Lateral distribution of the bonding areas

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H01L2224/80194

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80194Lateral distribution of the bonding areas

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Patents Grantslast 30 patents

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Conductive barrier direct hybrid bonding
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Conductive barrier direct hybrid bonding
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Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
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CONDUCTIVE BARRIER DIRECT HYBRID BONDING
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- INVENSAS BONDING TECHNOLOGIES, INC.
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- Taiwan Semiconductor Manufacturing Company, Ltd.
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- G02 - OPTICS

Lateral distribution of the bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Flat metal features for microelectronics applications

Conductive barrier direct hybrid bonding

Solid-state imaging device, manufacturing method thereof, and elect...

Semiconductor device

Semiconductor device

Semiconductor interconnect structure and method

Conductive barrier direct hybrid bonding

Solid-state imaging device, manufacturing method thereof, and elect...

Semiconductor device and imaging device

Flat metal features for microelectronics applications

Semiconductor device and imaging device

Solid-state imaging device, manufacturing method thereof, and elect...

Flat metal features for microelectronics applications

Semiconductor device and imaging device

Electronic component mounting structure

Patents Applicationslast 30 patents

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE

Semiconductor Interconnect Structure and Method

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE

SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...

SEMICONDUCTOR DEVICE AND IMAGING DEVICE

SEMICONDUCTOR DEVICE AND IMAGING DEVICE

SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...

Semiconductor Interconnect Structure and Method

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

ELECTRONIC COMPONENT MOUNTING STRUCTURE