Layout of power planes, ground planes or power supply conductors

Industry

CPC
H05K2201/093

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/093Layout of power planes, ground planes or power supply conductors

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Flexible printed circuit board assembly and electronic device inclu...
- Patent number 12,349,271
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Bumhee Bae
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connectors for linear lighting
- Patent number 12,345,398
- Issue date Jul 1, 2025
- Elemental LED, Inc.
- Kenneth A. Afan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost, low loss material for microwave or antenna printed circui...
- Patent number 12,347,927
- Issue date Jul 1, 2025
- Hughes Network Systems, L.L.C.
- Bingqian Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and display device including the same
- Patent number 12,328,815
- Issue date Jun 10, 2025
- Samsung Display Co., Ltd.
- Youngjin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and a display device including the same
- Patent number 12,324,107
- Issue date Jun 3, 2025
- Samsung Display Co., Ltd.
- Hyo-Chul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board-level pad pattern for multi-row QFN packages
- Patent number 12,309,921
- Issue date May 20, 2025
- Mediatek Inc.
- Hui-Chi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder stop feature for electronic devices
- Patent number 12,300,643
- Issue date May 13, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal processing board and image forming apparatus
- Patent number 12,295,093
- Issue date May 6, 2025
- Kyocera Document Solutions Inc.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for nanoplasma switches
- Patent number 12,267,940
- Issue date Apr 1, 2025
- Analog Devices International Unlimited Company
- Romulo Maggay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure
- Patent number 12,262,497
- Issue date Mar 25, 2025
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Illuminating circuit structure
- Patent number 12,259,112
- Issue date Mar 25, 2025
- Darfon Electronics Corp.
- Hsin-Cheng Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid boards with embedded planes
- Patent number 12,256,487
- Issue date Mar 18, 2025
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting substrate, electronic component mount...
- Patent number 12,256,491
- Issue date Mar 18, 2025
- Sony Group Corporation
- Koji Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising interposer
- Patent number 12,245,374
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
EMC filter for a control device
- Patent number 12,245,362
- Issue date Mar 4, 2025
- Robert Bosch GmbH
- Rupert Fackler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including flexible printed circuit board
- Patent number 12,213,246
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Seonghun Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 12,213,294
- Issue date Jan 28, 2025
- Hitachi Astemo, Ltd.
- Masahiro Toyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery module printed circuit board assembly system and method
- Patent number 12,208,694
- Issue date Jan 28, 2025
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
CPU for heatsink based power delivery
- Patent number 12,213,252
- Issue date Jan 28, 2025
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overlap joint flex circuit board interconnection
- Patent number 12,207,407
- Issue date Jan 21, 2025
- Google LLC
- John Martinis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detection device
- Patent number 12,193,165
- Issue date Jan 7, 2025
- Japan Display Inc.
- Koji Ishizaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit assemblies including metallic bars
- Patent number 12,185,454
- Issue date Dec 31, 2024
- Maxim Integrated Products, Inc.
- Alexandr Ikriannikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a flexible electronics assembly
- Patent number 12,177,968
- Issue date Dec 24, 2024
- The Boeing Company
- John E. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Skin care device providing micro current to a mask for promoting pr...
- Patent number 12,161,866
- Issue date Dec 10, 2024
- N&B LAB CO., LTD.
- Kwang Suk Hwang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency filter
- Patent number 12,160,217
- Issue date Dec 3, 2024
- Mitsubishi Electric Corporation
- Motomi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 12,160,945
- Issue date Dec 3, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switching power supply including wiring layer
- Patent number 12,149,171
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Yutaka Mimino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE
- Publication number 20250233092
- Publication date Jul 17, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD
- Publication number 20250220807
- Publication date Jul 3, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GROUNDING OPTIMIZATION FOR UNSHIELDED DATA CONNECTIONS
- Publication number 20250203754
- Publication date Jun 19, 2025
- Marvell Asia Pte Ltd.
- Shaowu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20250185165
- Publication date Jun 5, 2025
- AOI ELECTRONICS CO., LTD.
- Takashi SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250176103
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sanghyeok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC APPARATUS
- Publication number 20250158323
- Publication date May 15, 2025
- LENOVO (SINGAPORE) PTE. LTD.
- Fumitake Mizoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, MEMORY MODULE INCLUDING THE SAME, AND METHOD...
- Publication number 20250159808
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Youngbong HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151191
- Publication date May 8, 2025
- Dell Products L.P.
- Earl BOONE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER METHOD FOR HIGHER CURRENT ASIC POWER DELIVERY
- Publication number 20250151198
- Publication date May 8, 2025
- Cisco Technology, Inc.
- Joel Richard Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PER LAYER ANTI-PAD STRUCTURE FOR BALL GRID ARRAY PRINTED CIRCUIT BO...
- Publication number 20250142716
- Publication date May 1, 2025
- Astera Labs, Inc.
- Long YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION DEVICE
- Publication number 20250142733
- Publication date May 1, 2025
- Japan Display Inc.
- Koji ISHIZAKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD
- Publication number 20250125269
- Publication date Apr 17, 2025
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
- Publication number 20250106998
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- TAKASHI NUMAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTING NODE AND COMPUTING DEVICE
- Publication number 20250089169
- Publication date Mar 13, 2025
- xFusion Digital Technologies Co., Ltd
- Guoqiang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE
- Publication number 20250079284
- Publication date Mar 6, 2025
- KYOCERA CORPORATION
- Shigenori TAKAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMPENING GOLD FINGER RESONANCE
- Publication number 20250048547
- Publication date Feb 6, 2025
- Dell Products L.P.
- Arun Chada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core Resonance Suppression in Signal Integrity Optimized Package
- Publication number 20250048535
- Publication date Feb 6, 2025
- Avago Technologies International Sales Pte. Limited
- Kun Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250040042
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- Hae Sik KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD
- Publication number 20250031300
- Publication date Jan 23, 2025
- Cisco Technology, Inc.
- Mike Sapozhnikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS
- Publication number 20250024590
- Publication date Jan 16, 2025
- Smith & Nephew PLC
- Ben Alan Askem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE AUTOMOTIVE GRADE LIGHT SOURCE
- Publication number 20250024597
- Publication date Jan 16, 2025
- Lumileds LLC
- Christian KLEIJNEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE
- Publication number 20250018798
- Publication date Jan 16, 2025
- CPS Technology Holdings LLC
- Matthew R. TYLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250016917
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT HEIGHT ADJUSTMENT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20250008650
- Publication date Jan 2, 2025
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- CLINTON LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431030
- Publication date Dec 26, 2024
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND CIRCUIT BOARD
- Publication number 20240422913
- Publication date Dec 19, 2024
- Murata Manufacturing Co., Ltd.
- Ryutatsu MIZUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES
- Publication number 20240422895
- Publication date Dec 19, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Layout of power planes, ground planes or power supply conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible printed circuit board assembly and electronic device inclu...

Connectors for linear lighting

Low cost, low loss material for microwave or antenna printed circui...

Circuit board and display device including the same

Circuit board and a display device including the same

Mating backplane for high speed, high density electrical connector

Board-level pad pattern for multi-row QFN packages

Solder stop feature for electronic devices

Signal processing board and image forming apparatus

Apparatus and methods for nanoplasma switches

Circuit structure

Illuminating circuit structure

Hybrid boards with embedded planes

Electronic component mounting substrate, electronic component mount...

Electronic device comprising interposer

EMC filter for a control device

Electronic device including flexible printed circuit board

Electronic control device

Battery module printed circuit board assembly system and method

CPU for heatsink based power delivery

Overlap joint flex circuit board interconnection

Detection device

Circuit assemblies including metallic bars

Method of forming a flexible electronics assembly

Skin care device providing micro current to a mask for promoting pr...

Providing a lower inductance path in a routing substrate for a capa...

High frequency filter

Heatsink based power delivery for CPUs

Switching power supply including wiring layer

Bus bar link for battery cell interconnections in a battery module

Patents Applicationslast 30 patents

ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE

TEST PAD

GROUNDING OPTIMIZATION FOR UNSHIELDED DATA CONNECTIONS

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR PACKAGE

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND ELECTRONIC APPARATUS

PRINTED CIRCUIT BOARD, MEMORY MODULE INCLUDING THE SAME, AND METHOD...

DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

POWER METHOD FOR HIGHER CURRENT ASIC POWER DELIVERY

PER LAYER ANTI-PAD STRUCTURE FOR BALL GRID ARRAY PRINTED CIRCUIT BO...

DETECTION DEVICE

CIRCUIT BOARD

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...

COMPUTING NODE AND COMPUTING DEVICE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE

DAMPENING GOLD FINGER RESONANCE

Core Resonance Suppression in Signal Integrity Optimized Package

CIRCUIT BOARD

VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD

PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS

FLEXIBLE AUTOMOTIVE GRADE LIGHT SOURCE

BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE

PRINTED CIRCUIT BOARD

CONTACT HEIGHT ADJUSTMENT STRUCTURE OF FLEXIBLE CIRCUIT BOARD

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

CIRCUIT MODULE AND CIRCUIT BOARD

STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES