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMO-MECHANICAL DEVICE FOR COMPUTING SYSTEM
- Publication number 20250174520
- Publication date May 29, 2025
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250169375
- Publication date May 22, 2025
- Hyundai Motor Company
- Suk Hyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
- Publication number 20250167173
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250167066
- Publication date May 22, 2025
- Hyundai Motor Company
- Nam Sik KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING AN INTEGRATED CIRCUIT
- Publication number 20250157882
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- ZhiXin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIEN...
- Publication number 20250140741
- Publication date May 1, 2025
- Intel Corporation
- Rajiv Mongia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140638
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Nobuchika AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
COOLER AND COOLING STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20250118629
- Publication date Apr 10, 2025
- ROHM CO., LTD.
- Tomohiro YASUNISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTION OF COOLING ACROSS MULTIPLE SUBSTRATES OR DIE
- Publication number 20250112119
- Publication date Apr 3, 2025
- Avago Technologies International Sales Pte. Limited
- Jeremy Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION
- Publication number 20250087554
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Chetan Sharma
- H01 - BASIC ELECTRIC ELEMENTS

involving the transfer of heat by flowing fluids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for power module for inverter for electric vehicle

Computer system with external bypass air plenum

Management of heat on a semiconductor device and methods for produc...

Systems and methods for power module for inverter for electric vehicle

Semiconductor device and manufacturing method thereof

Computing system with cooling for controlling temperature of electr...

Systems and methods for multiple output integrated gate driver for...

Systems and methods for galvanic isolation for inverter for electri...

Semiconductor package including stress-reduction structures and met...

Fluid channel geometry optimizations to improve cooling efficiency

Systems and methods for data recorder for inverter for electric veh...

Systems and methods for an interlocking feature on a power module

Power module package for direct cooling multiple power modules

Aluminum nitride multilayer power module interposer and method

Cyclic cooling embedded packaging substrate and manufacturing metho...

Heterogeneous integrated multi-chip cooler module

Optimization of the thermal performance of the 3D ICs utilizing the...

Multi-fractal heatsink system and method

Systems and methods for cooling system and power module for inverte...

Integrated cooling assemblies for advanced device packaging and met...

Systems and methods for parameter drift correction for inverter for...

Exhaust blending for piezoelectric cooling systems

Choked flow cooling

Systems and methods for cooling system and power module for inverte...

Embedded cooling systems with coolant channel for device packaging

Secure semiconductor integration and method for making thereof

Heat sink with turbulent structures

Cooling heatshield for clamshell BGA rework

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Patents Applicationslast 30 patents

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

SEMICONDUCTOR COOLING AND HEATING DEVICE

MULTIPLE CHIP MODULE DIRECT ATTACH COOLING

METHOD FOR PRODUCING A COOLING DEVICE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY

SEMICONDUCTOR DEVICE AND AIRFLOW GENERATING PACKAGE

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

POWER MODULES

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

SEMICONDUCTOR MODULE INCLUDING HEAT RADIATION SYSTEM

Active Cooling for Heterogenous Packages

THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE

Power Module For An Electronic Computing Device

POWER MODULE

POWER DEVICE AND METHOD FOR ASSEMBLING A POWER DEVICE

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

THERMO-MECHANICAL DEVICE FOR COMPUTING SYSTEM

POWER MODULES

PACKAGES FORMED USING RDL-LAST PROCESS

POWER MODULES

SYSTEMS AND METHODS FOR COOLING AN INTEGRATED CIRCUIT

PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIEN...

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

COOLER AND COOLING STRUCTURE FOR SEMICONDUCTOR DEVICE

DISTRIBUTION OF COOLING ACROSS MULTIPLE SUBSTRATES OR DIE

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION