Land grid array [LGA]

Industry

CPC
H05K2201/10719

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10719Land grid array [LGA]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Opto-mechanical structure design of thin LGA package with glass cover
- Patent number 12,117,337
- Issue date Oct 15, 2024
- PixArt Imaging Inc.
- Sai Mun Lee
- G01 - MEASURING TESTING
Information Patent Grant
Electronic assembly including cable modules
- Patent number 12,089,357
- Issue date Sep 10, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package body, electronic component assembly st...
- Patent number 12,089,336
- Issue date Sep 10, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising antenna and RF element, and base station includin...
- Patent number 12,062,853
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pluggable CPU modules with vertical power
- Patent number 12,002,795
- Issue date Jun 4, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 12,002,793
- Issue date Jun 4, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical power delivery packaging structure
- Patent number 11,799,374
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Xin Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Opto-mechanical structure design of thin LGA package with glass cov...
- Patent number 11,754,440
- Issue date Sep 12, 2023
- PixArt Imaging Inc.
- Sai Mun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,737,227
- Issue date Aug 22, 2023
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising antenna and RF element, and base station includin...
- Patent number 11,682,845
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance laser driver packaging using lead-frame and thin die...
- Patent number 11,611,193
- Issue date Mar 21, 2023
- Excelitas Canada, Inc.
- Gabriel Charlebois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced capacitance land pad
- Patent number 11,516,915
- Issue date Nov 29, 2022
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly including cable modules
- Patent number 11,477,904
- Issue date Oct 18, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component, and contacting assembly having a semicondu...
- Patent number 11,310,913
- Issue date Apr 19, 2022
- Robert Bosch GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable circuit board module system
- Patent number 11,297,715
- Issue date Apr 5, 2022
- PHYTEC Messtechnik GmbH
- Bodo Huber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server microprocessor carrier with guiding alignment anti-tilt and...
- Patent number 11,291,115
- Issue date Mar 29, 2022
- Intel Corporation
- Shelby A. Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,291,133
- Issue date Mar 29, 2022
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 11,278,977
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount passive component shorted together
- Patent number 11,202,375
- Issue date Dec 14, 2021
- QUALCOMM Incorporated
- Yu-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure with controlled capillary coverage
- Patent number 11,152,226
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery module for an electronic package
- Patent number 11,129,290
- Issue date Sep 21, 2021
- TE CONNECTIVITY SERVICES GMBH
- Brian Patrick Costello
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 11,114,421
- Issue date Sep 7, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising antenna and RF element, and base station includin...
- Patent number 11,063,370
- Issue date Jul 13, 2021
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising antenna and RF element, and base station includin...
- Patent number 11,063,371
- Issue date Jul 13, 2021
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional stiffener that enables land grid array interconnections...
- Patent number 11,062,976
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising antenna and RF element, and base station includin...
- Patent number 11,050,165
- Issue date Jun 29, 2021
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System-in-Package device ball map and layout optimization
- Patent number 11,032,910
- Issue date Jun 8, 2021
- OCTAVO SYSTEMS LLC
- Erik James Welsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated socket body and terminals for a land grid array socket as...
- Patent number 10,980,135
- Issue date Apr 13, 2021
- John O. Tate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical-side solder method and package for power GaN devices
- Patent number 10,939,553
- Issue date Mar 2, 2021
- Zhanming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable socket connector assembly for an electronic
- Patent number 10,910,748
- Issue date Feb 2, 2021
- TE Connectivity Corporation
- Jeffery Walter Mason
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS
- Publication number 20240381534
- Publication date Nov 14, 2024
- Endress+Hauser SE+Co. KG
- Romuald Girardey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pluggable CPU Modules with Vertical Power
- Publication number 20240290763
- Publication date Aug 29, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...
- Publication number 20240266301
- Publication date Aug 8, 2024
- Juniper Networks, Inc.
- Gautam GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTO-MECHANICAL STRUCTURE DESIGN OF THIN LGA PACKAGE WITH GLASS COVER
- Publication number 20230366730
- Publication date Nov 16, 2023
- PixArt Imaging Inc.
- Sai Mun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pluggable CPU Modules With Vertical Power
- Publication number 20230335541
- Publication date Oct 19, 2023
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY COMPONENT, ELECTRIC CIRCUIT ARRANGEMENT AND RADAR SY...
- Publication number 20230328875
- Publication date Oct 12, 2023
- ROBERT BOSCH GmbH
- Kevin Stella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20230300985
- Publication date Sep 21, 2023
- Huawei Technologies Co., Ltd
- Jie SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTO-MECHANICAL STRUCTURE DESIGN OF THIN LGA PACKAGE WITH GLASS COV...
- Publication number 20230221174
- Publication date Jul 13, 2023
- PixArt Imaging Inc.
- Sai Mun LEE
- G01 - MEASURING TESTING
Information Patent Application
VERTICAL POWER DELIVERY PACKAGING STRUCTURE
- Publication number 20230078561
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Xin Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LGA SOCKET PINS FOR IMPROVED DIFFERENTIAL SIGNALING PERFORMANCE
- Publication number 20230046581
- Publication date Feb 16, 2023
- Xiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES
- Publication number 20230025397
- Publication date Jan 26, 2023
- TE Connectivity Solutions GMBH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX-PCB INTEGRATED PACKAGING FOR SILICON PHOTONICS LIDAR
- Publication number 20220400548
- Publication date Dec 15, 2022
- Intel Corporation
- Sanjeev Gupta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...
- Publication number 20220183177
- Publication date Jun 9, 2022
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEPPED PACKAGE AND RECESSED CIRCUIT BOARD
- Publication number 20220110214
- Publication date Apr 7, 2022
- Intel Corporation
- Martin M. Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20210366883
- Publication date Nov 25, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...
- Publication number 20210344120
- Publication date Nov 4, 2021
- Samsung Electronics Co., Ltd.
- Kwanghyun BAEK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERABLE CIRCUIT BOARD MODULE SYSTEM
- Publication number 20210307169
- Publication date Sep 30, 2021
- PHYTEC Messtechnik GmbH
- Bodo HUBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES
- Publication number 20210274673
- Publication date Sep 2, 2021
- TE CONNECTIVITY CORPORATION
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20210114126
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE
- Publication number 20210111039
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Kevin Drummond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED SOCKET BODY AND TERMINALS FOR A LAND GRID ARRAY SOCKET AS...
- Publication number 20200375037
- Publication date Nov 26, 2020
- John O. Tate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY MODULE FOR AN ELECTRONIC PACKAGE
- Publication number 20200375053
- Publication date Nov 26, 2020
- TE Connectivity Corporation
- Brian Patrick Costello
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SURFACE MOUNT PASSIVE COMPONENT SHORTED TOGETHER
- Publication number 20200344894
- Publication date Oct 29, 2020
- QUALCOMM Incorporated
- Yu-Chun LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...
- Publication number 20200321711
- Publication date Oct 8, 2020
- Samsung Electronics Co., Ltd.
- Kwanghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT, AND CONTACTING ASSEMBLY HAVING A SEMICONDU...
- Publication number 20200196449
- Publication date Jun 18, 2020
- ROBERT BOSCH GmbH
- Guenter Gera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
- Publication number 20200163213
- Publication date May 21, 2020
- Canon Kabushiki Kaisha
- Koji Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Inductance Laser Driver Packaging Using Lead-Frame and Thin Die...
- Publication number 20200136347
- Publication date Apr 30, 2020
- Excelitas Canada, Inc.
- Gabriel Charlebois
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20190378828
- Publication date Dec 12, 2019
- Intel Corporation
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...
- Publication number 20190307009
- Publication date Oct 3, 2019
- Zhichao ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...
- Publication number 20190306985
- Publication date Oct 3, 2019
- Shelby A. Ferguson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Land grid array [LGA]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Opto-mechanical structure design of thin LGA package with glass cover

Electronic assembly including cable modules

Electronic component package body, electronic component assembly st...

Module comprising antenna and RF element, and base station includin...

Pluggable CPU modules with vertical power

Integrating system in package (SiP) with input/output (IO) board fo...

Vertical power delivery packaging structure

Opto-mechanical structure design of thin LGA package with glass cov...

Selective ground flood around reduced land pad on package base laye...

Module comprising antenna and RF element, and base station includin...

Low inductance laser driver packaging using lead-frame and thin die...

Reduced capacitance land pad

Electronic assembly including cable modules

Semiconductor component, and contacting assembly having a semicondu...

Solderable circuit board module system

Server microprocessor carrier with guiding alignment anti-tilt and...

Selective ground flood around reduced land pad on package base laye...

Liquid metal infiltration rework of electronic assembly

Surface mount passive component shorted together

Structure with controlled capillary coverage

Power delivery module for an electronic package

Integrating system in package (SiP) with input/output (IO) board fo...

Module comprising antenna and RF element, and base station includin...

Module comprising antenna and RF element, and base station includin...

Functional stiffener that enables land grid array interconnections...

Module comprising antenna and RF element, and base station includin...

System-in-Package device ball map and layout optimization

Insulated socket body and terminals for a land grid array socket as...

Vertical-side solder method and package for power GaN devices

Cable socket connector assembly for an electronic

Patents Applicationslast 30 patents

ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS

Pluggable CPU Modules with Vertical Power

CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...

OPTO-MECHANICAL STRUCTURE DESIGN OF THIN LGA PACKAGE WITH GLASS COVER

Pluggable CPU Modules With Vertical Power

HIGH-FREQUENCY COMPONENT, ELECTRIC CIRCUIT ARRANGEMENT AND RADAR SY...

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

OPTO-MECHANICAL STRUCTURE DESIGN OF THIN LGA PACKAGE WITH GLASS COV...

VERTICAL POWER DELIVERY PACKAGING STRUCTURE

LGA SOCKET PINS FOR IMPROVED DIFFERENTIAL SIGNALING PERFORMANCE

ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES

FLEX-PCB INTEGRATED PACKAGING FOR SILICON PHOTONICS LIDAR

SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...

STEPPED PACKAGE AND RECESSED CIRCUIT BOARD

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...

SOLDERABLE CIRCUIT BOARD MODULE SYSTEM

ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

STRUCTURE WITH CONTROLLED CAPILLARY COVERAGE

INSULATED SOCKET BODY AND TERMINALS FOR A LAND GRID ARRAY SOCKET AS...

POWER DELIVERY MODULE FOR AN ELECTRONIC PACKAGE

SURFACE MOUNT PASSIVE COMPONENT SHORTED TOGETHER

MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDIN...

SEMICONDUCTOR COMPONENT, AND CONTACTING ASSEMBLY HAVING A SEMICONDU...

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

Low Inductance Laser Driver Packaging Using Lead-Frame and Thin Die...

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

SELECTIVE GROUND FLOOD AROUND REDUCED LAND PAD ON PACKAGE BASE LAYE...

SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...