Iridium [Ir] as principal constituent

Industry

CPC
H01L2224/13178

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13178Iridium [Ir] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device, and set of onboard-components, body a...
- Patent number 11,462,668
- Issue date Oct 4, 2022
- TOHOKU-MICROTEC CO., LTD.
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,164,836
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 10,658,318
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 10,622,326
- Issue date Apr 14, 2020
- Industrial Technology Research Institute
- Chen-Tsai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a reinforcing member
- Patent number 10,573,852
- Issue date Feb 25, 2020
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Biocompatible bonding method and electronics package suitable for i...
- Patent number 9,849,297
- Issue date Dec 26, 2017
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor bonding structure
- Patent number 9,196,595
- Issue date Nov 24, 2015
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrode arrays and methods of fabricating the same using printing...
- Patent number 8,546,257
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Tobias Kraus
- G01 - MEASURING TESTING
Information Patent Grant
Process of producing semiconductor chip with surface interconnectio...
- Patent number 7,329,562
- Issue date Feb 12, 2008
- Rohm Co., Ltd.
- Nobuhisa Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and production process therefor
- Patent number 6,707,159
- Issue date Mar 16, 2004
- Rohm Co., Ltd.
- Nobuhisa Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device of chip-on-chip structure
- Patent number 6,657,309
- Issue date Dec 2, 2003
- Rohm Co., Ltd.
- Junichi Hikita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE, AND SET OF ONBOARD-COMPONENTS, BODY A...
- Publication number 20210399184
- Publication date Dec 23, 2021
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME FOR BUMPING
- Publication number 20200243469
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20190057948
- Publication date Feb 21, 2019
- Industrial Technology Research Institute
- Chen-Tsai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biocompatible Bonding Method and Electronics Package Suitable for I...
- Publication number 20170095671
- Publication date Apr 6, 2017
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS
- Publication number 20140239494
- Publication date Aug 28, 2014
- Kuo-Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnections of Semiconductor Devices and Methods fo...
- Publication number 20130313707
- Publication date Nov 28, 2013
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...
- Publication number 20130196504
- Publication date Aug 1, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING...
- Publication number 20120282771
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Tobias Kraus
- G01 - MEASURING TESTING
Information Patent Application
ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING...
- Publication number 20090278213
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Tobias Kraus
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor chip and production process therefor
- Publication number 20080138976
- Publication date Jun 12, 2008
- Rohm Co., Ltd.
- Nobuhisa Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoscale probes for electrophysiological applications
- Publication number 20070187840
- Publication date Aug 16, 2007
- Ludovico M. Dell'Acqua-Bellavitis
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Semiconductor chip and production process therefor
- Publication number 20040183208
- Publication date Sep 23, 2004
- Nobuhisa Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS

Iridium [Ir] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Stacked semiconductor device, and set of onboard-components, body a...

Film scheme for bumping

Film scheme for bumping

Film scheme for bumping

Chip package structure

Display device including a reinforcing member

Transfer substrate for forming metal wiring and method for forming...

Method for producing metal ball, joining material, and metal ball

Biocompatible bonding method and electronics package suitable for i...

Semiconductor bonding structure

Method for bonding wafers and structure of bonding part

Electrode arrays and methods of fabricating the same using printing...

Process of producing semiconductor chip with surface interconnectio...

Semiconductor chip and production process therefor

Semiconductor chip and semiconductor device of chip-on-chip structure

Patents Applicationslast 30 patents

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

STACKED SEMICONDUCTOR DEVICE, AND SET OF ONBOARD-COMPONENTS, BODY A...

FILM SCHEME FOR BUMPING

CHIP PACKAGE STRUCTURE

Biocompatible Bonding Method and Electronics Package Suitable for I...

METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS

Electrical Interconnections of Semiconductor Devices and Methods fo...

TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...

ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING...

ELECTRODE ARRAYS AND METHODS OF FABRICATING THE SAME USING PRINTING...

Semiconductor chip and production process therefor

Nanoscale probes for electrophysiological applications

Semiconductor chip and production process therefor