Layer connectors having different materials

Industry

CPC
H01L2224/33505

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/33505Layer connectors having different materials

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multi-color LED pixel unit with vertical li...
- Patent number 12,074,151
- Issue date Aug 27, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multi-color LED pixel unit with vertical li...
- Patent number 12,027,509
- Issue date Jul 2, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,855,067
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
- Patent number 11,817,418
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,694,960
- Issue date Jul 4, 2023
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,563,157
- Issue date Jan 24, 2023
- Au Optronics Corporation
- Hui-Yang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of heat sinks for a semiconductor package
- Patent number 11,515,237
- Issue date Nov 29, 2022
- Agency for Science, Technology and Research
- Gongyue Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,502,072
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,462,529
- Issue date Oct 4, 2022
- Samsung Display Co., Ltd.
- Jungpyo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor design for integrated magnetic devices
- Patent number 11,393,787
- Issue date Jul 19, 2022
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and power...
- Patent number 11,183,479
- Issue date Nov 23, 2021
- Mitsubishi Electric Corporation
- Shohei Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component having a buffer layer and method for producing a component
- Patent number 11,183,621
- Issue date Nov 23, 2021
- OSRAM OLED GmbH
- Paola Altieri-Weimar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,133,257
- Issue date Sep 28, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging structure
- Patent number 11,114,387
- Issue date Sep 7, 2021
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a metal silicide layer and methods...
- Patent number 11,063,014
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi layer thermal interface material
- Patent number 11,037,860
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor with external electrode
- Patent number 11,037,865
- Issue date Jun 15, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,991,676
- Issue date Apr 27, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having recessed adhesive layer between stacke...
- Patent number 10,930,613
- Issue date Feb 23, 2021
- Samsung Electronics Co., Ltd.
- Sang Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and dicing method
- Patent number 10,784,165
- Issue date Sep 22, 2020
- Kabushiki Kaisha Toshiba
- Shingo Masuko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical joint structure
- Patent number 10,763,232
- Issue date Sep 1, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer frame packages for integrated circuits having a magnetic...
- Patent number 10,643,954
- Issue date May 5, 2020
- EVERSPIN TECHNOLOGIES, INC.
- Angelo V. Ugge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with solders of different melting points and m...
- Patent number 10,622,285
- Issue date Apr 14, 2020
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,593,651
- Issue date Mar 17, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 10,475,745
- Issue date Nov 12, 2019
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for producing a device
- Patent number 10,431,715
- Issue date Oct 1, 2019
- Osram Opto Semiconductors GmbH
- Barbara Behr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polymer-assisted chip transfer
- Patent number 10,388,516
- Issue date Aug 20, 2019
- Facebook Technologies, LLC
- Oscar Torrents Abad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240282662
- Publication date Aug 22, 2024
- UT-Battelle, LLC
- Md Shajjad Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
- Publication number 20240213112
- Publication date Jun 27, 2024
- Global Unichip Corporation
- Sheng-Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240170473
- Publication date May 23, 2024
- Industrial Technology Research Institute
- Hao-Che Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240088123
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079366
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER
- Publication number 20240071977
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
- Publication number 20240038795
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
- Publication number 20240030180
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369278
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220392884
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20210398933
- Publication date Dec 23, 2021
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20210391517
- Publication date Dec 16, 2021
- AU OPTRONICS CORPORATION
- Hui-Yang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20210384129
- Publication date Dec 9, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH VERTICAL LI...
- Publication number 20210384181
- Publication date Dec 9, 2021
- Jade Bird Display (Shanghai) Limited
- Qunchao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20210327866
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20210225811
- Publication date Jul 22, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Can Housing a Semiconductor Die w...
- Publication number 20210159204
- Publication date May 27, 2021
- INFINEON TECHNOLOGIES AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI LAYER THERMAL INTERFACE MATERIAL
- Publication number 20200411411
- Publication date Dec 31, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20200212013
- Publication date Jul 2, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20200203261
- Publication date Jun 25, 2020
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200098719
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- Sang Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...
- Publication number 20200043887
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Shohei OGAWA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20200043852
- Publication date Feb 6, 2020
- Intel Corporation
- Yueli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...
- Publication number 20190371759
- Publication date Dec 5, 2019
- Hitachi Automotive Systems, Ltd.
- Takuya AOYAGI
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20190371765
- Publication date Dec 5, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including a Metal Silicide Layer and Methods...
- Publication number 20190355691
- Publication date Nov 21, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DICING METHOD
- Publication number 20190267288
- Publication date Aug 29, 2019
- Kabushiki Kaisha Toshiba
- Shingo Masuko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES
- Publication number 20190164934
- Publication date May 30, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS

Layer connectors having different materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bridge interconnection with layered interconnect structures

Systems and methods for multi-color LED pixel unit with vertical li...

Systems and methods for multi-color LED pixel unit with vertical li...

Electronic device and display device using the same

Integrated circuit package and method

Semiconductor device comprising a can housing a semiconductor die w...

Bridge interconnection with layered interconnect structures

Light-emitting device

Plurality of heat sinks for a semiconductor package

Integrated circuit package and method

Electronic apparatus

Conductor design for integrated magnetic devices

Semiconductor device, method for manufacturing the same, and power...

Component having a buffer layer and method for producing a component

Bridge interconnection with layered interconnect structures

Electronic packaging structure

Semiconductor devices including a metal silicide layer and methods...

Multi layer thermal interface material

Semiconductor with external electrode

Systems and methods for flash stacking

Semiconductor package having recessed adhesive layer between stacke...

Dam for three-dimensional integrated circuit

Semiconductor device and dicing method

Electrical joint structure

Multilayer frame packages for integrated circuits having a magnetic...

Semiconductor device with solders of different melting points and m...

Systems and methods for flash stacking

Bridge interconnection with layered interconnect structures

Device and method for producing a device

Method for polymer-assisted chip transfer

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

POWER MODULE

SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE

DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME

SEMICONDUCTOR DEVICE

Integrated Circuit Package and Method

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

LIGHT-EMITTING DEVICE

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH VERTICAL LI...

INTEGRATED CIRCUIT PACKAGE AND METHOD

SYSTEMS AND METHODS FOR FLASH STACKING

Semiconductor Device Comprising a Can Housing a Semiconductor Die w...

MULTI LAYER THERMAL INTERFACE MATERIAL

SYSTEMS AND METHODS FOR FLASH STACKING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER...

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...

SYSTEMS AND METHODS FOR FLASH STACKING

Semiconductor Devices Including a Metal Silicide Layer and Methods...

SEMICONDUCTOR DEVICE AND DICING METHOD

CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES