Laminating followed by cutting or slicing perpendicular to plane of the laminate Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires

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CPC
H05K2203/0235

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0235Laminating followed by cutting or slicing perpendicular to plane of the laminate Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of cutting electronic component, method of removing componen...
- Patent number 11,166,377
- Issue date Nov 2, 2021
- Kioxia Corporation
- Kazuya Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board interposer
- Patent number 11,006,524
- Issue date May 11, 2021
- Apple Inc.
- Scott A. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring board, method of manufacturing light...
- Patent number 10,797,214
- Issue date Oct 6, 2020
- Nichia Corporation
- Yukitoshi Marutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated interposers and packages with embedded trace interconnects
- Patent number 10,636,780
- Issue date Apr 28, 2020
- Invensas Corporation
- Nader Gamini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated interposers and packages with embedded trace interconnects
- Patent number 10,283,492
- Issue date May 7, 2019
- Invensas Corporation
- Nader Gamini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating flexible substrate and flexible substrate pr...
- Patent number 9,717,143
- Issue date Jul 25, 2017
- BOE Technology Group Co., Ltd.
- Meili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection elements with encased interconnects
- Patent number 8,988,895
- Issue date Mar 24, 2015
- Tessera, Inc.
- Ilyas Mohammed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method and structure for a substrate with vertically...
- Patent number 7,994,429
- Issue date Aug 9, 2011
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric sheet
- Patent number 7,841,862
- Issue date Nov 30, 2010
- J.S.T. Mfg. Co., Ltd.
- Miki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin substrate and package
- Patent number 7,745,244
- Issue date Jun 29, 2010
- Fairchild Semiconductor Corporation
- Zhongfa Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and radiation detector employing it
- Patent number 7,545,044
- Issue date Jun 9, 2009
- Hamamatsu Photonics K.K.
- Katsumi Shibayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method therefor
- Patent number 7,484,293
- Issue date Feb 3, 2009
- International Business Machines Corporation
- Yoshiyuki Yamaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating an RF substrate with selected electrical prop...
- Patent number 7,353,592
- Issue date Apr 8, 2008
- Harris Corporation
- Dennis Tebbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive sheet and manufacture thereof
- Patent number 7,304,390
- Issue date Dec 4, 2007
- J.S.T. Mfg. Co., Ltd.
- Miki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive sheet
- Patent number 7,264,482
- Issue date Sep 4, 2007
- J.S.T. Mfg. Co., Ltd.
- Miki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating an RF substrate with selected electrical prop...
- Patent number 7,181,834
- Issue date Feb 27, 2007
- Harris Corporation
- Dennis Tebbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component having at least one semiconductor chip and fli...
- Patent number 7,176,131
- Issue date Feb 13, 2007
- Infineon Technologies AG
- Georg Meyer-Berg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastomer interposer for grid array packages and method of manufact...
- Patent number 6,841,882
- Issue date Jan 11, 2005
- VIA Technologies, Inc.
- Ray Chien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector for transporting signals between contact pads on two surf...
- Patent number 6,817,869
- Issue date Nov 16, 2004
- Richard S. Norman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a semiconductor device
- Patent number 6,772,511
- Issue date Aug 10, 2004
- Matsushita Electric Industrial Co., Ltd.
- Sachiyuki Nose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating an RF substrate with selected electrical prop...
- Patent number 6,770,159
- Issue date Aug 3, 2004
- Harris Corporation
- Dennis Tebbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for producing the same, and anisotr...
- Patent number 6,707,158
- Issue date Mar 16, 2004
- Matsushita Electric Industrial Co., Ltd.
- Sachiyuki Nose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parallel plane substrate
- Patent number 6,632,734
- Issue date Oct 14, 2003
- Intel Corporation
- Robert L. Sankman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parallel plane substrate
- Patent number 6,563,210
- Issue date May 13, 2003
- Intel Corporation
- Robert L. Sankman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate material for wiring and substrate material for printed ci...
- Patent number 6,403,201
- Issue date Jun 11, 2002
- NGK Insulators, Ltd.
- Tadashi Otagiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board material and method of manufacturing board ma...
- Patent number 6,379,781
- Issue date Apr 30, 2002
- NGK Insulators, Ltd.
- Tomio Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having vias
- Patent number 6,271,483
- Issue date Aug 7, 2001
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered body for manufacturing ceramic substrate
- Patent number 5,997,999
- Issue date Dec 7, 1999
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20240188228
- Publication date Jun 6, 2024
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Roll-to-Roll Copper Foil Laminating Device
- Publication number 20220353998
- Publication date Nov 3, 2022
- XIAMEN UNIVERSITY OF TECHNOLOGY
- An Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20220304166
- Publication date Sep 22, 2022
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTI...
- Publication number 20210283890
- Publication date Sep 16, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CUTTING ELECTRONIC COMPONENT, METHOD OF REMOVING COMPONEN...
- Publication number 20210282267
- Publication date Sep 9, 2021
- KIOXIA Corporation
- Kazuya NAGASAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED INTERPOSERS AND PACKAGES WITH EMBEDDED TRACE INTERCONNECTS
- Publication number 20190088636
- Publication date Mar 21, 2019
- Invensas Corporation
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Processes For Forming Waveguides Using LTCC Substrates
- Publication number 20160087325
- Publication date Mar 24, 2016
- Telekom Malaysia Berhad
- Rosidah Alias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150129293
- Publication date May 14, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINE-PITCH FLEXIBLE WIRING
- Publication number 20130319759
- Publication date Dec 5, 2013
- GENERAL ELECTRIC COMPANY
- James Wilson Rose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION ELEMENTS WITH ENCASED INTERCONNECTS
- Publication number 20130050972
- Publication date Feb 28, 2013
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN SUBSTRATE AND PACKAGE
- Publication number 20090315171
- Publication date Dec 24, 2009
- Zhongfa Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dielectric sheet
- Publication number 20090078449
- Publication date Mar 26, 2009
- Miki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20090047755
- Publication date Feb 19, 2009
- International Business Machines Corporation
- Yoshiyuki Yamaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD AND STRUCTURE FOR A SUBSTRATE WITH VERTICALLY...
- Publication number 20080053690
- Publication date Mar 6, 2008
- Guo-Cheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package and Manufacturing Method Therefor
- Publication number 20070145551
- Publication date Jun 28, 2007
- Yoshiyuki Yamaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Fabricating an RF Substrate with Selected Electrical Prop...
- Publication number 20070117403
- Publication date May 24, 2007
- Harris Corporation
- Dennis Tebbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component Having at Least One Semiconductor Chip and Fli...
- Publication number 20070102826
- Publication date May 10, 2007
- Infineon Technologies AG
- Georg Meyer-Berg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and radiation detector employing it
- Publication number 20070029670
- Publication date Feb 8, 2007
- Katsumi Shibayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic conductive sheet
- Publication number 20050201034
- Publication date Sep 15, 2005
- Miki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic conductive sheet and manufacture thereof
- Publication number 20050194697
- Publication date Sep 8, 2005
- Miki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component having at least one semiconductor chip and fli...
- Publication number 20050110162
- Publication date May 26, 2005
- Georg Meyer-Berg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating an RF substrate with selected electrical prop...
- Publication number 20050087284
- Publication date Apr 28, 2005
- Dennis Tebbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Elastomer interposer for grid array packages and method of manufact...
- Publication number 20030146510
- Publication date Aug 7, 2003
- Ray Chien
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Parallel plane substrate
- Publication number 20030127742
- Publication date Jul 10, 2003
- Robert L. Sankman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for producing the same, and anisotr...
- Publication number 20030110622
- Publication date Jun 19, 2003
- Matsushita Electric Industrial Co., Ltd.
- Sachiyuki Nose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for producing the same, and anisotr...
- Publication number 20020132450
- Publication date Sep 19, 2002
- Matsushita Electric Industrial Co., Ltd.
- Sachiyuki Nose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Parallel plane substrate
- Publication number 20020074644
- Publication date Jun 20, 2002
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS

Laminating followed by cutting or slicing perpendicular to plane of the laminate Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin multilayer substrate and method for manufacturing resin multi...

Method for manufacturing printed wiring board

Method of cutting electronic component, method of removing componen...

Circuit board interposer

Method of manufacturing wiring board, method of manufacturing light...

Laminated interposers and packages with embedded trace interconnects

Laminated interposers and packages with embedded trace interconnects

Method for fabricating flexible substrate and flexible substrate pr...

Interconnection elements with encased interconnects

Manufacturing method and structure for a substrate with vertically...

Dielectric sheet

Pin substrate and package

Semiconductor device and radiation detector employing it

Semiconductor package and manufacturing method therefor

Method of fabricating an RF substrate with selected electrical prop...

Anisotropic conductive sheet and manufacture thereof

Anisotropic conductive sheet

Method of fabricating an RF substrate with selected electrical prop...

Electronic component having at least one semiconductor chip and fli...

Elastomer interposer for grid array packages and method of manufact...

Connector for transporting signals between contact pads on two surf...

Method for producing a semiconductor device

Method of fabricating an RF substrate with selected electrical prop...

Semiconductor device and method for producing the same, and anisotr...

Parallel plane substrate

Parallel plane substrate

Substrate material for wiring and substrate material for printed ci...

Printed circuit board material and method of manufacturing board ma...

Wiring board having vias

Sintered body for manufacturing ceramic substrate

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

Roll-to-Roll Copper Foil Laminating Device

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTI...

METHOD OF CUTTING ELECTRONIC COMPONENT, METHOD OF REMOVING COMPONEN...

LAMINATED INTERPOSERS AND PACKAGES WITH EMBEDDED TRACE INTERCONNECTS

Processes For Forming Waveguides Using LTCC Substrates

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

FINE-PITCH FLEXIBLE WIRING

INTERCONNECTION ELEMENTS WITH ENCASED INTERCONNECTS

PIN SUBSTRATE AND PACKAGE

Dielectric sheet

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

MANUFACTURING METHOD AND STRUCTURE FOR A SUBSTRATE WITH VERTICALLY...

Semiconductor Package and Manufacturing Method Therefor

Method of Fabricating an RF Substrate with Selected Electrical Prop...

Electronic Component Having at Least One Semiconductor Chip and Fli...

Semiconductor device and radiation detector employing it

Anisotropic conductive sheet

Anisotropic conductive sheet and manufacture thereof

Electronic component having at least one semiconductor chip and fli...

Method of fabricating an RF substrate with selected electrical prop...

Elastomer interposer for grid array packages and method of manufact...

Parallel plane substrate

Semiconductor device and method for producing the same, and anisotr...

Semiconductor device and method for producing the same, and anisotr...

Parallel plane substrate