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H01L2224/40095

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40095Kinked

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,068,741
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,063,030
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plate-shaped conductor
- Patent number 12,002,782
- Issue date Jun 4, 2024
- Kabushiki Kaisha Toshiba
- Shun Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,936,369
- Issue date Mar 19, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,728,801
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared base plate and semiconductor module provided with same
- Patent number 11,626,347
- Issue date Apr 11, 2023
- Mitsubishi Electric Corporation
- Takashi Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,336,275
- Issue date May 17, 2022
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,273
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,201,121
- Issue date Dec 14, 2021
- Fuji Electric Co., Ltd.
- Kohei Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power module
- Patent number 11,195,778
- Issue date Dec 7, 2021
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,916,491
- Issue date Feb 9, 2021
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method with clip arrangement in IC package
- Patent number 10,825,757
- Issue date Nov 3, 2020
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 10,826,481
- Issue date Nov 3, 2020
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 10,770,381
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,770,400
- Issue date Sep 8, 2020
- Kabushiki Kaisha Toyota Jidoshokki
- Naoki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,672,677
- Issue date Jun 2, 2020
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,656
- Issue date Jan 7, 2020
- Mitsubishi Electric Corporation
- Yoshihiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an electronic device
- Patent number 10,453,946
- Issue date Oct 22, 2019
- Renesas Electronics Corporation
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20240275373
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240170441
- Publication date May 23, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
- Publication number 20240120308
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
- Publication number 20240096775
- Publication date Mar 21, 2024
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230411339
- Publication date Dec 21, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230402421
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230307411
- Publication date Sep 28, 2023
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20230268914
- Publication date Aug 24, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20230268915
- Publication date Aug 24, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20230261647
- Publication date Aug 17, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230078823
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Shun TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220344253
- Publication date Oct 27, 2022
- Rohm Co., Ltd.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...
- Publication number 20220302073
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE STIFFNESS MODULES
- Publication number 20220285309
- Publication date Sep 8, 2022
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20220239289
- Publication date Jul 28, 2022
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210265243
- Publication date Aug 26, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi KURAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210175198
- Publication date Jun 10, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20210028779
- Publication date Jan 28, 2021
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
SHARED BASE PLATE AND SEMICONDUCTOR MODULE PROVIDED WITH SAME
- Publication number 20200395271
- Publication date Dec 17, 2020
- Mitsubishi Electric Corporation
- Takashi NAGAO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20200083207
- Publication date Mar 12, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20190173461
- Publication date Jun 6, 2019
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC POWER MODULE
- Publication number 20180358282
- Publication date Dec 13, 2018
- Audi AG
- Andreas APELSMEIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20180342448
- Publication date Nov 29, 2018
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Fabricating Low-Profile Footed Power Package
- Publication number 20180330968
- Publication date Nov 15, 2018
- ADVENTIVE IPBANK
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180261519
- Publication date Sep 13, 2018
- Industrial Technology Research Institute
- Jing-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module with a first substrate, a second substrate and...

Switching device and electronic circuit

Switching device and electronic circuit

Semiconductor module

Semiconductor device

Semiconductor device with plate-shaped conductor

Semiconductor module

Semiconductor module

Switching device and electronic circuit

Semiconductor device

Switching device and electronic circuit

Shared base plate and semiconductor module provided with same

Power module package and method of manufacturing the same

Switching device and electronic circuit

Electronic module

Semiconductor device

Electronic power module

Semiconductor device

Power module package

Semiconductor module

Solid top terminal for discrete power devices

Semiconductor device and method with clip arrangement in IC package

Switching device and electronic circuit

Semiconductor component and method of manufacture

Semiconductor module

Semiconductor package structure

Method for fabricating stack die package

Semiconductor device

Semiconductor device and an electronic device

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SEMICONDUCTOR MODULE

STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SEMICONDUCTOR DEVICE

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR DEVICE

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

VARIABLE STIFFNESS MODULES

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

ELECTRONIC MODULE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SHARED BASE PLATE AND SEMICONDUCTOR MODULE PROVIDED WITH SAME

Method of Manufacturing a Multi-Chip Semiconductor Power Device

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

ELECTRONIC POWER MODULE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Method Of Fabricating Low-Profile Footed Power Package

SEMICONDUCTOR PACKAGE STRUCTURE