Layer and strap connectors

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H01L2224/73263

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/73263Layer and strap connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module
- Patent number 12,224,231
- Issue date Feb 11, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,191,237
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and fabrication method for the same
- Patent number 12,191,275
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 12,074,090
- Issue date Aug 27, 2024
- Fuji Electric Co., Ltd.
- Shinichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,068,741
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,063,030
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,021,043
- Issue date Jun 25, 2024
- Fuji Electric Co., Ltd.
- Hiroaki Hokazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack module and method of fabricating the same
- Patent number 11,984,432
- Issue date May 14, 2024
- Unity Power Technology Limited
- Kuk Fong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,967,545
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,961,790
- Issue date Apr 16, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,936,369
- Issue date Mar 19, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,270
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Tatsuya Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
- Patent number 11,855,035
- Issue date Dec 26, 2023
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and fabrication method for the same
- Patent number 11,848,295
- Issue date Dec 19, 2023
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070074
- Publication date Feb 27, 2025
- Fuji Electric Co., Ltd.
- Hiroaki HOKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250062272
- Publication date Feb 20, 2025
- Fuji Electric Co., Ltd.
- Tsubasa WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20250062271
- Publication date Feb 20, 2025
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046664
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038146
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20250022833
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006622
- Publication date Jan 2, 2025
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429139
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429138
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240413060
- Publication date Dec 12, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240404941
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Asuma IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO REDUCE CHIP SHIFT DURING ASSEMBLY
- Publication number 20240395758
- Publication date Nov 28, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- MC Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240395761
- Publication date Nov 28, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT
- Publication number 20240387513
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Isao TAKOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387326
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...
- Publication number 20240387526
- Publication date Nov 21, 2024
- Infineon Technologies Austria AG
- Gerhard Thomas Nöbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCU...
- Publication number 20240379510
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240355774
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Nozomi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE
- Publication number 20240355773
- Publication date Oct 24, 2024
- STATS ChipPAC Pte Ltd.
- KyungEun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312875
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Rie ARIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312896
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...
- Publication number 20240312882
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Junqing HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR CHIP PACKAGE
- Publication number 20240304528
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LEADFRAME PACKAGE WITH LEAD SIDEWALL SURFACE THAT IS FULLY SO...
- Publication number 20240274572
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS

Layer and strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module

Semiconductor module

Power semiconductor apparatus and fabrication method for the same

Semiconductor module with a first substrate, a second substrate and...

Semiconductor apparatus

Switching device and electronic circuit

Switching device and electronic circuit

Semiconductor module

Power module and fabrication method of the same, graphite plate, an...

Semiconductor device

Leadframe package with adjustable clip

Semiconductor device

Semiconductor device and electronic device

Film in substrate for releasing z stack-up constraint

Semiconductor device and method for manufacturing semiconductor device

Semiconductor packages using package in package systems and related...

Semiconductor chip stack module and method of fabricating the same

Semiconductor device

Semiconductor device

Semiconductor module

Semiconductor module

Semiconductor device

Semiconductor module

Switching device and electronic circuit

Semiconductor device

Power semiconductor device with dual heat dissipation structures

Semiconductor package with solder standoff

Semiconductor device having a metallization structure

Stack of electrical components and method of producing the same

Power semiconductor apparatus and fabrication method for the same

Patents Applicationslast 30 patents

DUAL SWITCHING POWER DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

STRUCTURE TO REDUCE CHIP SHIFT DURING ASSEMBLY

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT

SEMICONDUCTOR DEVICE

TRANSISTOR DEVICE HAVING GROUPS OF TRANSISTOR CELLS WITH DIFFERENT...

CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCU...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...

POWER TRANSISTOR CHIP PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER LEADFRAME PACKAGE WITH LEAD SIDEWALL SURFACE THAT IS FULLY SO...