Lateral distribution of the layer connectors

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CPC
H01L2224/83194

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83194Lateral distribution of the layer connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Detection structure and detection method
- Patent number 11,915,985
- Issue date Feb 27, 2024
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Qin Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,854,783
- Issue date Dec 26, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,195,741
- Issue date Dec 7, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cooling body with a groove
- Patent number 11,088,045
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having an under-fill element, a mounting method o...
- Patent number 10,910,338
- Issue date Feb 2, 2021
- Samsung Display Co., Ltd.
- Jeonghun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a semiconductor device having bi-material...
- Patent number 10,784,188
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 10,763,192
- Issue date Sep 1, 2020
- STMicroelectronics S.r.l.
- Dario Vitello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,636,838
- Issue date Apr 28, 2020
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Improving mechanical and thermal reliability in varying form factors
- Patent number 10,629,557
- Issue date Apr 21, 2020
- Veronica A Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for the fluidic assembly of micro-LEDs utilizing...
- Patent number 10,535,640
- Issue date Jan 14, 2020
- eLux Inc.
- Jong-Jan Lee
- G02 - OPTICS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 10,535,546
- Issue date Jan 14, 2020
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,515,918
- Issue date Dec 24, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for semiconductor device having bi-material d...
- Patent number 10,366,944
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,325,894
- Issue date Jun 18, 2019
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having an under-fill element, a mounting method o...
- Patent number 10,276,538
- Issue date Apr 30, 2019
- Samsung Display Co., Ltd.
- Jeonghun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and electronic apparatus to lower risk of breakage of...
- Patent number 10,236,312
- Issue date Mar 19, 2019
- Sony Corporation
- Yusuke Mada
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,199,338
- Issue date Feb 5, 2019
- Renesas Electronics Corporation
- Taku Kanaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,163,840
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Teck Kheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,929,124
- Issue date Mar 27, 2018
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component mounting method
- Patent number 9,609,760
- Issue date Mar 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 9,585,247
- Issue date Feb 28, 2017
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chip affixed to substrate...
- Patent number 9,524,949
- Issue date Dec 20, 2016
- Dexerials Corporation
- Kazunori Hamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, substrate and semiconductor device manufactur...
- Patent number 9,520,374
- Issue date Dec 13, 2016
- Rohm Co., Ltd.
- Yasumasa Kasuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 9,502,370
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating resin film, bonded structure using insulating resin film...
- Patent number 9,426,896
- Issue date Aug 23, 2016
- Dexerials Corporation
- Daisuke Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing light-emitting device and wiring substrate...
- Patent number 9,368,675
- Issue date Jun 14, 2016
- Nichia Corporation
- Yoshikazu Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,368,374
- Issue date Jun 14, 2016
- Dexerials Corporation
- Kazunori Hamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, imaging device and semiconductor device manuf...
- Patent number 9,343,498
- Issue date May 17, 2016
- Olympus Corporation
- Haruhisa Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DETECTION STRUCTURE AND DETECTION METHOD
- Publication number 20220148930
- Publication date May 12, 2022
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Qin KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...
- Publication number 20200043888
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki TATSUMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Methods and Apparatus for a Semiconductor Device Having Bi-Material...
- Publication number 20190304881
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...
- Publication number 20190019774
- Publication date Jan 17, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SUBSTRATES
- Publication number 20170117247
- Publication date Apr 27, 2017
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTUR...
- Publication number 20140312513
- Publication date Oct 23, 2014
- Rohm Co., Ltd.
- Yasumasa Kasuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, HAVING THROUGH ELECTRODES, A MANUFACTURING ME...
- Publication number 20140306342
- Publication date Oct 16, 2014
- Tsuyoshi YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140264383
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulating Resin Film, Bonded Structure Using Insulating Resin Film...
- Publication number 20140251537
- Publication date Sep 11, 2014
- DEXERIALS CORPORATION
- Daisuke SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP-ON-LEAD PACKAGE AND METHOD OF FORMING
- Publication number 20140248747
- Publication date Sep 4, 2014
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER SOURCE DEVICE
- Publication number 20140203444
- Publication date Jul 24, 2014
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20140175678
- Publication date Jun 26, 2014
- RENESAS ELECTRONICS CORPORATION
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140159245
- Publication date Jun 12, 2014
- RENESAS ELECTRONICS CORPORATION
- Taku KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating an Electronic Component
- Publication number 20140138843
- Publication date May 22, 2014
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structure and Process
- Publication number 20140117510
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP
- Publication number 20140110866
- Publication date Apr 24, 2014
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140096379
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140080260
- Publication date Mar 20, 2014
- RENESAS ELECTRONICS CORPORATION
- Tomoko HIGASHINO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140042616
- Publication date Feb 13, 2014
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Contact, Electric Device Package and Method of Manufacturing...
- Publication number 20130341778
- Publication date Dec 26, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASTE APPLYING APPARATUS AND PASTE APPLYING METHOD, AND DIE BONDER
- Publication number 20130276989
- Publication date Oct 24, 2013
- Tatsuyuki OKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...
- Publication number 20130234328
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-LEAD PACKAGE AND METHOD OF FORMING
- Publication number 20130168866
- Publication date Jul 4, 2013
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE
- Publication number 20130168875
- Publication date Jul 4, 2013
- SK HYNIX INC.
- Jin Ho BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD COMPONENT SHIM STRUCTURE
- Publication number 20130147012
- Publication date Jun 13, 2013
- Neil R. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Metallurgical Intercon...
- Publication number 20130113093
- Publication date May 9, 2013
- STATS ChipPAC, Ltd.
- Nazir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20130075896
- Publication date Mar 28, 2013
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL CONDUCTIVITY AND LOW DEGRADATION DIE ATTACH WITH DUAL...
- Publication number 20130062655
- Publication date Mar 14, 2013
- AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
- Keat Chuan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20130049186
- Publication date Feb 28, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS

Lateral distribution of the layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Detection structure and detection method

Micro device arrangement in donor substrate

Micro device arrangement in donor substrate

Semiconductor device having a cooling body with a groove

Electronic device having an under-fill element, a mounting method o...

Methods and apparatus for a semiconductor device having bi-material...

Systems and methods for improved delamination characteristics in a...

Method of manufacturing semiconductor devices and corresponding sem...

Integrated multi-color light-emitting pixel arrays based devices by...

Improving mechanical and thermal reliability in varying form factors

System and method for the fluidic assembly of micro-LEDs utilizing...

Micro device arrangement in donor substrate

Methods of fluxless micro-piercing of solder balls, and resulting d...

Methods and apparatus for semiconductor device having bi-material d...

Integrated multi-color light-emitting pixel arrays based devices by...

Electronic device having an under-fill element, a mounting method o...

Camera module and electronic apparatus to lower risk of breakage of...

Semiconductor device and a method of manufacturing the same

Methods of fluxless micro-piercing of solder balls, and resulting d...

Method for coating conductive substrate with adhesive

Method for bonding substrates

Electronic component mounting method

Anisotropic conductive film and method of producing the same

Semiconductor device having semiconductor chip affixed to substrate...

Semiconductor device, substrate and semiconductor device manufactur...

Semiconductor bonding structure and process

Insulating resin film, bonded structure using insulating resin film...

Method of manufacturing light-emitting device and wiring substrate...

Method of manufacturing semiconductor device

Semiconductor device, imaging device and semiconductor device manuf...

Patents Applicationslast 30 patents

DETECTION STRUCTURE AND DETECTION METHOD

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...

Methods and Apparatus for a Semiconductor Device Having Bi-Material...

METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...

METHOD FOR BONDING SUBSTRATES

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

SEMICONDUCTOR DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTUR...

SEMICONDUCTOR DEVICE, HAVING THROUGH ELECTRODES, A MANUFACTURING ME...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Insulating Resin Film, Bonded Structure Using Insulating Resin Film...

CHIP-ON-LEAD PACKAGE AND METHOD OF FORMING

SEMICONDUCTOR DEVICE AND POWER SOURCE DEVICE

Semiconductor Device and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Method for Fabricating an Electronic Component

Semiconductor Bonding Structure and Process

SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Device Contact, Electric Device Package and Method of Manufacturing...

PASTE APPLYING APPARATUS AND PASTE APPLYING METHOD, AND DIE BONDER

METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING D...

CHIP-ON-LEAD PACKAGE AND METHOD OF FORMING

SEMICONDUCTOR DEVICE AND PACKAGE

CIRCUIT BOARD COMPONENT SHIM STRUCTURE

Semiconductor Device and Method of Forming a Metallurgical Intercon...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

HIGH THERMAL CONDUCTIVITY AND LOW DEGRADATION DIE ATTACH WITH DUAL...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF