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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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H01L2924/12042
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Patents Grants
last 30 patents
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
12,368,138
Issue date
Jul 22, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices with through-substrate interconnects and as...
Patent number
12,368,096
Issue date
Jul 22, 2025
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor memory device and structure
Patent number
12,362,219
Issue date
Jul 15, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
12,347,731
Issue date
Jul 1, 2025
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming recesses in molding compound of wafer to reduce stress
Patent number
12,334,474
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in package
Patent number
12,327,807
Issue date
Jun 10, 2025
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package, wearable device, and temperature detection m...
Patent number
12,322,740
Issue date
Jun 3, 2025
Advanced Semiconductor Engineering, Inc.
Ying-Chung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
12,278,216
Issue date
Apr 15, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
Patent number
12,278,199
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Chang-Pin Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic chip support device and corresponding manufacturing method
Patent number
12,272,922
Issue date
Apr 8, 2025
STMicroelectronics (Grenoble 2) SAS
Fabien Quercia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device
Patent number
12,274,104
Issue date
Apr 8, 2025
Nichia Corporation
Takuya Nakabayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor memory device and structure with memory and metal...
Patent number
12,272,586
Issue date
Apr 8, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor light emitting device
Patent number
12,255,275
Issue date
Mar 18, 2025
Rohm Co., Ltd.
Tomoichiro Toyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers and memory...
Patent number
12,243,765
Issue date
Mar 4, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Header for an electric component
Patent number
12,230,937
Issue date
Feb 18, 2025
Schott AG
Ong Wai Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package and fabricating method thereof
Patent number
12,230,661
Issue date
Feb 18, 2025
Amkor Technology Singapore Holding Pte Ltd.
Jin Young Kim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
Patent number
12,218,098
Issue date
Feb 4, 2025
Infineon Technologies AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device, resin package, resin-molded body, and method...
Patent number
12,211,959
Issue date
Jan 28, 2025
Nichia Corporation
Hirofumi Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package assembly with wire bond vias
Patent number
12,211,821
Issue date
Jan 28, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring base, package for storing semiconductor element, and semicon...
Patent number
12,199,194
Issue date
Jan 14, 2025
Kyocera Corporation
Makoto Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level dicing method and semiconductor device
Patent number
12,176,248
Issue date
Dec 24, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Ju Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and a method of manufacturing the same
Patent number
12,154,823
Issue date
Nov 26, 2024
Renesas Electronics Corporation
Katsuhiko Hotta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor memory device and structure
Patent number
12,154,817
Issue date
Nov 26, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming ultra high density embed...
Patent number
12,148,677
Issue date
Nov 19, 2024
JCET Semiconductor (Shaoxing) Co., Ltd.
See Chian Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
Patent number
12,143,077
Issue date
Nov 12, 2024
Skyworks Solutions, Inc.
Peter J. Zampardi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and manufacturing method thereof
Patent number
12,136,565
Issue date
Nov 5, 2024
Amkor Technology Singapore Holding Pte Ltd.
Michael G. Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with single-crystal layers
Patent number
12,136,562
Issue date
Nov 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etched trenches in bond materials for die singulation, and associat...
Patent number
12,132,155
Issue date
Oct 29, 2024
Micron Technology, Inc.
Vladimir Odnoblyudov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge interconnection with layered interconnect structures
Patent number
12,132,002
Issue date
Oct 29, 2024
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers and memory...
Patent number
12,125,737
Issue date
Oct 22, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Patents Applications
last 30 patents
Information
Patent Application
SILICON PHOTONICS CHIP AND METHOD OF MANUFACTURING THE SAME
Publication number
20250226369
Publication date
Jul 10, 2025
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
SangHwa YOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING
Publication number
20250183090
Publication date
Jun 5, 2025
TEXAS INSTRUMENTS INCORPORATED
Jezreel Duane Aquino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
Publication number
20250160031
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
COMPONENT AND METHOD OF MANUFACTURING A COMPONENT USING AN ULTRATHI...
Publication number
20250157857
Publication date
May 15, 2025
INFINEON TECHNOLOGIES AG
Karl Mayer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
Publication number
20250149489
Publication date
May 8, 2025
Apple Inc.
Jared L. Zerbe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
Publication number
20250132187
Publication date
Apr 24, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...
Publication number
20250133878
Publication date
Apr 24, 2025
Nichia Corporation.
Hirofumi Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20250132260
Publication date
Apr 24, 2025
Ping-Jung Yang
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
WIRE BOND ELECTROMAGNETIC INTERFERENCE (EMI) CAGE TO BLOCK TRANSMIS...
Publication number
20250125279
Publication date
Apr 17, 2025
STMicroelectronics International N.V.
Kai Quan CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
Publication number
20250118705
Publication date
Apr 10, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20250110291
Publication date
Apr 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Ming Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS CHIP STACKING STRUCTURE
Publication number
20250105186
Publication date
Mar 27, 2025
Shine Optics Technology Company Limited
KUNG-AN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS CHIP STACKING DEVICE
Publication number
20250105202
Publication date
Mar 27, 2025
Shine Optics Technology Company Limited
KUNG-AN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PAD SURFACE LEVELING DEVICE
Publication number
20250105033
Publication date
Mar 27, 2025
Shine Optics Technology Company Limited
KUNG-AN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS CHIP STACKING METHOD
Publication number
20250105204
Publication date
Mar 27, 2025
Shine Optics Technology Company Limited
KUNG-AN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
Publication number
20250070091
Publication date
Feb 27, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
Publication number
20250069954
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Ju Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250062304
Publication date
Feb 20, 2025
Samsung Electronics Co., Ltd.
SEOKGEUN AHN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated transceiver array
Publication number
20250054930
Publication date
Feb 13, 2025
Apple Inc.
Shingo Mandai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
Publication number
20250056937
Publication date
Feb 13, 2025
Micron Technology, Inc.
Vladimir Odnoblyudov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20250046653
Publication date
Feb 6, 2025
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250038042
Publication date
Jan 30, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Michael G. Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
Publication number
20250030386
Publication date
Jan 23, 2025
Skyworks Solutions, Inc.
Weimin Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
Publication number
20250015033
Publication date
Jan 9, 2025
Apple Inc.
Jared L. Zerbe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
Publication number
20250015004
Publication date
Jan 9, 2025
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
Publication number
20250006544
Publication date
Jan 2, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
Bonding structure
Publication number
20250006684
Publication date
Jan 2, 2025
Teknologian Tutkimuskeskus VTT Oy
Jae-Wung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20240429173
Publication date
Dec 26, 2024
Intel Corporation
Henning BRAUNISCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
Publication number
20240429086
Publication date
Dec 26, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20240421131
Publication date
Dec 19, 2024
Lodestar Licensing Group LLC
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS