larger or equal to 1000 microns less than 1500 microns

Industry

CPC
H01L2924/2065

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/2065larger or equal to 1000 microns less than 1500 microns

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 9,917,036
- Issue date Mar 13, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 9,911,705
- Issue date Mar 6, 2018
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 9,653,390
- Issue date May 16, 2017
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly bonding
- Patent number 9,488,853
- Issue date Nov 8, 2016
- VERILY LIFE SCIENCES LLC
- James Etzkorn
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,431,360
- Issue date Aug 30, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat management in electronics packaging
- Patent number 9,331,000
- Issue date May 3, 2016
- Kyocera America, Inc.
- Mark Eblen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...
- Patent number 9,266,196
- Issue date Feb 23, 2016
- Senju Metal Industry Co., Ltd.
- Takashi Akagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,257,408
- Issue date Feb 9, 2016
- Mitsubishi Electric Corporation
- Takayuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge bond foot jumper connections
- Patent number 9,236,363
- Issue date Jan 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D bond and assembly process for severely bowed interposer die
- Patent number 9,224,712
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Marcus E. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079340
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE
- Publication number 20230335530
- Publication date Oct 19, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20180158759
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20160190044
- Publication date Jun 30, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20160064355
- Publication date Mar 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150348927
- Publication date Dec 3, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- HSUAN-TING KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT MANAGEMENT IN ELECTRONICS PACKAGING
- Publication number 20150287661
- Publication date Oct 8, 2015
- Kyocera America Inc
- Mark EBLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wedge Bond Foot Jumper Connections
- Publication number 20150262961
- Publication date Sep 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150262962
- Publication date Sep 17, 2015
- Mitsubishi Electric Corporation
- Takayuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20150235925
- Publication date Aug 20, 2015
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE
- Publication number 20150228614
- Publication date Aug 13, 2015
- International Business Machines Corporation
- MARCUS E INTERRANTE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20150221582
- Publication date Aug 6, 2015
- Kabushiki Kaisha Toshiba
- Takeshi Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...
- Publication number 20150217409
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Takashi AKAGAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ASSEMBLY BONDING
- Publication number 20150212340
- Publication date Jul 30, 2015
- Google Inc.
- James Etzkorn
- G02 - OPTICS
Information Patent Application
ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS
- Publication number 20140085599
- Publication date Mar 27, 2014
- Google Inc.
- James Etzkorn
- G02 - OPTICS
Information Patent Application
ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS
- Publication number 20140084489
- Publication date Mar 27, 2014
- James Etzkorn
- G02 - OPTICS
Information Patent Application
A METHOD FOR MANUFACTURING A CHIP PACKAGE, A METHOD FOR MANUFACTURI...
- Publication number 20130334712
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS

larger or equal to 1000 microns less than 1500 microns

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package and a wafer level package

Chip package and a wafer level package

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and semiconductor device manufacturing method

Assembly bonding

Semiconductor structure and manufacturing method thereof

Heat management in electronics packaging

Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...

Semiconductor device and method of manufacturing the same

Wedge bond foot jumper connections

3D bond and assembly process for severely bowed interposer die

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

CHIP PACKAGES AND METHODS OF MANUFACTURE THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

HEAT MANAGEMENT IN ELECTRONICS PACKAGING

Wedge Bond Foot Jumper Connections

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE

CONNECTOR FRAME AND SEMICONDUCTOR DEVICE

Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...

ASSEMBLY BONDING

ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS

ASSEMBLING THIN SILICON CHIPS ON A CONTACT LENS

A METHOD FOR MANUFACTURING A CHIP PACKAGE, A METHOD FOR MANUFACTURI...