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CPC
H05K1/116

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via

Industries

Patents Grantslast 30 patents

Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency filter
- Patent number 12,160,217
- Issue date Dec 3, 2024
- Mitsubishi Electric Corporation
- Motomi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate, electronic device, and elect...
- Patent number 12,144,114
- Issue date Nov 12, 2024
- Kyocera Corporation
- Kanae Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cable assembly, signal transmission structure, and electronic device
- Patent number 12,114,425
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Guodong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Buried lines and related fabrication techniques
- Patent number 12,087,758
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Hernan A. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting flex circuit boards having metal structures for imp...
- Patent number 12,082,335
- Issue date Sep 3, 2024
- Google LLC
- John Martinis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wideband millimeter wave via transition
- Patent number 12,069,805
- Issue date Aug 20, 2024
- Apple Inc.
- Chi V. Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly
- Patent number 12,068,552
- Issue date Aug 20, 2024
- Hitachi Astemo, Ltd.
- Shinya Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,063,737
- Issue date Aug 13, 2024
- LG Innotek Co., Ltd
- Hae Sik Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stacked-layer board, electronic component module, and method of man...
- Patent number 12,052,821
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,010,796
- Issue date Jun 11, 2024
- Ibiden Co., Ltd.
- Yoshinori Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,004,287
- Issue date Jun 4, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Pinghua Duan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards and memory modules
- Patent number 11,974,391
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Dongyoon Seo
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board, inverter, motor vehicle and method for produ...
- Patent number 11,956,895
- Issue date Apr 9, 2024
- ZF Friedrichshafen AG
- Michael Sperber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing same
- Patent number 11,950,365
- Issue date Apr 2, 2024
- Sumitomo Electric Industries, Ltd.
- Shoichiro Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wideband routing techniques for PCB layout
- Patent number 11,937,373
- Issue date Mar 19, 2024
- Hewlett Packard Enterprise Development LP
- Melvin K. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB) including heatsinks
- Patent number 11,924,962
- Issue date Mar 5, 2024
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for galvanic effect reduction
- Patent number 11,924,964
- Issue date Mar 5, 2024
- Western Digital Technologies, Inc.
- Lin Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and manufacturing method thereof, electronic de...
- Patent number 11,917,758
- Issue date Feb 27, 2024
- PANELSEMI CORPORATION
- Ya-Che Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 11,895,773
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for high-speed signal layer transition
- Patent number 11,889,617
- Issue date Jan 30, 2024
- BAIDU USA LLC
- Zhenwei Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Balun comprising stepped transitions between balance and unbalance...
- Patent number 11,876,278
- Issue date Jan 16, 2024
- Raytheon Company
- Angelo M. Puzella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and manufacturing method for same
- Patent number 11,871,525
- Issue date Jan 9, 2024
- Kyocera Corporation
- Yoshihiro Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR THE ACYLATION OF MAYTANSINOL
- Publication number 20250007192
- Publication date Jan 2, 2025
- ImmunoGen, Inc.
- Wayne C. Widdison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250008659
- Publication date Jan 2, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422901
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION
- Publication number 20240357735
- Publication date Oct 24, 2024
- LG ENERGY SOLUTION, LTD.
- Young Joong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...
- Publication number 20240341026
- Publication date Oct 10, 2024
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE
- Publication number 20240329090
- Publication date Oct 3, 2024
- SCHNEIDER ELECTRIC USA, INC.
- Adrian Abdala Rendon Hernandez
- G01 - MEASURING TESTING
Information Patent Application
STORAGE
- Publication number 20240324116
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Hayato YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR THE ACYLATION OF MAYTANSINOL
- Publication number 20240313444
- Publication date Sep 19, 2024
- ImmunoGen, Inc.
- Wayne C. Widdison
- C07 - ORGANIC CHEMISTRY
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306299
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240306312
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240292537
- Publication date Aug 29, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240292536
- Publication date Aug 29, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE FOR MULTILAYER...
- Publication number 20240266109
- Publication date Aug 8, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240268017
- Publication date Aug 8, 2024
- DONGWOO FINE-CHEM CO., LTD.
- KI HUN SUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO LIGHT-EMITTING PACKAGE
- Publication number 20240268019
- Publication date Aug 8, 2024
- Lextar Electronics Corporation
- Hsin-Lun SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...
- Publication number 20240237210
- Publication date Jul 11, 2024
- International Business Machines Corporation
- James D. BIELICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Manufacturing Method Thereof, and Terminal Device
- Publication number 20240237194
- Publication date Jul 11, 2024
- Honor Device Co., Ltd.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240234326
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240196517
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Youngsun JO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240196528
- Publication date Jun 13, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sangik CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...
- Publication number 20240188217
- Publication date Jun 6, 2024
- TTM TECHNOLOGIES INC.
- Matthew Douglas Neely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240188216
- Publication date Jun 6, 2024
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240179839
- Publication date May 30, 2024
- Shinko Electric Industries Co., Ltd.
- Toshiki SHIROTORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240155771
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILLING CRACKS ON A SUBSTRATE VIA
- Publication number 20240155767
- Publication date May 9, 2024
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20240147621
- Publication date May 2, 2024
- Hitachi Astemo, Ltd.
- Narutoshi YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR THE ACYLATION OF MAYTANSINOL
- Publication number 20240145953
- Publication date May 2, 2024
- ImmunoGen, Inc.
- Wayne C. Widdison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240136294
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H01 - BASIC ELECTRIC ELEMENTS

Lands, clearance holes or other lay-out details concerning the surrounding of a via

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capacitive compensation for vertical interconnect accesses

Circuit board and manufacturing method thereof and electronic device

High frequency filter

Package carrier with improved heat dissipation efficiency and manuf...

Electronic element mounting substrate, electronic device, and elect...

Cable assembly, signal transmission structure, and electronic device

Manufacturing method for double-sided wiring circuit board and doub...

Buried lines and related fabrication techniques

Superconducting flex circuit boards having metal structures for imp...

Wideband millimeter wave via transition

Circuit board assembly

Circuit board

Stacked-layer board, electronic component module, and method of man...

Wiring substrate and method for manufacturing wiring substrate

Printed circuit board

Redistribution plate

Laminated circuit board

Component-embedded substrate

Printed circuit boards and memory modules

Printed circuit board, inverter, motor vehicle and method for produ...

Flexible printed circuit board and method of manufacturing same

Wideband routing techniques for PCB layout

Package component and forming method thereof

Printed circuit board (PCB) including heatsinks

Printed circuit board for galvanic effect reduction

Substrate structure and manufacturing method thereof, electronic de...

Circuit board structure

Techniques for high-speed signal layer transition

Balun comprising stepped transitions between balance and unbalance...

Wiring board and manufacturing method for same

Patents Applicationslast 30 patents

METHODS FOR THE ACYLATION OF MAYTANSINOL

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION

WIRING SUBSTRATE

SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...

REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE

STORAGE

METHODS FOR THE ACYLATION OF MAYTANSINOL

WIRING SUBSTRATE

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE FOR MULTILAYER...

CIRCUIT BOARD

MICRO LIGHT-EMITTING PACKAGE

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...

Circuit Board and Manufacturing Method Thereof, and Terminal Device

WIRING SUBSTRATE

PACKAGE COMPONENT

INTERPOSER AND ELECTRONIC DEVICE COMPRISING SAME

PRINTED CIRCUIT BOARD

SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVIN...

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

WIRING SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

FILLING CRACKS ON A SUBSTRATE VIA

METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE

METHODS FOR THE ACYLATION OF MAYTANSINOL

WIRING SUBSTRATE