Layers comprising organo-silicon compounds

Industry

CPC
H01L21/3121

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3121Layers comprising organo-silicon compounds

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Spin-on spacer materials for double- and triple-patterning lithography
- Patent number 9,640,396
- Issue date May 2, 2017
- Brewer Science Inc.
- Qin Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Patternable dielectric film structure with improved lithography and...
- Patent number 9,484,248
- Issue date Nov 1, 2016
- GLOBALFOUNDRIES Inc.
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for forming resist underlayer film, and pattern-forming...
- Patent number 9,268,229
- Issue date Feb 23, 2016
- JSR Corporation
- Hiromitsu Tanaka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of manufacturing a semiconductor device having a porous, low...
- Patent number 9,224,593
- Issue date Dec 29, 2015
- Samsung Electronics Co., Ltd.
- Sang-Hoon Ahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric layer for an electronic device
- Patent number 8,994,016
- Issue date Mar 31, 2015
- Xerox Corporation
- Yiliang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective thin films for use during fabrication of semiconductors,...
- Patent number 8,987,029
- Issue date Mar 24, 2015
- Applied Microstructures, Inc.
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low k dielectric
- Patent number 8,932,702
- Issue date Jan 13, 2015
- SBA Materials, Inc.
- Mark L. F. Phillps
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Product of polysiloxane condensation
- Patent number 8,906,153
- Issue date Dec 9, 2014
- Asahi Kasei E-Materials Corporation
- Reiko Moriyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flowable film dielectric gap fill process
- Patent number 8,809,161
- Issue date Aug 19, 2014
- Novellus Systems, Inc.
- Vishal Gauri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High mechanical strength additives for porous ultra low-k material
- Patent number 8,736,014
- Issue date May 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Patternable dielectric film structure with improved lithography and...
- Patent number 8,618,663
- Issue date Dec 31, 2013
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, insulating film, protective film,...
- Patent number 8,604,113
- Issue date Dec 10, 2013
- Sumitomo Bakelite Co., Ltd.
- Hideyuki Toyoda
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Insulating film material, multilayer wiring board and production me...
- Patent number 8,580,907
- Issue date Nov 12, 2013
- Fujitsu Limited
- Yasushi Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods of modifying interlayer adhesion
- Patent number 8,569,166
- Issue date Oct 29, 2013
- Applied Materials, Inc.
- Francimar Campana Schmitt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dielectric layer for an electronic device
- Patent number 8,513,650
- Issue date Aug 20, 2013
- Xerox Corporation
- Yiliang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple patterning using improved patternable low-κ dielectric mat...
- Patent number 8,487,411
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Qinghuang Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flowable film dielectric gap fill process
- Patent number 8,481,403
- Issue date Jul 9, 2013
- Novellus Systems, Inc.
- Vishal Gauri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Patternable low-K dielectric interconnect structure with a graded c...
- Patent number 8,461,039
- Issue date Jun 11, 2013
- International Business Machines Corporation
- Qinghuang Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing silicic coating, silicic coating and semicond...
- Patent number 8,431,464
- Issue date Apr 30, 2013
- Fujitsu Limited
- Yasushi Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Selectively self-assembling oxygen diffusion barrier
- Patent number 8,410,559
- Issue date Apr 2, 2013
- International Business Machines Corporation
- Zhengwen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasing and post-releasing processes in fabrications for micromir...
- Patent number 8,395,837
- Issue date Mar 12, 2013
- Texas Instruments Incorporated
- Hongqin Shi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nanoporous media with lamellar structures
- Patent number 8,389,589
- Issue date Mar 5, 2013
- International Business Machines Corporation
- Jennifer Nam Cha
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for forming silicon-containing materials during a photoexcit...
- Patent number 8,387,557
- Issue date Mar 5, 2013
- Applied Materials
- Kaushal K. Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnection substrate having first and second insulating films...
- Patent number 8,390,099
- Issue date Mar 5, 2013
- Fujitsu Limited
- Shirou Ozaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of etching organosiloxane dielectric material and semiconduc...
- Patent number 8,383,520
- Issue date Feb 26, 2013
- Arizona Board of Regents, a body corporate of the State of Arizona, acting fo...
- Michael Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,378,489
- Issue date Feb 19, 2013
- Fujitsu Limited
- Shiro Ozaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and system for using ion implantation for treating a low-k d...
- Patent number 8,372,760
- Issue date Feb 12, 2013
- Tokyo Electron Limited
- Kenneth Duerksen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Borazine-based resin, process for its production, borazine-based re...
- Patent number 8,362,199
- Issue date Jan 29, 2013
- Hitachi Chemical Co., Ltd.
- Hiroshi Matsutani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Insulating film, process for producing the same and electronic devi...
- Patent number 8,216,647
- Issue date Jul 10, 2012
- FUJIFILM Corporation
- Yutaka Adegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon compound, ultraviolet absorbent, method for manufacturing m...
- Patent number 8,207,059
- Issue date Jun 26, 2012
- Fujitsu Limited
- Shirou Ozaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
FLOWABLE FILM DIELECTRIC GAP FILL PROCESS
- Publication number 20140017904
- Publication date Jan 16, 2014
- Vishal GAURI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIELECTRIC LAYER FOR AN ELECTRONIC DEVICE
- Publication number 20130331512
- Publication date Dec 12, 2013
- Xerox Corporation
- Yiliang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND PATTERN-FORMING...
- Publication number 20130256264
- Publication date Oct 3, 2013
- JSR Corporation
- Hiromitsu TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED C...
- Publication number 20120252204
- Publication date Oct 4, 2012
- International Business Machines Corporation
- Qinghuang Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Releasing and post-releasing processes in fabrications for micromir...
- Publication number 20120184067
- Publication date Jul 19, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Hongqin Shi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Manufacturing a Semiconductor Device Having a Porous, Low...
- Publication number 20120178253
- Publication date Jul 12, 2012
- Sang-Hoon Ahn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MAT...
- Publication number 20120161296
- Publication date Jun 28, 2012
- International Business Machines Corporation
- Qinghuang Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRODUCT OF POLYSILOXANE CONDENSATION
- Publication number 20120100298
- Publication date Apr 26, 2012
- Reiko Moriyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROTECTIVE THIN FILMS FOR USE DURING FABRICATION OF SEMICONDUCTORS,...
- Publication number 20120045884
- Publication date Feb 23, 2012
- Jeffrey Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE PACKAGE AND A METHOD FOR MANUFACTURING THE DIE PACKAGE
- Publication number 20110316117
- Publication date Dec 29, 2011
- Agency For Science, Technology and Research
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BORAZINE-BASED RESIN, PROCESS FOR ITS PRODUCTION, BORAZINE-BASED RE...
- Publication number 20110313122
- Publication date Dec 22, 2011
- Hiroshi MATSUTANI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PATTERNABLE DIELECTRIC FILM STRUCTURE WITH IMPROVED LITHOGRAPHY AND...
- Publication number 20110312177
- Publication date Dec 22, 2011
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MODIFYING INTERLAYER ADHESION
- Publication number 20110237085
- Publication date Sep 29, 2011
- FRANCIMAR CAMPANA SCHMITT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF ETCHING ORGANOSILOXANE DIELECTRIC MATERIAL AND SEMICONDUC...
- Publication number 20110230047
- Publication date Sep 22, 2011
- Arizona Board of Regents, for and on behalf of Arizona State University
- MICHAEL MARRS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED CAP BARRIER IN MICROELECTRONIC INTERCONNECT STRUCTURES
- Publication number 20110226981
- Publication date Sep 22, 2011
- International Business Machines Corporation
- Jeffrey C. Hedrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110215384
- Publication date Sep 8, 2011
- NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY
- Tadahiro Ohmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED STRUCTURES COMPRISING SILICON CARBIDE LAYERS, A PROCESS FOR...
- Publication number 20110204382
- Publication date Aug 25, 2011
- BASE SE
- Alexander Traut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW K DIELECTRIC
- Publication number 20110135847
- Publication date Jun 9, 2011
- Mark L. F. Phillps
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER INSULATING FILM, WIRING STRUCTURE, AND METHODS OF MANUFA...
- Publication number 20110127075
- Publication date Jun 2, 2011
- NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY
- Tadahiro Ohmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING COMPOSITION AND PATTERN FORMING METHOD
- Publication number 20110117746
- Publication date May 19, 2011
- Nissan Chemical Industries, Ltd.
- Daisuke Maruyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED C...
- Publication number 20110074044
- Publication date Mar 31, 2011
- International Business Machines Corporation
- Qinghuang Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MAKING POROUS MATERIALS AND POROUS MATERIALS PREPARED THE...
- Publication number 20110076416
- Publication date Mar 31, 2011
- BASF SE
- Andreas Klipp
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MAT...
- Publication number 20110042790
- Publication date Feb 24, 2011
- International Business Machines Corporation
- Qinghuang Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SACRIFICIAL INORGANIC POLYMER INTERMETAL DIELECTRIC DAMASCENE WIRE...
- Publication number 20110042826
- Publication date Feb 24, 2011
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING FILM, PROCESS FOR PRODUCING THE SAME AND ELECTRONIC DEVI...
- Publication number 20110039037
- Publication date Feb 17, 2011
- FUJIFILM CORPORATION
- Yutaka ADEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANOSILANE POLYMERS, HARDMASK COMPOSITIONS INCLUDING THE SAME AND...
- Publication number 20100320573
- Publication date Dec 23, 2010
- Dong Seon Uh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTERCONNECTION SUBSTRATE, SEMICONDUCTOR DEVICE, AND PRODUCTION MET...
- Publication number 20100320618
- Publication date Dec 23, 2010
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC LAYER FOR AN ELECTRONIC DEVICE
- Publication number 20100301344
- Publication date Dec 2, 2010
- Xerox Corporation
- Yiliang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR OXIDE FILM FORMATION AND APPARATUS FOR THE METHOD
- Publication number 20100255684
- Publication date Oct 7, 2010
- MEIDENSHA CORPORATION
- Tetsuya Nishiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVELY SELF-ASSEMBLING OXYGEN DIFFUSION BARRIER
- Publication number 20100237442
- Publication date Sep 23, 2010
- International Business Machines Corporation
- ZHENGWEN LI
- H01 - BASIC ELECTRIC ELEMENTS

Layers comprising organo-silicon compounds

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Spin-on spacer materials for double- and triple-patterning lithography

Patternable dielectric film structure with improved lithography and...

Composition for forming resist underlayer film, and pattern-forming...

Method of manufacturing a semiconductor device having a porous, low...

Dielectric layer for an electronic device

Protective thin films for use during fabrication of semiconductors,...

Low k dielectric

Product of polysiloxane condensation

Flowable film dielectric gap fill process

High mechanical strength additives for porous ultra low-k material

Patternable dielectric film structure with improved lithography and...

Photosensitive resin composition, insulating film, protective film,...

Insulating film material, multilayer wiring board and production me...

Methods of modifying interlayer adhesion

Dielectric layer for an electronic device

Multiple patterning using improved patternable low-κ dielectric mat...

Flowable film dielectric gap fill process

Patternable low-K dielectric interconnect structure with a graded c...

Process for producing silicic coating, silicic coating and semicond...

Selectively self-assembling oxygen diffusion barrier

Releasing and post-releasing processes in fabrications for micromir...

Nanoporous media with lamellar structures

Method for forming silicon-containing materials during a photoexcit...

Interconnection substrate having first and second insulating films...

Method of etching organosiloxane dielectric material and semiconduc...

Semiconductor device and manufacturing method therefor

Method and system for using ion implantation for treating a low-k d...

Borazine-based resin, process for its production, borazine-based re...

Insulating film, process for producing the same and electronic devi...

Silicon compound, ultraviolet absorbent, method for manufacturing m...

Patents Applicationslast 30 patents

FLOWABLE FILM DIELECTRIC GAP FILL PROCESS

DIELECTRIC LAYER FOR AN ELECTRONIC DEVICE

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, AND PATTERN-FORMING...

PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED C...

Releasing and post-releasing processes in fabrications for micromir...

Method of Manufacturing a Semiconductor Device Having a Porous, Low...

MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MAT...

PRODUCT OF POLYSILOXANE CONDENSATION

PROTECTIVE THIN FILMS FOR USE DURING FABRICATION OF SEMICONDUCTORS,...

DIE PACKAGE AND A METHOD FOR MANUFACTURING THE DIE PACKAGE

BORAZINE-BASED RESIN, PROCESS FOR ITS PRODUCTION, BORAZINE-BASED RE...

PATTERNABLE DIELECTRIC FILM STRUCTURE WITH IMPROVED LITHOGRAPHY AND...

METHODS OF MODIFYING INTERLAYER ADHESION

METHOD OF ETCHING ORGANOSILOXANE DIELECTRIC MATERIAL AND SEMICONDUC...

MULTILAYERED CAP BARRIER IN MICROELECTRONIC INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

LAYERED STRUCTURES COMPRISING SILICON CARBIDE LAYERS, A PROCESS FOR...

LOW K DIELECTRIC

INTERLAYER INSULATING FILM, WIRING STRUCTURE, AND METHODS OF MANUFA...

COATING COMPOSITION AND PATTERN FORMING METHOD

PATTERNABLE LOW-K DIELECTRIC INTERCONNECT STRUCTURE WITH A GRADED C...

METHOD OF MAKING POROUS MATERIALS AND POROUS MATERIALS PREPARED THE...

MULTIPLE PATTERNING USING IMPROVED PATTERNABLE LOW-k DIELECTRIC MAT...

SACRIFICIAL INORGANIC POLYMER INTERMETAL DIELECTRIC DAMASCENE WIRE...

INSULATING FILM, PROCESS FOR PRODUCING THE SAME AND ELECTRONIC DEVI...

ORGANOSILANE POLYMERS, HARDMASK COMPOSITIONS INCLUDING THE SAME AND...

INTERCONNECTION SUBSTRATE, SEMICONDUCTOR DEVICE, AND PRODUCTION MET...

DIELECTRIC LAYER FOR AN ELECTRONIC DEVICE

METHOD FOR OXIDE FILM FORMATION AND APPARATUS FOR THE METHOD

SELECTIVELY SELF-ASSEMBLING OXYGEN DIFFUSION BARRIER