LASER

Industry

CPC
H01L2924/401

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/401LASER

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus, and method of manufacturing...
- Patent number 11,823,924
- Issue date Nov 21, 2023
- Kioxia Corporation
- Aoi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-beam laser de-bonding apparatus and method thereof
- Patent number 11,699,676
- Issue date Jul 11, 2023
- LASERSSEL CO., LTD.
- Jae-Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solar cell and method of manufacturing the same
- Patent number 11,404,597
- Issue date Aug 2, 2022
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method
- Patent number 11,114,341
- Issue date Sep 7, 2021
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser welding method
- Patent number 10,442,035
- Issue date Oct 15, 2019
- Fuji Electric Co., Ltd.
- Yuta Tamai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
- Patent number 10,037,972
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFID chip module
- Patent number 9,542,636
- Issue date Jan 10, 2017
- Textilma AG
- Stephan Buehler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal member, metal member surface processing method, semiconductor...
- Patent number 9,517,532
- Issue date Dec 13, 2016
- Denso Corporation
- Wataru Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite substrate manufacturing method, semiconductor element man...
- Patent number 9,455,229
- Issue date Sep 27, 2016
- Namiki Seimitsu Houseki Kabushiki Kaisha
- Hideo Aida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser welding method, laser welding jig, and semiconductor device
- Patent number 9,399,268
- Issue date Jul 26, 2016
- Fuji Electric Co., Ltd.
- Yuta Tamai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside mold process for ultra thin substrate and package on packa...
- Patent number 8,835,220
- Issue date Sep 16, 2014
- Intel Corporation
- Huay Huay Sim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Backside mold process for ultra thin substrate and package on packa...
- Patent number 8,384,223
- Issue date Feb 26, 2013
- Intel Corporation
- Huay Huay Sim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
CHIP TRANSFERRING AND BONDING DEVICE, AND CHIP TRANSFERRING AND BON...
- Publication number 20250087626
- Publication date Mar 13, 2025
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20250079395
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240297045
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...
- Publication number 20240258134
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Masayuki NISHIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240234215
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240136231
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240120311
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- FUTOSHI YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE
- Publication number 20240105497
- Publication date Mar 28, 2024
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240021570
- Publication date Jan 18, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20230275062
- Publication date Aug 31, 2023
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...
- Publication number 20220285181
- Publication date Sep 8, 2022
- KIOXIA Corporation
- Aoi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BEAM LASER DE-BONDING APPARATUS AND METHOD THEREOF
- Publication number 20200251442
- Publication date Aug 6, 2020
- LASERSSEL CO., LTD.
- Jae-Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20200135563
- Publication date Apr 30, 2020
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS
- Publication number 20170018525
- Publication date Jan 19, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL MEMBER, METAL MEMBER SURFACE PROCESSING METHOD, SEMICONDUCTOR...
- Publication number 20160207148
- Publication date Jul 21, 2016
- Denso Corporation
- Wataru KOBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRI...
- Publication number 20150348893
- Publication date Dec 3, 2015
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- CHIH WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD-FLAT NO-LEADS PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20150279796
- Publication date Oct 1, 2015
- Lingsen Precision Industries Ltd.
- Ming-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID Chip Module
- Publication number 20150262053
- Publication date Sep 17, 2015
- TEXTILMA AG
- Stephan Buehler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LASER WELDING METHOD, LASER WELDING JIG, AND SEMICONDUCTOR DEVICE
- Publication number 20150179539
- Publication date Jun 25, 2015
- Fuji Electric Co., Ltd.
- Yuta TAMAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...
- Publication number 20150076662
- Publication date Mar 19, 2015
- NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
- Hideo Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKA...
- Publication number 20150072474
- Publication date Mar 12, 2015
- Intel Corporation
- Huay Huay Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...
- Publication number 20150072515
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID Chip Module
- Publication number 20140210078
- Publication date Jul 31, 2014
- TEXTILMA AG
- Stephan Buehler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKA...
- Publication number 20130230946
- Publication date Sep 5, 2013
- Huay Huay Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKA...
- Publication number 20090321949
- Publication date Dec 31, 2009
- Huay Huay Sim
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus, and method of manufacturing...

Multi-beam laser de-bonding apparatus and method thereof

Solar cell and method of manufacturing the same

Laser processing method

Laser welding method

Electronic module comprising fluid cooling channel and method of ma...

RFID chip module

Metal member, metal member surface processing method, semiconductor...

Composite substrate manufacturing method, semiconductor element man...

Laser welding method, laser welding jig, and semiconductor device

Backside mold process for ultra thin substrate and package on packa...

Backside mold process for ultra thin substrate and package on packa...

Patents Applicationslast 30 patents

CHIP TRANSFERRING AND BONDING DEVICE, AND CHIP TRANSFERRING AND BON...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...

APPARATUS FOR MEASURING AN ADHESION FORCE

APPARATUS FOR MEASURING AN ADHESION FORCE

BONDING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE

BONDING APPARATUS

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...

MULTI-BEAM LASER DE-BONDING APPARATUS AND METHOD THEREOF

LASER PROCESSING METHOD

METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS

METAL MEMBER, METAL MEMBER SURFACE PROCESSING METHOD, SEMICONDUCTOR...

METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRI...

QUAD-FLAT NO-LEADS PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...

RFID Chip Module

LASER WELDING METHOD, LASER WELDING JIG, AND SEMICONDUCTOR DEVICE

COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...

BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKA...

LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...

RFID Chip Module

BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKA...

BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKA...