Laser

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CPC
H01L2224/75261

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75261Laser

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for soldering electronic component and method for manufactur...
- Patent number 12,051,887
- Issue date Jul 30, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding head with large and small spray apertures
- Patent number 11,817,419
- Issue date Nov 14, 2023
- SHIBUYA CORPORATION
- Masato Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reel-to-reel laser reflow
- Patent number 11,515,287
- Issue date Nov 29, 2022
- LASERSSEL CO., LTD.
- Byung Rock Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reel-to-reel laser reflow
- Patent number 11,257,783
- Issue date Feb 22, 2022
- LASERSSEL CO., LTD.
- Byung Rock Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding method and bonding device
- Patent number 11,239,198
- Issue date Feb 1, 2022
- BOE Technology Group Co., Ltd.
- Lili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for contactlessly transferring at least partly fe...
- Patent number 11,062,927
- Issue date Jul 13, 2021
- Muehlbauer GmbH & Co. KG
- Hans-Peter Monser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placing ultra-small or ultra-thin discrete components
- Patent number 10,748,802
- Issue date Aug 18, 2020
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices f...
- Patent number 10,636,770
- Issue date Apr 28, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for transfer of semiconductor devices
- Patent number 10,622,337
- Issue date Apr 14, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,615,153
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Semiconductor device on glass substrate
- Patent number 10,615,152
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,566,319
- Issue date Feb 18, 2020
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Grant
Apparatus for laser bonding of flip chip and method for laser bondi...
- Patent number 10,497,665
- Issue date Dec 3, 2019
- PROTEC CO., LTD.
- Geunsik Ahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 10,490,525
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices
- Patent number 10,490,532
- Issue date Nov 26, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Apparatus for bonding semiconductor chip and method for bonding sem...
- Patent number 10,483,228
- Issue date Nov 19, 2019
- PROTEC CO., LTD.
- Geunsik Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser welding method
- Patent number 10,442,035
- Issue date Oct 15, 2019
- Fuji Electric Co., Ltd.
- Yuta Tamai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for multi-direct transfer of semiconductors
- Patent number 10,373,937
- Issue date Aug 6, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Substrate with array of LEDs for backlighting a display device
- Patent number 10,361,176
- Issue date Jul 23, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device on string circuit and method of making the same
- Patent number 10,325,885
- Issue date Jun 18, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for improved direct transfer of semiconductor die
- Patent number 10,290,615
- Issue date May 14, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF DISPLAY PANEL, AND DETECTION AND BONDING AP...
- Publication number 20240047280
- Publication date Feb 8, 2024
- TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.
- Kerui XI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20220367404
- Publication date Nov 17, 2022
- SHIBUYA CORPORATION
- Masato KITAGAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP BONDING METHOD AND BONDING DEVICE
- Publication number 20210159208
- Publication date May 27, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Lili WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
- Publication number 20200251453
- Publication date Aug 6, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20200243491
- Publication date Jul 30, 2020
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
- Publication number 20200235081
- Publication date Jul 23, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
Apparatus and Method for Direct Transfer of Semiconductor Devices
- Publication number 20200168587
- Publication date May 28, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR CONTACTLESSLY TRANSFERRING AT LEAST PARTLY FE...
- Publication number 20200027764
- Publication date Jan 23, 2020
- Muehlbauer GmbH & Co. KG
- Hans-Peter Monser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20190348405
- Publication date Nov 14, 2019
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE
- Publication number 20190237445
- Publication date Aug 1, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LIGHT DIFFUSION
- Publication number 20190139945
- Publication date May 9, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING SEMICONDUCTOR CHIP AND METHOD FOR BONDING SEM...
- Publication number 20180366433
- Publication date Dec 20, 2018
- PROTEC CO., LTD.
- GEUNSIK AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR LASER BONDING OF FLIP CHIP AND METHOD FOR LASER BONDI...
- Publication number 20180366435
- Publication date Dec 20, 2018
- PROTEC CO., LTD.
- GEUNSIK AHN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF
- Publication number 20180065186
- Publication date Mar 8, 2018
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
LASER WELDING METHOD, LASER WELDING JIG, AND SEMICONDUCTOR DEVICE
- Publication number 20150179539
- Publication date Jun 25, 2015
- Fuji Electric Co., Ltd.
- Yuta TAMAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE
- Publication number 20150171048
- Publication date Jun 18, 2015
- SHIBUYA KOGYO CO., LTD.
- Hiroyuki YASUYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20130340943
- Publication date Dec 26, 2013
- Tadashi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES
- Publication number 20130210194
- Publication date Aug 15, 2013
- LUXVUE TECHNOLOGY CORPORATION
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AN...
- Publication number 20120319253
- Publication date Dec 20, 2012
- Toyota Jidosha Kabushiki Kaisha
- Hiroki Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for soldering electronic component and method for manufactur...

Laser bonding apparatus for three-dimensional molded sculptures

Bonding head with large and small spray apertures

Dielectric-dielectric and metallization bonding via plasma activati...

Systems for direct transfer of semiconductor device die

Device and method for reel-to-reel laser reflow

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Device and method for reel-to-reel laser reflow

Chip bonding method and bonding device

High speed handling of ultra-small chips by selective laser bonding...

Method for improved transfer of semiconductor die

Device and method for contactlessly transferring at least partly fe...

Apparatus for direct transfer of semiconductor device die

Placing ultra-small or ultra-thin discrete components

Micro-selective sintering laser systems and methods thereof

Apparatus and method for direct transfer of semiconductor devices f...

Method and apparatus for transfer of semiconductor devices

Apparatus for direct transfer of semiconductor device die

Semiconductor device on glass substrate

Apparatus for direct transfer of semiconductor device die

Apparatus for laser bonding of flip chip and method for laser bondi...

High speed handling of ultra-small chips by selective laser bonding...

Apparatus and method for direct transfer of semiconductor devices

Apparatus for bonding semiconductor chip and method for bonding sem...

Laser welding method

Apparatus for multi-direct transfer of semiconductors

Substrate with array of LEDs for backlighting a display device

Semiconductor device on string circuit and method of making the same

Method and apparatus for improved direct transfer of semiconductor die

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF DISPLAY PANEL, AND DETECTION AND BONDING AP...

BONDING APPARATUS

CHIP BONDING METHOD AND BONDING DEVICE

APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE

Apparatus and Method for Direct Transfer of Semiconductor Devices

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

DEVICE AND METHOD FOR CONTACTLESSLY TRANSFERRING AT LEAST PARTLY FE...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE

METHOD AND APPARATUS FOR LIGHT DIFFUSION

APPARATUS FOR BONDING SEMICONDUCTOR CHIP AND METHOD FOR BONDING SEM...

APPARATUS FOR LASER BONDING OF FLIP CHIP AND METHOD FOR LASER BONDI...

MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF

LASER WELDING METHOD, LASER WELDING JIG, AND SEMICONDUCTOR DEVICE

BONDING DEVICE

BONDING APPARATUS

METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES

SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AN...