Iridium [Ir] as principal constituent

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H01L2224/81478

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81478Iridium [Ir] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biocompatible bonding method and electronics package suitable for i...
- Patent number 9,849,297
- Issue date Dec 26, 2017
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biocompatible Bonding Method and Electronics Package Suitable for I...
- Publication number 20170095671
- Publication date Apr 6, 2017
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS