involving the transfer of heat by flowing fluids

Industry

CPC
H01L23/46

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/46involving the transfer of heat by flowing fluids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assembly including coolant channel on the backsi...
- Patent number 12,176,263
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink and cooling device
- Patent number 12,163,746
- Issue date Dec 10, 2024
- Nidec Corporation
- Hidehiko Hidaka
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heatsink and cooling device
- Patent number 12,165,953
- Issue date Dec 10, 2024
- Nidec Corporation
- Hidehiko Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for cooling a heating element
- Patent number 12,158,305
- Issue date Dec 3, 2024
- Kanthal GmbH
- Ralph Miethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processors and integrated circuits including a microelectromechanic...
- Patent number 12,154,843
- Issue date Nov 26, 2024
- Honeywell International Inc.
- Sridhar Vanka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor module, method for manufacturing semiconductor module...
- Patent number 12,148,631
- Issue date Nov 19, 2024
- Fuji Electric Co., Ltd.
- Kazunaga Onishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mechanism
- Patent number 12,140,625
- Issue date Nov 12, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method of manufacturing the same
- Patent number 12,131,975
- Issue date Oct 29, 2024
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Convectors
- Patent number 12,129,868
- Issue date Oct 29, 2024
- Pedro Arnulfo Sarmiento
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Hood for MEMS-based cooling systems
- Patent number 12,127,369
- Issue date Oct 22, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink with increased air flow
- Patent number 12,114,467
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Magnus Kallmark
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal control system
- Patent number 12,110,881
- Issue date Oct 8, 2024
- APR Technologies AB
- Robert Thorslund
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling structure and electrical apparatus
- Patent number 12,107,033
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toyota Jidoshokki
- Toshiaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Solid state drive apparatus and data storage apparatus including th...
- Patent number 12,094,803
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Sungchul Hur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including a deformable flow blocking mem...
- Patent number 12,094,798
- Issue date Sep 17, 2024
- Mitsubishi Electric Corporation
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimization of the thermal performance of the 3D ICs utilizing the...
- Patent number 12,087,663
- Issue date Sep 10, 2024
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fractal heat transfer device
- Patent number 12,078,432
- Issue date Sep 3, 2024
- FRACTAL HEATSINK TECHNOLOGIES LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor apparatus
- Patent number 12,074,090
- Issue date Aug 27, 2024
- Fuji Electric Co., Ltd.
- Shinichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,074,154
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for cooling components in an electronic module
- Patent number 12,068,225
- Issue date Aug 20, 2024
- Whirlpool Corporation
- Nelson Rene Garcia-Polanco
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation member including fin groups
- Patent number 12,061,057
- Issue date Aug 13, 2024
- Nidec Corporation
- Kazuhiro Nishikawa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electrical device having heat generating components with improved h...
- Patent number 12,062,478
- Issue date Aug 13, 2024
- Paolo Pavanello
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Airflow control in active cooling systems
- Patent number 12,033,917
- Issue date Jul 9, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for forming a semiconductor component with a cooling structure
- Patent number 12,027,446
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of circuit boards
- Patent number 12,028,962
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FRACTAL HEAT TRANSFER DEVICE
- Publication number 20240426563
- Publication date Dec 26, 2024
- Fractal Heatsink Technologies LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR, AND...
- Publication number 20240429124
- Publication date Dec 26, 2024
- ROBERT BOSCH GmbH
- Arne Stephen Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOOD FOR MEMS-BASED COOLING SYSTEMS
- Publication number 20240431068
- Publication date Dec 26, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...
- Publication number 20240413054
- Publication date Dec 12, 2024
- Intel Corporation
- Min Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
EMITTERS FOR INTEGRATED POWER CARD COOLING
- Publication number 20240395657
- Publication date Nov 28, 2024
- DENSO International America, Inc.
- Sean Schoneboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTH-SURFACE COOLING SEMICONDUCTOR DEVICE
- Publication number 20240387313
- Publication date Nov 21, 2024
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...
- Publication number 20240379497
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363611
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240355705
- Publication date Oct 24, 2024
- Hyundai Motor Company
- Tae Hwa KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20240347411
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR DEVICE PACKAGES AND METHODS OF COOLING...
- Publication number 20240332128
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING T...
- Publication number 20240334641
- Publication date Oct 3, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Matthias Eisner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING BACKSIDE POWER/GROUND DELIV...
- Publication number 20240332129
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240321681
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Sunggu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING COOLING STRUCTURE
- Publication number 20240312872
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20240304450
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240290632
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
- Publication number 20240290686
- Publication date Aug 29, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT COOLING TYPE SEMICONDUCTOR PACKAGE UNIT AND MANUFACTURING ME...
- Publication number 20240266251
- Publication date Aug 8, 2024
- Republic Of Korea (Defense Acquisition Program Administration)
- Jun Rae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE
- Publication number 20240268058
- Publication date Aug 8, 2024
- NISSAN MOTOR CO., LTD.
- Kenta EMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240266285
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE, ELECTRIC VEHICLE OR HYBRID VEHICLE, AND M...
- Publication number 20240253613
- Publication date Aug 1, 2024
- Rohm Co., Ltd.
- Hideki SAWADA
- B60 - VEHICLES IN GENERAL
Information Patent Application
CHIP HEAT SINK AND NUCLEIC ACID EXTRACTION DEVICE
- Publication number 20240249997
- Publication date Jul 25, 2024
- Beijing BOE Technology Development Co., Ltd.
- Beiyuan FAN
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING
- Publication number 20240249998
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240234247
- Publication date Jul 11, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...
- Publication number 20240235138
- Publication date Jul 11, 2024
- Transportation IP Holdings, LLC
- Henry Todd Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20240222226
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES OF SEMICONDUCTOR DEVICES FOR HEAT DISSIPATION
- Publication number 20240222224
- Publication date Jul 4, 2024
- GLOBALFOUNDRIES U.S. Inc.
- SIVA P. ADUSUMILLI
- H01 - BASIC ELECTRIC ELEMENTS

involving the transfer of heat by flowing fluids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for single channel fault encoding for inverter...

Embedded cooling assemblies for advanced device packaging and metho...

Integrated cooling assembly including coolant channel on the backsi...

Heatsink and cooling device

Systems and methods for phase switch timing controller for inverter...

Heatsink and cooling device

Methods and systems for cooling a heating element

Processors and integrated circuits including a microelectromechanic...

Semiconductor module, method for manufacturing semiconductor module...

Alignment mechanism

Power module and method of manufacturing the same

Convectors

Systems and methods for bidirectional message architecture for inve...

Hood for MEMS-based cooling systems

Heatsink with increased air flow

Thermal control system

Cooling structure and electrical apparatus

Systems and methods for integrated gate driver for inverter for ele...

Solid state drive apparatus and data storage apparatus including th...

Power semiconductor device including a deformable flow blocking mem...

Optimization of the thermal performance of the 3D ICs utilizing the...

Fractal heat transfer device

Semiconductor apparatus

Package structure

System for cooling components in an electronic module

Heat dissipation member including fin groups

Electrical device having heat generating components with improved h...

Airflow control in active cooling systems

Method for forming a semiconductor component with a cooling structure

Thermal management of circuit boards

Patents Applicationslast 30 patents

FRACTAL HEAT TRANSFER DEVICE

ELECTRONIC MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR, AND...

HOOD FOR MEMS-BASED COOLING SYSTEMS

INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

EMITTERS FOR INTEGRATED POWER CARD COOLING

BOTH-SURFACE COOLING SEMICONDUCTOR DEVICE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...

PACKAGE STRUCTURE

POWER MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

EMBEDDED COOLING SYSTEMS FOR DEVICE PACKAGES AND METHODS OF COOLING...

ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING T...

INTEGRATED COOLING ASSEMBLIES INCLUDING BACKSIDE POWER/GROUND DELIV...

HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

APPARATUS INCLUDING COOLING STRUCTURE

ELECTRONIC PACKAGE STRUCTURE

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE

DIRECT COOLING TYPE SEMICONDUCTOR PACKAGE UNIT AND MANUFACTURING ME...

COOLING DEVICE

HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

INTELLIGENT POWER MODULE, ELECTRIC VEHICLE OR HYBRID VEHICLE, AND M...

CHIP HEAT SINK AND NUCLEIC ACID EXTRACTION DEVICE

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

SUBSTRATES OF SEMICONDUCTOR DEVICES FOR HEAT DISSIPATION