Layer connectors having different sizes

Industry

CPC
H01L2224/3303

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3303Layer connectors having different sizes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor apparatus
- Patent number 12,132,014
- Issue date Oct 29, 2024
- Hitachi, Ltd.
- Junpei Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,113,006
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 12,051,670
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor device including binding agent adhering an integrated...
- Patent number 11,929,345
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,854,783
- Issue date Dec 26, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,837,569
- Issue date Dec 5, 2023
- Kioxia Corporation
- Yoshiharu Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,694,960
- Issue date Jul 4, 2023
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having second connector that overlaps a part o...
- Patent number 11,688,711
- Issue date Jun 27, 2023
- Kabushiki Kaisha Toshiba
- Yoshiharu Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and methods of manufacturing the same
- Patent number 11,658,170
- Issue date May 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,574,861
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,538,896
- Issue date Dec 27, 2022
- Samsung Display Co., Ltd.
- Wontae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,462,529
- Issue date Oct 4, 2022
- Samsung Display Co., Ltd.
- Jungpyo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method with conductive film
- Patent number 11,417,627
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Jamyeong Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,282,818
- Issue date Mar 22, 2022
- Kioxia Corporation
- Toshimitsu Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having second connector that overlaps a part o...
- Patent number 11,195,814
- Issue date Dec 7, 2021
- Kabushiki Kaisha Toshiba
- Yoshiharu Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,195,741
- Issue date Dec 7, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 11,139,262
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,133,257
- Issue date Sep 28, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,879,209
- Issue date Dec 29, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line-integrated switch and method for producing a line-integrated s...
- Patent number 10,840,207
- Issue date Nov 17, 2020
- Auto-Kabel Management GmbH
- Simon Betscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and dicing method
- Patent number 10,784,165
- Issue date Sep 22, 2020
- Kabushiki Kaisha Toshiba
- Shingo Masuko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,770,428
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20240387441
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240371742
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312920
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Keunho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258188
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Shoji SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240250035
- Publication date Jul 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Se Hwan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240213165
- Publication date Jun 27, 2024
- PowerX Semiconductor Corporation
- Jing-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178082
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178083
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170456
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Seo Eun KYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170440
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Hwanyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240162195
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128248
- Publication date Apr 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120325
- Publication date Apr 11, 2024
- Powertech Technology Inc.
- Pei-chun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module having a double-sided heat dissipation structu...
- Publication number 20240096720
- Publication date Mar 21, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER
- Publication number 20240071977
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240047331
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240047333
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230335450
- Publication date Oct 19, 2023
- Fuji Electric Co., Ltd.
- Taisuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326835
- Publication date Oct 12, 2023
- NEXPERIA B.V.
- Hing Suan Cheam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PCB FOR TOPSIDE POWER DELIVERY
- Publication number 20230317706
- Publication date Oct 5, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING MODULE AND ELECTRONIC DEVICE
- Publication number 20230307428
- Publication date Sep 28, 2023
- Huawei Technologies Co., Ltd
- Zhongli JI
- H01 - BASIC ELECTRIC ELEMENTS

Layer connectors having different sizes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor apparatus

Bridge interconnection with layered interconnect structures

Semiconductor package

Non-conductive film sheet and semiconductor package including the same

Display device including connection pad part and electronic compone...

Use of pre-channeled materials for anisotropic conductors

Electronic device and display device using the same

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor device including binding agent adhering an integrated...

Die attached leveling control by metal stopper bumps

Micro device arrangement in donor substrate

Semiconductor device and manufacturing method thereof

Bridge interconnection with layered interconnect structures

Semiconductor device having second connector that overlaps a part o...

Semiconductor package structure and methods of manufacturing the same

Semiconductor package

Display device

Electronic apparatus

Micro LED display and manufacturing method with conductive film

Semiconductor device

Semiconductor device having second connector that overlaps a part o...

Micro device arrangement in donor substrate

Use of pre-channeled materials for anisotropic conductors

Bridge interconnection with layered interconnect structures

Encapsulated stress mitigation layer and power electronic assemblie...

Die stack assembly using an edge separation structure for connectiv...

Line-integrated switch and method for producing a line-integrated s...

Electronic component device

Semiconductor device and dicing method

Semiconductor device and method

Patents Applicationslast 30 patents

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

POWER MODULE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor module having a double-sided heat dissipation structu...

DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER

WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...

WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

SEMICONDUCTOR DEVICE

MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METAL PCB FOR TOPSIDE POWER DELIVERY

PACKAGING MODULE AND ELECTRONIC DEVICE