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CPC
H05K1/116

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via

Industries

Patents Grantslast 30 patents

Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards and memory modules
- Patent number 11,974,391
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Dongyoon Seo
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board, inverter, motor vehicle and method for produ...
- Patent number 11,956,895
- Issue date Apr 9, 2024
- ZF Friedrichshafen AG
- Michael Sperber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing same
- Patent number 11,950,365
- Issue date Apr 2, 2024
- Sumitomo Electric Industries, Ltd.
- Shoichiro Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wideband routing techniques for PCB layout
- Patent number 11,937,373
- Issue date Mar 19, 2024
- Hewlett Packard Enterprise Development LP
- Melvin K. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB) including heatsinks
- Patent number 11,924,962
- Issue date Mar 5, 2024
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for galvanic effect reduction
- Patent number 11,924,964
- Issue date Mar 5, 2024
- Western Digital Technologies, Inc.
- Lin Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and manufacturing method thereof, electronic de...
- Patent number 11,917,758
- Issue date Feb 27, 2024
- PANELSEMI CORPORATION
- Ya-Che Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 11,895,773
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for high-speed signal layer transition
- Patent number 11,889,617
- Issue date Jan 30, 2024
- BAIDU USA LLC
- Zhenwei Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Balun comprising stepped transitions between balance and unbalance...
- Patent number 11,876,278
- Issue date Jan 16, 2024
- Raytheon Company
- Angelo M. Puzella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and manufacturing method for same
- Patent number 11,871,525
- Issue date Jan 9, 2024
- Kyocera Corporation
- Yoshihiro Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,871,515
- Issue date Jan 9, 2024
- Ibiden Co., Ltd.
- Yasuki Kimishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging structure with embedded electronic components and method...
- Patent number 11,864,329
- Issue date Jan 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,832,397
- Issue date Nov 28, 2023
- Ibiden Co., Ltd.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including interposer
- Patent number 11,818,843
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Jungsik Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board
- Patent number 11,792,916
- Issue date Oct 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Han Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,792,929
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole via and circuit board
- Patent number 11,778,742
- Issue date Oct 3, 2023
- NEC Corporation
- Takuya Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems including an integrated power module with vias and methods...
- Patent number 11,778,793
- Issue date Oct 3, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hitoshi Fujioka
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board
- Patent number 11,765,820
- Issue date Sep 19, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Heun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass core, multilayer circuit board, and method of manufacturing g...
- Patent number 11,756,846
- Issue date Sep 12, 2023
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board connector footprint
- Patent number 11,729,898
- Issue date Aug 15, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Justin Dennis Pickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 11,706,878
- Issue date Jul 18, 2023
- INNOGRIT TECHNOLOGIES CO., LTD.
- Yanwen Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,700,690
- Issue date Jul 11, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intermediate substrate and fabrication method thereof
- Patent number 11,658,104
- Issue date May 23, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspension assembly and disk device
- Patent number 11,657,840
- Issue date May 23, 2023
- Kabushiki Kaisha Toshiba
- Kenichiro Aoki
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240155771
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILLING CRACKS ON A SUBSTRATE VIA
- Publication number 20240155767
- Publication date May 9, 2024
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20240147621
- Publication date May 2, 2024
- Hitachi Astemo, Ltd.
- Narutoshi YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR THE ACYLATION OF MAYTANSINOL
- Publication number 20240145953
- Publication date May 2, 2024
- ImmunoGen, Inc.
- Wayne C. Widdison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240136294
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...
- Publication number 20240138064
- Publication date Apr 25, 2024
- International Business Machines Corporation
- James D. BIELICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Manufacturing Method Thereof, and Terminal Device
- Publication number 20240138056
- Publication date Apr 25, 2024
- Honor Device Co., Ltd.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107685
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20240074059
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jungsik PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240074057
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND PRINTED WIRING BOARD MANUFACTURING SUBSTRATE
- Publication number 20240074056
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Shinri SAEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240057253
- Publication date Feb 15, 2024
- LG Innotek Co., Ltd.
- Sang Myung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE NEUROSTIMULATOR WITH RIVET CONNECTION
- Publication number 20240039190
- Publication date Feb 1, 2024
- AVATION MEDICAL, INC.
- Austin Morgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING SUBSTRATE, MANUFACTURING METHOD FOR THE SAME, AND...
- Publication number 20240021508
- Publication date Jan 18, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240023251
- Publication date Jan 18, 2024
- Unimicron Technology Corp.
- Shao-Chien LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20230422412
- Publication date Dec 28, 2023
- TOPPAN INC.
- Akihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387026
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- SEONGHO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
- Publication number 20230380062
- Publication date Nov 23, 2023
- Corning Incorporated
- DHANANJAY JOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMPLE LITZ PLANAR ARCHITECTURE WITH MINIMAL VIAS TO REDUCE AC RESI...
- Publication number 20230352235
- Publication date Nov 2, 2023
- Centre for Development of Advanced Computing (C-DAC)
- SUBHASH JOSHI THARAYPARAMBIL GEORGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20230345622
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE WITH EMBEDDED POWER CHIP AND CIRCUIT BOARD MODU...
- Publication number 20230343694
- Publication date Oct 26, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...
- Publication number 20230345643
- Publication date Oct 26, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20230337361
- Publication date Oct 19, 2023
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR GALVANIC EFFECT REDUCTION
- Publication number 20230328873
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Lin Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230319992
- Publication date Oct 5, 2023
- Shinko Electric Industries Co., Ltd.
- Koichi Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING MULTILAYERED SUBSTRATE AND MANUFACTURING M...
- Publication number 20230300984
- Publication date Sep 21, 2023
- Samsung Electronics Co., Ltd.
- Seungjin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING A R...
- Publication number 20230276568
- Publication date Aug 31, 2023
- Intel Corporation
- Ofer Markish
- G01 - MEASURING TESTING
Information Patent Application
Printed Circuit Board, Backplane Architecture System, and Communica...
- Publication number 20230269862
- Publication date Aug 24, 2023
- Huawei Technologies Co., Ltd
- Wenliang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20230262893
- Publication date Aug 17, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Lands, clearance holes or other lay-out details concerning the surrounding of a via

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminated circuit board

Component-embedded substrate

Printed circuit boards and memory modules

Printed circuit board, inverter, motor vehicle and method for produ...

Flexible printed circuit board and method of manufacturing same

Wideband routing techniques for PCB layout

Package component and forming method thereof

Printed circuit board (PCB) including heatsinks

Printed circuit board for galvanic effect reduction

Substrate structure and manufacturing method thereof, electronic de...

Circuit board structure

Techniques for high-speed signal layer transition

Balun comprising stepped transitions between balance and unbalance...

Wiring board and manufacturing method for same

Wiring substrate

Packaging structure with embedded electronic components and method...

Printed wiring board and method for manufacturing printed wiring board

Electronic device including interposer

Printed circuit board

Printed circuit boards with plated blind slots for improved vertica...

Wiring substrate and method for manufacturing wiring substrate

Through-hole via and circuit board

Systems including an integrated power module with vias and methods...

Printed circuit board

Glass core, multilayer circuit board, and method of manufacturing g...

Circuit board connector footprint

Multilayer circuit board

Component carrier with blind hole filled with an electrically condu...

Intermediate substrate and fabrication method thereof

Suspension assembly and disk device

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

FILLING CRACKS ON A SUBSTRATE VIA

METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE

METHODS FOR THE ACYLATION OF MAYTANSINOL

WIRING SUBSTRATE

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...

Circuit Board and Manufacturing Method Thereof, and Terminal Device

PRINTED WIRING BOARD

ELECTRONIC DEVICE INCLUDING INTERPOSER

SUBSTRATES WITH CONTINUOUS SLOT VIAS

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD AND PRINTED WIRING BOARD MANUFACTURING SUBSTRATE

CIRCUIT BOARD

WEARABLE NEUROSTIMULATOR WITH RIVET CONNECTION

DEVICE PACKAGING SUBSTRATE, MANUFACTURING METHOD FOR THE SAME, AND...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTILAYER WIRING BOARD

SEMICONDUCTOR PACKAGE

BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME

SIMPLE LITZ PLANAR ARCHITECTURE WITH MINIMAL VIAS TO REDUCE AC RESI...

PACKAGE COMPONENT AND FORMING METHOD THEREOF

PACKAGING STRUCTURE WITH EMBEDDED POWER CHIP AND CIRCUIT BOARD MODU...

PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...

WIRING BOARD

PRINTED CIRCUIT BOARD FOR GALVANIC EFFECT REDUCTION

WIRING SUBSTRATE

ELECTRONIC DEVICE HAVING MULTILAYERED SUBSTRATE AND MANUFACTURING M...

APPARATUS AND SYSTEM OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING A R...

Printed Circuit Board, Backplane Architecture System, and Communica...

CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE