Layer connectors formed on an encapsulation of the semiconductor or solid-state body

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H01L2224/28105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/28105Layer connectors formed on an encapsulation of the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package substrate and method of manufacturing semicon...
- Patent number 11,594,505
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Tae Ho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with separate electric and thermal paths
- Patent number 11,495,506
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a dielectric layer edge covering cir...
- Patent number 11,410,897
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate and method of manufacturing semicon...
- Patent number 11,114,397
- Issue date Sep 7, 2021
- Samsung Electronics Co., Ltd.
- Tae Ho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating package structure
- Patent number 10,879,197
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,580,758
- Issue date Mar 3, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,319,708
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Chip protection envelope and method
- Patent number 10,074,616
- Issue date Sep 11, 2018
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,037,976
- Issue date Jul 31, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,991,220
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Yoko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 9,881,911
- Issue date Jan 30, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 9,793,244
- Issue date Oct 17, 2017
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) structure including multiple dies
- Patent number 9,401,350
- Issue date Jul 26, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices, methods of fabricating the same, and se...
- Patent number 9,324,696
- Issue date Apr 26, 2016
- Samsung Electronics Co., Ltd.
- Mi-Na Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded electrical component surface interconnect
- Patent number 9,245,819
- Issue date Jan 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level package with thermal pad for higher power dissipation
- Patent number 8,552,540
- Issue date Oct 8, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PANEL-LEVEL PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240332240
- Publication date Oct 3, 2024
- JIANGSU PANGU SEMICONDUCTOR TECHNOLOGY CO., LTD
- Zhiyi XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20230052776
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING SEMICON...
- Publication number 20210375805
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Tae Ho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20210305112
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING SEMICON...
- Publication number 20200312801
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- Tae Ho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20190244948
- Publication date Aug 8, 2019
- STMicroelectronics S.r.l
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20180005912
- Publication date Jan 4, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...
- Publication number 20180005997
- Publication date Jan 4, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20170200693
- Publication date Jul 13, 2017
- Hamamatsu Photonics K.K.
- Yoshimaro FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Protection Envelope and Method
- Publication number 20170154856
- Publication date Jun 1, 2017
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160172265
- Publication date Jun 16, 2016
- J-DEVICES CORPORATION
- Kiyoaki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150380374
- Publication date Dec 31, 2015
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20130241025
- Publication date Sep 19, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Electrical Component Surface Interconnect
- Publication number 20130215583
- Publication date Aug 22, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH THERMAL PAD FOR HIGHER POWER DISSIPATION
- Publication number 20120286408
- Publication date Nov 15, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS

Layer connectors formed on an encapsulation of the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package substrate and method of manufacturing semicon...

Semiconductor package with separate electric and thermal paths

Semiconductor structure having a dielectric layer edge covering cir...

Semiconductor package substrate and method of manufacturing semicon...

Package structure and method of fabricating package structure

Electronic system having increased coupling by using horizontal and...

Scalable package architecture and associated techniques and configu...

Electronic system having increased coupling by using horizontal and...

Electronic system having increased coupling by using horizontal and...

Chip protection envelope and method

Scalable package architecture and associated techniques and configu...

Semiconductor device

Electronic system having increased coupling by using horizontal and...

Scalable package architecture and associated techniques and configu...

Package-on-package (POP) structure including multiple dies

Bump package and methods of formation thereof

Package-on-package devices, methods of fabricating the same, and se...

Embedded electrical component surface interconnect

Wafer level package with thermal pad for higher power dissipation

Patents Applicationslast 30 patents

PANEL-LEVEL PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING SEMICON...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING SEMICON...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...

SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...

ELECTRONIC COMPONENT

Chip Protection Envelope and Method

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

Bump Package and Methods of Formation Thereof

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

Embedded Electrical Component Surface Interconnect

WAFER LEVEL PACKAGE WITH THERMAL PAD FOR HIGHER POWER DISSIPATION