Layer and TAB connectors

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CPC
H01L2224/73269

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73269Layer and TAB connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
- Patent number 10,957,633
- Issue date Mar 23, 2021
- Infineon Technologies AG
- Boon Teik Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,438,927
- Issue date Oct 8, 2019
- Samsung Electronics Co, Ltd.
- Ha Yong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
- Patent number 10,438,870
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Boon Teik Tee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for producing a switching device with a moisture-tight and e...
- Patent number 9,883,596
- Issue date Jan 30, 2018
- Semikron Elektronik GmbH & Co., KG
- Christian Göbl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame strips with electrical isolation of die paddles
- Patent number 9,263,419
- Issue date Feb 16, 2016
- Infineon Technologies AG
- Nee Wan Khoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with surface electrodes
- Patent number 8,963,315
- Issue date Feb 24, 2015
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic integration double-ended converter
- Patent number 8,822,276
- Issue date Sep 2, 2014
- Huawei Technologies Co., Ltd.
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 8,581,422
- Issue date Nov 12, 2013
- Toyota Jidosha Kabushiki Kaisha
- Masaki Aoshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single unit automated assembly of flex enhanced ball grid array pac...
- Patent number 6,759,752
- Issue date Jul 6, 2004
- ST Assembly Test Services Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting board
- Patent number 6,621,160
- Issue date Sep 16, 2003
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, manufacturing method of a lead frame, semiconductor dev...
- Patent number 6,563,202
- Issue date May 13, 2003
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,563,212
- Issue date May 13, 2003
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor devices, semiconductor device, circu...
- Patent number 6,555,200
- Issue date Apr 29, 2003
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single unit automated assembly of flex enhanced ball grid array pac...
- Patent number 6,544,812
- Issue date Apr 8, 2003
- ST Assembly Test Service Ltd.
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding layer method in a semiconductor device
- Patent number 6,436,733
- Issue date Aug 20, 2002
- Sony Corporation
- Masahiko Yukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof and mounting board
- Patent number 6,404,049
- Issue date Jun 11, 2002
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding layer in a semiconductor device
- Patent number 6,320,267
- Issue date Nov 20, 2001
- Sony Corporation
- Masahiko Yukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,300,168
- Issue date Oct 9, 2001
- Hayato Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and the manufacturing method
- Patent number 6,258,631
- Issue date Jul 10, 2001
- Sony Corporation
- Makoto Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit film utilizing a power supply and ground connections
- Patent number 6,118,178
- Issue date Sep 12, 2000
- Sony Corporation
- Hayato Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including chip housing, encapsulation and the...
- Patent number 6,114,755
- Issue date Sep 5, 2000
- Sony Corporation
- Makoto Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and the manufacturing method
- Patent number 6,104,091
- Issue date Aug 15, 2000
- Sony Corporation
- Makoto Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of fabricating the same, and electroni...
- Patent number 6,066,512
- Issue date May 23, 2000
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, manufacturing method of a lead frame, semiconductor dev...
- Patent number 6,051,450
- Issue date Apr 18, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,998,241
- Issue date Dec 7, 1999
- NEC Corporation
- Kouichirou Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method employing a palladium-p...
- Patent number 5,973,398
- Issue date Oct 26, 1999
- LSI Logic Corporation
- Larry L. Jacobsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switchable MCM CMOS I/O buffers
- Patent number 5,903,168
- Issue date May 11, 1999
- Industrial Technology Research Institiute
- Jyh-Ren Yang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic package with thermally conductive support member having...
- Patent number 5,773,884
- Issue date Jun 30, 1998
- International Business Machines Corporation
- Frank Edward Andros
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190189589
- Publication date Jun 20, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ha Yong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module
- Publication number 20130264721
- Publication date Oct 10, 2013
- INFINEON TECHNOLOGIES AG
- Stefan Landau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20130168845
- Publication date Jul 4, 2013
- Toyota Jidosha Kabushiki Kaisha
- Masaki AOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER
- Publication number 20120241959
- Publication date Sep 27, 2012
- Huawei Technologies Co., Ltd
- Leif Bergstedt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110186981
- Publication date Aug 4, 2011
- DENSO CORPORATION
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single unit automated assembly of flex enhanced ball grid array pac...
- Publication number 20030151148
- Publication date Aug 14, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE, AND SEMICONDUCTOR DEVICE...
- Publication number 20020149027
- Publication date Oct 17, 2002
- NORIYUKI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method thereof and mounting board
- Publication number 20020105070
- Publication date Aug 8, 2002
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method thereof and mounting board
- Publication number 20020066955
- Publication date Jun 6, 2002
- Hitachi, Ltd.
- Masanori Shibamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of fabricating the same, and electroni...
- Publication number 20020061609
- Publication date May 23, 2002
- NOBUAKI HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding layer method in a semiconductor device
- Publication number 20010031545
- Publication date Oct 18, 2001
- Masahiko Yukawa
- H01 - BASIC ELECTRIC ELEMENTS

Layer and TAB connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device packaging assembly, lead frame strip and unit...

Power electronics assembly having an adhesion layer, and method for...

Apparatus for the material-bonded connection of connection partners...

Fan-out semiconductor package

Semiconductor device packaging assembly, lead frame strip and unit...

Method for producing a switching device with a moisture-tight and e...

Lead frame strips with electrical isolation of die paddles

Semiconductor device with surface electrodes

Magnetic integration double-ended converter

Semiconductor module

Single unit automated assembly of flex enhanced ball grid array pac...

Semiconductor device and mounting board

Lead frame, manufacturing method of a lead frame, semiconductor dev...

Semiconductor device

Method of making semiconductor devices, semiconductor device, circu...

Single unit automated assembly of flex enhanced ball grid array pac...

Bonding layer method in a semiconductor device

Semiconductor device, manufacturing method thereof and mounting board

Bonding layer in a semiconductor device

Method of manufacturing a semiconductor device

Semiconductor package and the manufacturing method

Circuit film utilizing a power supply and ground connections

Semiconductor package including chip housing, encapsulation and the...

Semiconductor package and the manufacturing method

Semiconductor device, method of fabricating the same, and electroni...

Lead frame, manufacturing method of a lead frame, semiconductor dev...

Semiconductor device and method of manufacturing the same

Semiconductor device and fabrication method employing a palladium-p...

Switchable MCM CMOS I/O buffers

Electronic package with thermally conductive support member having...

Patents Applicationslast 30 patents

FAN-OUT SEMICONDUCTOR PACKAGE

Electronic Module

SEMICONDUCTOR MODULE

MAGNETIC INTEGRATION DOUBLE-ENDED CONVERTER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Single unit automated assembly of flex enhanced ball grid array pac...

SEMICONDUCTOR DEVICE AND ITS MANUFACTURE, AND SEMICONDUCTOR DEVICE...

Semiconductor device, manufacturing method thereof and mounting board

Semiconductor device, manufacturing method thereof and mounting board

Semiconductor device, method of fabricating the same, and electroni...

Bonding layer method in a semiconductor device