Lateral distribution of the bump connectors

Industry

CPC
H01L2224/81194

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81194Lateral distribution of the bump connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Asymmetric die bonding
- Patent number 11,784,160
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing and filling containers
- Patent number 11,345,073
- Issue date May 31, 2022
- KHS GmbH
- Ludwig Clüsserath
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector-arrays and methods of fabrication thereof
- Patent number 10,644,061
- Issue date May 5, 2020
- Semi-Conductor Devices-An Elbit Systems-Rafael Partnership
- Yoram Karni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 10,468,366
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 10,271,429
- Issue date Apr 23, 2019
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 10,177,108
- Issue date Jan 8, 2019
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Display device
- Patent number 9,818,771
- Issue date Nov 14, 2017
- Japan Display Inc.
- Yohei Iwai
- G02 - OPTICS
Information Patent Grant
Semiconductor device
- Patent number 9,818,678
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Jumpei Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package using the same
- Patent number 9,748,193
- Issue date Aug 29, 2017
- Samsung Electronics Co., Ltd.
- Young-ja Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concentric bump design for the alignment in die stacking
- Patent number 9,721,916
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming overlapping semiconducto...
- Patent number 9,721,925
- Issue date Aug 1, 2017
- STATS ChipPAC, Pte. Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of confining conductive bump materi...
- Patent number 9,679,811
- Issue date Jun 13, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,673,161
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor devices on sustrate and bonding st...
- Patent number 9,613,925
- Issue date Apr 4, 2017
- Tsinghua University
- Jian Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 9,570,414
- Issue date Feb 14, 2017
- Kabushiki Kaisha Toshiba
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module and electronic...
- Patent number 9,532,495
- Issue date Dec 27, 2016
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe feature to minimize flip-chip semiconductor die collapse...
- Patent number 9,449,900
- Issue date Sep 20, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method of electronic component and electronic component mo...
- Patent number 9,439,300
- Issue date Sep 6, 2016
- Ricoh Company, Ltd.
- Yuichi Tanida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump-on-lead interconnec...
- Patent number 9,385,101
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,355,974
- Issue date May 31, 2016
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with removable backing element ha...
- Patent number 9,337,161
- Issue date May 10, 2016
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,142,516
- Issue date Sep 22, 2015
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump-on-lead interconnec...
- Patent number 9,064,858
- Issue date Jun 23, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of dissipating heat from thin packa...
- Patent number 8,941,235
- Issue date Jan 27, 2015
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming overlapping semiconducto...
- Patent number 8,872,320
- Issue date Oct 28, 2014
- STATS ChipPAC, Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with means for preventing solder bridges, and...
- Patent number 8,829,688
- Issue date Sep 9, 2014
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with removable backing element ha...
- Patent number 8,810,017
- Issue date Aug 19, 2014
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,810,043
- Issue date Aug 19, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230187285
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- SANG-WON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC DIE BONDING
- Publication number 20220093556
- Publication date Mar 24, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20200098714
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED DIE SEMICONDUCTOR DEVICE
- Publication number 20180342483
- Publication date Nov 29, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20180240775
- Publication date Aug 23, 2018
- FUJITSU COMPONENT LIMITED
- Rie Tsudome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180014405
- Publication date Jan 11, 2018
- SAMSUNG DISPLAY CO., LTD.
- BYOUNG YONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20160329293
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package System with Removable Backing Element Ha...
- Publication number 20140332955
- Publication date Nov 13, 2014
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR REDUCING STRESS ON DIE ASSEMBLY
- Publication number 20140225268
- Publication date Aug 14, 2014
- GEORGE R. LEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNT...
- Publication number 20140218881
- Publication date Aug 7, 2014
- RICOH COMPANY, LTD.
- Yuichi Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140203431
- Publication date Jul 24, 2014
- RENESAS ELECTRONICS CORPORATION
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Interconnection Structure
- Publication number 20140145340
- Publication date May 29, 2014
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH PILLAR CONNECTION
- Publication number 20140141566
- Publication date May 22, 2014
- MOSAID TECHNOLOGIES INCORPORATED
- Roland SCHUETZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...
- Publication number 20140049922
- Publication date Feb 20, 2014
- MURATA MANUFACTURING CO., LTD.
- Shinya KIYONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...
- Publication number 20140008792
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140004661
- Publication date Jan 2, 2014
- RENESAS ELECTRONICS CORPORATION
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNEC...
- Publication number 20130277826
- Publication date Oct 24, 2013
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Contact Alignment Posts
- Publication number 20130157455
- Publication date Jun 20, 2013
- International Buiness Machines Corporation
- David Justin West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFAC...
- Publication number 20130134594
- Publication date May 30, 2013
- Shinko Electric Industries Co., LTD.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS
- Publication number 20130119536
- Publication date May 16, 2013
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130026649
- Publication date Jan 31, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP SEMICONDUCTOR DEVICE HAVING ANISOTROPIC ELECTRICAL INTERC...
- Publication number 20130026625
- Publication date Jan 31, 2013
- Hian-Hang MAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO PIN HYBRID INTERCONNECT ARRAY
- Publication number 20130000963
- Publication date Jan 3, 2013
- GENERAL ELECTRIC COMPANY
- Charles Gerard Woychick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130001274
- Publication date Jan 3, 2013
- Renesas Electronics Corporation
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES
- Publication number 20120326322
- Publication date Dec 27, 2012
- Oracle International Corporation
- Ashok V. Krishnamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Bump Pitch Scaling
- Publication number 20120319269
- Publication date Dec 20, 2012
- BROADCOM CORPORATION
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES
- Publication number 20120267781
- Publication date Oct 25, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REMOVABLE BACKING ELEMENT HA...
- Publication number 20120261808
- Publication date Oct 18, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Dissipating Heat From Thin Packa...
- Publication number 20120175769
- Publication date Jul 12, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device and Method of Forming Overlapping Semiconducto...
- Publication number 20120119361
- Publication date May 17, 2012
- STATS ChipPAC, Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS

Lateral distribution of the bump connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Asymmetric die bonding

Method and device for producing and filling containers

Bonded structures for package and substrate

Photodetector-arrays and methods of fabrication thereof

Bonded structures for package and substrate

Display device and method for manufacturing the same

Method of manufacturing electronic component module and electronic...

Display device

Semiconductor device

Printed circuit board and semiconductor package using the same

Concentric bump design for the alignment in die stacking

Semiconductor device and method of forming overlapping semiconducto...

Semiconductor device and method of confining conductive bump materi...

Bonded structures for package and substrate

Method for bonding semiconductor devices on sustrate and bonding st...

Semiconductor device and method of manufacturing the semiconductor...

Method of manufacturing electronic component module and electronic...

Leadframe feature to minimize flip-chip semiconductor die collapse...

Mounting method of electronic component and electronic component mo...

Flip-chip assembly process comprising pre-coating interconnect elem...

Semiconductor device and method of forming bump-on-lead interconnec...

Semiconductor device and manufacturing method therefor

Integrated circuit package system with removable backing element ha...

Semiconductor device and manufacturing method therefor

Semiconductor device and method of forming bump-on-lead interconnec...

Semiconductor device and method of dissipating heat from thin packa...

Semiconductor device and method of forming overlapping semiconducto...

Semiconductor device with means for preventing solder bridges, and...

Integrated circuit package system with removable backing element ha...

Semiconductor device

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

ASYMMETRIC DIE BONDING

Bonded Structures for Package and Substrate

ANGLED DIE SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Bonded Structures for Package and Substrate

Integrated Circuit Package System with Removable Backing Element Ha...

METHODS AND STRUCTURES FOR REDUCING STRESS ON DIE ASSEMBLY

MOUNTING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNT...

SEMICONDUCTOR DEVICE

Flip Chip Interconnection Structure

MULTI-CHIP PACKAGE WITH PILLAR CONNECTION

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...

Semiconductor Device and Method of Forming Bump-on-Lead Interconnec...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNEC...

Electrical Contact Alignment Posts

SEMICONDUCTOR DEVICE, SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFAC...

METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

FLIP-CHIP SEMICONDUCTOR DEVICE HAVING ANISOTROPIC ELECTRICAL INTERC...

MICRO PIN HYBRID INTERCONNECT ARRAY

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CHIP PACKAGE WITH REINFORCED POSITIVE ALIGNMENT FEATURES

Enhanced Bump Pitch Scaling

MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REMOVABLE BACKING ELEMENT HA...

Semiconductor Device and Method of Dissipating Heat From Thin Packa...

Semiconductor Device and Method of Forming Overlapping Semiconducto...