Layer connector larger than the underlying bonding area

Industry

CPC
H01L2224/29006

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29006Layer connector larger than the underlying bonding area

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a display panel with multiple pads
- Patent number 11,894,294
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Hanho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a dielectric layer edge covering cir...
- Patent number 11,410,897
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 11,004,742
- Issue date May 11, 2021
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,580,758
- Issue date Mar 3, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bonding pad
- Patent number 10,504,867
- Issue date Dec 10, 2019
- ABLIC Inc.
- Koichi Shimazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,446,455
- Issue date Oct 15, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of transferring micro devices
- Patent number 10,431,569
- Issue date Oct 1, 2019
- PlayNitride Inc.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,297,515
- Issue date May 21, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Adhesive film for semiconductor chip with through electrode
- Patent number 10,131,826
- Issue date Nov 20, 2018
- Sekisui Chemical Co., Ltd.
- Mai Nagata
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated optical inspection of unit specific patterning
- Patent number 10,056,304
- Issue date Aug 21, 2018
- Deca Technologies Inc.
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,037,976
- Issue date Jul 31, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package comprising photo sensitive fill between a...
- Patent number 10,037,941
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274501
- Publication date Aug 15, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20230387051
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STRUCTURE
- Publication number 20230260957
- Publication date Aug 17, 2023
- Advanced Semiconductor Engineering, Inc.
- Po-Jen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL
- Publication number 20220399317
- Publication date Dec 15, 2022
- Seoul Semiconductor Co., Ltd.
- Woo Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220392979
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Sang Duk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE, AND SUBSTRATE FOR MANUFACT...
- Publication number 20220336423
- Publication date Oct 20, 2022
- LG ELECTRONICS INC.
- Jungsub KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING MICRO-LEDS AND METHOD FOR MANUFACTURING SAME
- Publication number 20220320371
- Publication date Oct 6, 2022
- LG ELECTRONICS INC.
- Chilkeun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
- Publication number 20220238466
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE
- Publication number 20210265214
- Publication date Aug 26, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20210243894
- Publication date Aug 5, 2021
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Preform for Diffusion Soldering, Method for the Production t...
- Publication number 20200139490
- Publication date May 7, 2020
- SIEMENS AKTIENGESELLSCHAFT
- Jörg Strogies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE
- Publication number 20180269135
- Publication date Sep 20, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...
- Publication number 20180005997
- Publication date Jan 4, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20170352635
- Publication date Dec 7, 2017
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING
- Publication number 20170256466
- Publication date Sep 7, 2017
- DECA TECHNOLOGIES INC
- Craig Bishop
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR CHIP WITH THROUGH ELECTRODE
- Publication number 20170183548
- Publication date Jun 29, 2017
- Sekisui Chemical Co., Ltd
- Mai NAGATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170005024
- Publication date Jan 5, 2017
- SII Semiconductor Corporation
- Koichi SHIMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MODULE
- Publication number 20150262915
- Publication date Sep 17, 2015
- Kabushiki Kaisha Toshiba
- Miwako SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD
- Publication number 20140335660
- Publication date Nov 13, 2014
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACT...
- Publication number 20140312361
- Publication date Oct 23, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Kenji Ohtsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20140147695
- Publication date May 29, 2014
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Layer connector larger than the underlying bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structures of integrated circuit devices and method forming...

Methods and apparatus for an improved integrated circuit package

Selective transfer of micro devices

Fingerprint sensor and manufacturing method thereof

Bonding structures of integrated circuit devices and method forming...

Display apparatus including a display panel with multiple pads

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Semiconductor device and method for manufacturing the same

Selective micro device transfer to receiver substrate

Semiconductor structure having a dielectric layer edge covering cir...

Fingerprint sensor and manufacturing method thereof

Methods and apparatus for an improved integrated circuit package

Scalable package architecture and associated techniques and configu...

Semiconductor device having a bonding pad

Fingerprint sensor and manufacturing method thereof

Hermetically sealed MEMS device and its fabrication

Method of transferring micro devices

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Fingerprint sensor and manufacturing method thereof

Adhesive film for semiconductor chip with through electrode

Metallic particle paste, cured product using same, and semiconducto...

Automated optical inspection of unit specific patterning

Method for coating conductive substrate with adhesive

Scalable package architecture and associated techniques and configu...

Integrated device package comprising photo sensitive fill between a...

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF MICRO DEVICES

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

ELECTRONIC STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL

DISPLAY DEVICE

METHOD FOR MANUFACTURING DISPLAY DEVICE, AND SUBSTRATE FOR MANUFACT...

DISPLAY DEVICE USING MICRO-LEDS AND METHOD FOR MANUFACTURING SAME

Bonding Structures of Integrated Circuit Devices and Method Forming...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE

SELECTIVE TRANSFER OF MICRO DEVICES

Solder Preform for Diffusion Soldering, Method for the Production t...

METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE

SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...

BONDING STRUCTURE AND METHOD

AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING

ADHESIVE FILM FOR SEMICONDUCTOR CHIP WITH THROUGH ELECTRODE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MODULE

BONDING STRUCTURE AND METHOD

SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACT...

ELECTRONIC COMPONENT BONDING METHOD

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME