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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11436Lamination of a preform

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Patents Grantslast 30 patents

Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 10,658,267
- Issue date May 19, 2020
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,403,592
- Issue date Sep 3, 2019
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 10,217,698
- Issue date Feb 26, 2019
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and semiconductor package structure having...
- Patent number 9,978,705
- Issue date May 22, 2018
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 9,972,556
- Issue date May 15, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow film, solder bump formation method, solder joint formation m...
- Patent number 9,656,353
- Issue date May 23, 2017
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 9,559,077
- Issue date Jan 31, 2017
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package device having high-standoff peripheral solder b...
- Patent number 9,219,043
- Issue date Dec 22, 2015
- Maxim Integrated Products, Inc.
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method of manufacturing semiconductor appa...
- Patent number 9,105,625
- Issue date Aug 11, 2015
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 9,082,754
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structures and method for fabricating the same
- Patent number 8,877,323
- Issue date Nov 4, 2014
- Himax Technologies Limited
- Tsung-Chieh Chang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Projection-electrode fabrication method
- Patent number 5,607,877
- Issue date Mar 4, 1997
- Fujitsu Limited
- Tatsuharu Matsuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014197
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20190348387
- Publication date Nov 14, 2019
- UTAC Headquarters Pte. Ltd.
- Yongbo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20180174949
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FO...
- Publication number 20160351522
- Publication date Dec 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE DEVICE HAVING HIGH-STANDOFF PERIPHERAL SOLDER B...
- Publication number 20140264845
- Publication date Sep 18, 2014
- Amit S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...
- Publication number 20140252607
- Publication date Sep 11, 2014
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS
- Publication number 20140205851
- Publication date Jul 24, 2014
- Ravindranath V. MAHAJAN
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20140035150
- Publication date Feb 6, 2014
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPA...
- Publication number 20130043585
- Publication date Feb 21, 2013
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...
- Publication number 20120319268
- Publication date Dec 20, 2012
- Tomohiro Kagimoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Structures and Method for Fabricating the Same
- Publication number 20120135201
- Publication date May 31, 2012
- HIMAX TECHNOLOGIES LIMITED
- Tsung-Chieh Chang
- B32 - LAYERED PRODUCTS
Information Patent Application
Nanoscale probes for electrophysiological applications
- Publication number 20070187840
- Publication date Aug 16, 2007
- Ludovico M. Dell'Acqua-Bellavitis
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Lamination of a preform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump-forming film, semiconductor device and manufacturing method th...

Metal cored solder decal structure and process

Semiconductor packages and methods of packaging semiconductor devices

Die attachment for packaged semiconductor device

Electronic device and method for producing an electronic device

Semiconductor substrate and semiconductor package structure having...

Metal cored solder decal structure and process

Reflow film, solder bump formation method, solder joint formation m...

Die attachment for packaged semiconductor device

Wafer-level package device having high-standoff peripheral solder b...

Semiconductor apparatus, method of manufacturing semiconductor appa...

Metal cored solder decal structure and process

Semiconductor structures and method for fabricating the same

Projection-electrode fabrication method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FO...

WAFER-LEVEL PACKAGE DEVICE HAVING HIGH-STANDOFF PERIPHERAL SOLDER B...

REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...

MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPA...

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...

Semiconductor Structures and Method for Fabricating the Same

Nanoscale probes for electrophysiological applications