Lands, clearance holes or other lay-out details concerning the surrounding of a via

Industry

CPC
H05K1/116

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,356,547
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package component
- Patent number 12,349,268
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and electronic-component mount multilayer...
- Patent number 12,274,002
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Atsushi Kishimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,262,465
- Issue date Mar 25, 2025
- LG Innotek Co., Ltd
- Won Suk Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modified internal clearance(s) at connector pin aperture(s) of a ci...
- Patent number 12,256,494
- Issue date Mar 18, 2025
- International Business Machines Corporation
- James D. Bielick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including interposer
- Patent number 12,256,496
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Jungsik Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising interposer
- Patent number 12,245,374
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,245,375
- Issue date Mar 4, 2025
- LG Innotek Co., Ltd
- Won Suk Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,232,257
- Issue date Feb 18, 2025
- Ibiden Co., Ltd.
- Shunsuke Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,232,261
- Issue date Feb 18, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kou Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having multilayered substrate and manufacturing m...
- Patent number 12,232,260
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Seungjin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof, and terminal device
- Patent number 12,219,695
- Issue date Feb 4, 2025
- HONOR DEVICE CO., LTD.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel molded electronic assemblies with integral terminals
- Patent number 12,200,862
- Issue date Jan 14, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency filter
- Patent number 12,160,217
- Issue date Dec 3, 2024
- Mitsubishi Electric Corporation
- Motomi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate, electronic device, and elect...
- Patent number 12,144,114
- Issue date Nov 12, 2024
- Kyocera Corporation
- Kanae Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cable assembly, signal transmission structure, and electronic device
- Patent number 12,114,425
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Guodong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Buried lines and related fabrication techniques
- Patent number 12,087,758
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Hernan A. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting flex circuit boards having metal structures for imp...
- Patent number 12,082,335
- Issue date Sep 3, 2024
- Google LLC
- John Martinis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wideband millimeter wave via transition
- Patent number 12,069,805
- Issue date Aug 20, 2024
- Apple Inc.
- Chi V. Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly
- Patent number 12,068,552
- Issue date Aug 20, 2024
- Hitachi Astemo, Ltd.
- Shinya Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,063,737
- Issue date Aug 13, 2024
- LG Innotek Co., Ltd
- Hae Sik Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stacked-layer board, electronic component module, and method of man...
- Patent number 12,052,821
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,010,796
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,004,287
- Issue date Jun 4, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Pinghua Duan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250212323
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20250212331
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Jungsik PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250203776
- Publication date Jun 19, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC EQUIPMENT AND V...
- Publication number 20250194012
- Publication date Jun 12, 2025
- Canon Kabushiki Kaisha
- SHOJI MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE AND ELECTRONIC APPARATUS INCLUDING SAME
- Publication number 20250193506
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Cheol HWANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD
- Publication number 20250193994
- Publication date Jun 12, 2025
- LG Innotek Co., Ltd.
- Won Suk JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194017
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Soo Bin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250176107
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Chunghee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC BOARD HAVING SELECTABLE SECONDARY CONDUCTIVE TRACES
- Publication number 20250151196
- Publication date May 8, 2025
- Hewlett-Packard Development Company, L.P.
- Marcus Joseph Benzel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stamping Surface Profile in Design Layer and Filling an Indentation...
- Publication number 20250142736
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132271
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Kyojin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250126709
- Publication date Apr 17, 2025
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...
- Publication number 20250112144
- Publication date Apr 3, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...
- Publication number 20250113434
- Publication date Apr 3, 2025
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
- Publication number 20250106998
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- TAKASHI NUMAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOTWIN LINER FOR THROUGH GLASS VIAS
- Publication number 20250106982
- Publication date Mar 27, 2025
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Publication number 20250105132
- Publication date Mar 27, 2025
- Intel Corporation
- Pratyush MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Publication number 20250106997
- Publication date Mar 27, 2025
- Intel Corporation
- Ehsan ZAMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20250098070
- Publication date Mar 20, 2025
- Huawei Technologies Co., Ltd
- Tong ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, AND DISP...
- Publication number 20250098064
- Publication date Mar 20, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Nianqi YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING INTERCONNECT SUBSTRATE
- Publication number 20250089168
- Publication date Mar 13, 2025
- Shinko Electric Industries Co., Ltd.
- Kensuke UCHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW STRESS THROUGH GLASS VIAS (TGVS)
- Publication number 20250089156
- Publication date Mar 13, 2025
- Intel Corporation
- Mohamed R. SABER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED LINES AND RELATED FABRICATION TECHNIQUES
- Publication number 20250072118
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Hernan Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250071887
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND COIL DEVICE
- Publication number 20250071899
- Publication date Feb 27, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Masaki MIYABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20250056723
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Dohyeong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20250056712
- Publication date Feb 13, 2025
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250048534
- Publication date Feb 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250048552
- Publication date Feb 6, 2025
- Canon Kabushiki Kaisha
- SHUICHI NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CARRIER
- Publication number 20250040026
- Publication date Jan 30, 2025
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS

Lands, clearance holes or other lay-out details concerning the surrounding of a via

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Package component

Multilayer circuit board and electronic-component mount multilayer...

Circuit board

Modified internal clearance(s) at connector pin aperture(s) of a ci...

Electronic device including interposer

Wiring board

Electronic device comprising interposer

Circuit board

Wiring substrate

Printed wiring board

Electronic device having multilayered substrate and manufacturing m...

Circuit board and manufacturing method thereof, and terminal device

Beveled overburden for vias and method of making the same

Panel molded electronic assemblies with integral terminals

Capacitive compensation for vertical interconnect accesses

Circuit board and manufacturing method thereof and electronic device

High frequency filter

Package carrier with improved heat dissipation efficiency and manuf...

Electronic element mounting substrate, electronic device, and elect...

Cable assembly, signal transmission structure, and electronic device

Manufacturing method for double-sided wiring circuit board and doub...

Buried lines and related fabrication techniques

Superconducting flex circuit boards having metal structures for imp...

Wideband millimeter wave via transition

Circuit board assembly

Circuit board

Stacked-layer board, electronic component module, and method of man...

Wiring substrate and method for manufacturing wiring substrate

Printed circuit board

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ELECTRONIC DEVICE INCLUDING INTERPOSER

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC EQUIPMENT AND V...

CAMERA MODULE AND ELECTRONIC APPARATUS INCLUDING SAME

CIRCUIT BOARD

PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE

LOGIC BOARD HAVING SELECTABLE SECONDARY CONDUCTIVE TRACES

Stamping Surface Profile in Design Layer and Filling an Indentation...

SEMICONDUCTOR PACKAGE

PRINTED WIRING BOARD

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...

THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...

NANOTWIN LINER FOR THROUGH GLASS VIAS

POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

CIRCUIT BOARD, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, AND DISP...

INTERCONNECT SUBSTRATE AND METHOD OF MAKING INTERCONNECT SUBSTRATE

LOW STRESS THROUGH GLASS VIAS (TGVS)

BURIED LINES AND RELATED FABRICATION TECHNIQUES

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD AND COIL DEVICE

ELECTRONIC DEVICE INCLUDING INTERPOSER

MANUFACTURING METHOD OF CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

MANUFACTURING METHOD OF PACKAGE CARRIER