Layer connector smaller than the underlying bonding area

Industry

CPC
H01L2224/29007

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29007Layer connector smaller than the underlying bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive heat spreader and heat sink assembly for optical devices
- Patent number 10,937,671
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Fuad Elias Doany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,692,792
- Issue date Jun 23, 2020
- Denso Corporation
- Hirohito Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,446,455
- Issue date Oct 15, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,297,515
- Issue date May 21, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,269,753
- Issue date Apr 23, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method for connecting two wafers
- Patent number 10,134,707
- Issue date Nov 20, 2018
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Kai Zoschke
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin stack packages
- Patent number 9,985,002
- Issue date May 29, 2018
- SK hynix Inc.
- Sang Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic device package
- Patent number 9,771,259
- Issue date Sep 26, 2017
- Xintec Inc.
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin stack packages
- Patent number 9,721,924
- Issue date Aug 1, 2017
- SK hynix Inc.
- Sang Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded components and method of making...
- Patent number 9,601,435
- Issue date Mar 21, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame having a perimeter recess within periphery of component...
- Patent number 9,536,852
- Issue date Jan 3, 2017
- Intersil Americas LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chip affixed to substrate...
- Patent number 9,524,949
- Issue date Dec 20, 2016
- Dexerials Corporation
- Kazunori Hamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package structure
- Patent number 9,406,636
- Issue date Aug 2, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 9,385,103
- Issue date Jul 5, 2016
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,368,374
- Issue date Jun 14, 2016
- Dexerials Corporation
- Kazunori Hamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor MOSFET device with double substrate-side mul...
- Patent number 9,355,953
- Issue date May 31, 2016
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,324,684
- Issue date Apr 26, 2016
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 9,324,676
- Issue date Apr 26, 2016
- Micron Technology, Inc.
- See Hiong Leow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming thermal interface materi...
- Patent number 9,281,228
- Issue date Mar 8, 2016
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible stack packages, electronic systems including the same, and...
- Patent number 9,269,657
- Issue date Feb 23, 2016
- SK Hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, method of mounting semiconductor chip, and sol...
- Patent number 9,245,829
- Issue date Jan 26, 2016
- Omron Corporation
- Shintaro Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240387492
- Publication date Nov 21, 2024
- LG ELECTRONICS INC.
- Dohan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282657
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
- Publication number 20240222308
- Publication date Jul 4, 2024
- PIXART IMAGING Inc.
- SAI-MUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES
- Publication number 20240213156
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
- Publication number 20230299026
- Publication date Sep 21, 2023
- Magnachip Semiconductor, Ltd.
- Myungho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, THERMOSETTING SHEET, SEMICONDUCTOR...
- Publication number 20200172666
- Publication date Jun 4, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Yasuo FUKUHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140374926
- Publication date Dec 25, 2014
- Kabushiki Kaisha Toshiba
- Takeshi MIYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...
- Publication number 20140361427
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING WEIGHT
- Publication number 20140312102
- Publication date Oct 23, 2014
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME HAVING A PERIMETER RECESS WITHIN PERIPHERY OF COMPONENT...
- Publication number 20140175627
- Publication date Jun 26, 2014
- INTERSIL AMERICAS LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, METHOD OF MOUNTING SEMICONDUCTOR CHIP, AND SOL...
- Publication number 20140077375
- Publication date Mar 20, 2014
- Omron Corporation
- Shintaro Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING
- Publication number 20140042625
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...
- Publication number 20140008779
- Publication date Jan 9, 2014
- Omron Corporation
- Toshiaki Okuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ADJUSTING THE RECEIVE FREQUENCY OF AN RF RECEIVER DIE
- Publication number 20130309990
- Publication date Nov 21, 2013
- Telekom Malaysia Berhad
- Syahrizal SALLEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20130217182
- Publication date Aug 22, 2013
- Micron Technology, Inc.
- See Hiong Leow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Thermal Interface Materi...
- Publication number 20130105963
- Publication date May 2, 2013
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120280389
- Publication date Nov 8, 2012
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME AND A M...
- Publication number 20120146228
- Publication date Jun 14, 2012
- HITACHI YONEZAWA ELECTRONICS CO., LTD.
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20120104618
- Publication date May 3, 2012
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THROUGH ELECTRODES AND METHOD FOR MANUFA...
- Publication number 20120074529
- Publication date Mar 29, 2012
- Hynix Semiconductor Inc.
- Ki-Young KIM
- B82 - NANO-TECHNOLOGY
Information Patent Application
Semiconductor Device with Substrate-Side Exposed Device-Side Electr...
- Publication number 20110291245
- Publication date Dec 1, 2011
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Perforated Opening in Bo...
- Publication number 20110278712
- Publication date Nov 17, 2011
- STATS ChipPAC, Ltd.
- Junwei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110267796
- Publication date Nov 3, 2011
- Atsushi YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED RESIN CONFIGURATION
- Publication number 20110241221
- Publication date Oct 6, 2011
- SEIKO EPSON CORPORATION
- Yoshiharu OGATA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110237028
- Publication date Sep 29, 2011
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazunori Hamazaki
- H01 - BASIC ELECTRIC ELEMENTS

Layer connector smaller than the underlying bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fingerprint sensor and manufacturing method thereof

Bonding structures and methods for forming the same

Semiconductor device and method for manufacturing the same

Fingerprint sensor and manufacturing method thereof

Conductive heat spreader and heat sink assembly for optical devices

Electronic component device

Electronic device

Fingerprint sensor and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Semiconductor device and manufacturing method of semiconductor device

Semiconductor devices and methods of forming thereof

Bonding method for connecting two wafers

Method for coating conductive substrate with adhesive

Thin stack packages

Method for producing structured sintered connection layers, and sem...

Method for fabricating electronic device package

Thin stack packages

Semiconductor package with embedded components and method of making...

Lead frame having a perimeter recess within periphery of component...

Semiconductor device having semiconductor chip affixed to substrate...

Semiconductor devices and methods of forming thereof

Interposer package-on-package structure

Semiconductor device manufacturing method

Method of manufacturing semiconductor device

Vertical semiconductor MOSFET device with double substrate-side mul...

Semiconductor device and manufacturing method thereof

Packaged microelectronic devices and methods for manufacturing pack...

Semiconductor device and method of forming thermal interface materi...

Flexible stack packages, electronic systems including the same, and...

Substrate structure, method of mounting semiconductor chip, and sol...

Patents Applicationslast 30 patents

DISPLAY DEVICE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

THERMOSETTING RESIN COMPOSITION, THERMOSETTING SHEET, SEMICONDUCTOR...

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

SEMICONDUCTOR DEVICE

FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING WEIGHT

Method for Producing Structured Sintered Connection Layers, and Sem...

LEAD FRAME HAVING A PERIMETER RECESS WITHIN PERIPHERY OF COMPONENT...

SUBSTRATE STRUCTURE, METHOD OF MOUNTING SEMICONDUCTOR CHIP, AND SOL...

BONDING LAYER STRUCTURE AND METHOD FOR WAFER TO WAFER BONDING

WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...

METHOD OF ADJUSTING THE RECEIVE FREQUENCY OF AN RF RECEIVER DIE

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

Semiconductor Device and Method of Forming Thermal Interface Materi...

CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME AND A M...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

SEMICONDUCTOR PACKAGE WITH THROUGH ELECTRODES AND METHOD FOR MANUFA...

Semiconductor Device with Substrate-Side Exposed Device-Side Electr...

Semiconductor Device and Method of Forming Perforated Opening in Bo...

NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH IMPROVED RESIN CONFIGURATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE