involving the transfer of heat by flowing fluids

Industry

CPC
H01L23/46

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/46involving the transfer of heat by flowing fluids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 11,967,548
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat distribution device with flow channels
- Patent number 11,955,400
- Issue date Apr 9, 2024
- Google LLC
- Xu Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control element utilized in device die packages
- Patent number 11,955,406
- Issue date Apr 9, 2024
- Google LLC
- Yingying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum dot devices with overlapping gates
- Patent number 11,942,516
- Issue date Mar 26, 2024
- Intel Corporation
- Nicole K. Thomas
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Stack chip air gap heat insulator
- Patent number 11,942,504
- Issue date Mar 26, 2024
- OmniVision Technologies, Inc.
- Sing-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of three-dimensional integrated circuits
- Patent number 11,942,453
- Issue date Mar 26, 2024
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for cooling power semiconductor devices of a converter
- Patent number 11,937,412
- Issue date Mar 19, 2024
- Bombardier Transportation GmbH
- Ben Diedrichs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motor drive device
- Patent number 11,935,814
- Issue date Mar 19, 2024
- Hyundai Motor Company
- Hyun Koo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package with dual integrated heat spreaders
- Patent number 11,929,298
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with heat dissipation conduit in sidewall i...
- Patent number 11,929,304
- Issue date Mar 12, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acclimated regulating system for electronics packages
- Patent number 11,901,259
- Issue date Feb 13, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink fastener
- Patent number 11,901,265
- Issue date Feb 13, 2024
- Southco, Inc.
- Richard E. Schlack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,263
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Choked flow cooling
- Patent number 11,901,264
- Issue date Feb 13, 2024
- SK hynix NAND Product Solutions Corp.
- Mark Forsnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid heat sink for electronics cooling
- Patent number 11,886,258
- Issue date Jan 30, 2024
- BAIDU USA LLC
- Tianyi Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package structure with offset stacked chips and top and...
- Patent number 11,887,908
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,871,513
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Management of heat on a semiconductor device and methods for produc...
- Patent number 11,869,826
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- James S. Rehmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with protrusions on multiple sides thereof and apparatus...
- Patent number 11,864,348
- Issue date Jan 2, 2024
- Gerald Ho Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fluid mover enclosure
- Patent number 11,859,915
- Issue date Jan 2, 2024
- Advanced Thermal Solutions, Inc.
- Kaveh Azar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable heat exchanger
- Patent number 11,862,534
- Issue date Jan 2, 2024
- Zonghu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,854,936
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,848,251
- Issue date Dec 19, 2023
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 11,848,320
- Issue date Dec 19, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bus bar and power electronic device with current shaping terminal c...
- Patent number 11,837,826
- Issue date Dec 5, 2023
- Transportation IP Holdings, LLC
- Henry Todd Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus
- Patent number 11,839,049
- Issue date Dec 5, 2023
- Nissan Motor Co., Ltd.
- Kenta Emori
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Mobile phone and other compute device cooling architecture
- Patent number 11,830,789
- Issue date Nov 28, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Common cooling solution for multiple packages
- Patent number 11,817,436
- Issue date Nov 14, 2023
- Advanced Micro Devices, Inc.
- Christopher M. Jaggers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mechanism
- Patent number 11,802,908
- Issue date Oct 31, 2023
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling heatshield for clamshell BGA rework
- Patent number 11,791,239
- Issue date Oct 17, 2023
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240136252
- Publication date Apr 25, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...
- Publication number 20240136782
- Publication date Apr 25, 2024
- Transportation IP Holdings, LLC
- Henry Todd Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136251
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20240120328
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240112983
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR...
- Publication number 20240103073
- Publication date Mar 28, 2024
- Intel Corporation
- Patrick PARDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...
- Publication number 20240105553
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Kevin M. Gertiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...
- Publication number 20240105552
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Kevin M. Gertiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR METHOD AND APPARATUS
- Publication number 20240096745
- Publication date Mar 21, 2024
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096764
- Publication date Mar 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SYSTEM INCLUDING THE SAME
- Publication number 20240087982
- Publication date Mar 14, 2024
- SK HYNIX INC.
- Nam Hyeon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240087986
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA STORAGE STRUCTURE OR DATA INFRASTRUCTURE INCLDUING A PLURALITY...
- Publication number 20240071867
- Publication date Feb 29, 2024
- SK HYNIX INC.
- Ho Sung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRAT...
- Publication number 20240074028
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Youngho YOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ALIGNMENT MECHANISM
- Publication number 20240061036
- Publication date Feb 22, 2024
- Delta Design, Inc.
- Jerry Ihor TUSTANIWSKYJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES
- Publication number 20240063089
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063066
- Publication date Feb 22, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240047303
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Kyung Don MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...
- Publication number 20240038631
- Publication date Feb 1, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin Fin Placement Assembly for Forming Temperature Control Element...
- Publication number 20240038620
- Publication date Feb 1, 2024
- Google LLC
- Yingshi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY, ELECTRONIC ASSEMBLY, A...
- Publication number 20240030100
- Publication date Jan 25, 2024
- Audi AG
- Daniel RUPPERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement for Cooling and Motor Module
- Publication number 20240021492
- Publication date Jan 18, 2024
- Siemens Aktiengesellschaft
- Lutz NAMYSLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus with a Porous Body for Receiving a Heat Quantity and Meth...
- Publication number 20240006264
- Publication date Jan 4, 2024
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Thomas LISEC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...
- Publication number 20240006395
- Publication date Jan 4, 2024
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE...
- Publication number 20240006269
- Publication date Jan 4, 2024
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER
- Publication number 20230420335
- Publication date Dec 28, 2023
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLA...
- Publication number 20230420410
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING SYSTEM WITH COOLING FOR CONTROLLING TEMPERATURE OF ELECTR...
- Publication number 20230397325
- Publication date Dec 7, 2023
- Microsoft Technology Licensing, LLC
- Unnikrishnan VADAKKANMARU VEEDU
- H01 - BASIC ELECTRIC ELEMENTS

involving the transfer of heat by flowing fluids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Assembly including plural through wafer vias, method of cooling the...

Heat distribution device with flow channels

Temperature control element utilized in device die packages

Quantum dot devices with overlapping gates

Stack chip air gap heat insulator

Thermal management of three-dimensional integrated circuits

Arrangement for cooling power semiconductor devices of a converter

Motor drive device

Molded semiconductor package with dual integrated heat spreaders

Semiconductor apparatus with heat dissipation conduit in sidewall i...

Acclimated regulating system for electronics packages

Heat sink fastener

Semiconductor device and manufacturing method thereof

Choked flow cooling

Hybrid heat sink for electronics cooling

Electronic package structure with offset stacked chips and top and...

Multilayer wiring substrate

Management of heat on a semiconductor device and methods for produc...

Heat sink with protrusions on multiple sides thereof and apparatus...

Fluid mover enclosure

Adjustable heat exchanger

Semiconductor device

Semiconductor device

Power module package for direct cooling multiple power modules

Bus bar and power electronic device with current shaping terminal c...

Cooling apparatus

Mobile phone and other compute device cooling architecture

Common cooling solution for multiple packages

Alignment mechanism

Cooling heatshield for clamshell BGA rework

Patents Applicationslast 30 patents

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

BUS BAR AND POWER ELECTRONIC DEVICE WITH CURRENT SHAPING TERMINAL C...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR...

SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...

SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...

STACKED SEMICONDUCTOR METHOD AND APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICE

DATA STORAGE STRUCTURE OR DATA INFRASTRUCTURE INCLDUING A PLURALITY...

ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRAT...

ALIGNMENT MECHANISM

THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES

TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES

SEMICONDUCTOR PACKAGE STRUCTURE

THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...

Pin Fin Placement Assembly for Forming Temperature Control Element...

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY, ELECTRONIC ASSEMBLY, A...

Arrangement for Cooling and Motor Module

Apparatus with a Porous Body for Receiving a Heat Quantity and Meth...

PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...

OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE...

CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER

PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLA...

COMPUTING SYSTEM WITH COOLING FOR CONTROLLING TEMPERATURE OF ELECTR...