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TEST PAD
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Publication number 20250220807
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Publication date Jul 3, 2025
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Chipbond Technology Corporation
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Kung-Tzu Tu
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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SEMICONDUCTOR PACKAGE
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Publication number 20250183186
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Publication date Jun 5, 2025
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Samsung Electronics Co., Ltd.
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Sungoh Ahn
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H01 - BASIC ELECTRIC ELEMENTS
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DETECTION DEVICE
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Publication number 20250142733
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Publication date May 1, 2025
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Japan Display Inc.
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Koji ISHIZAKI
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G06 - COMPUTING CALCULATING COUNTING
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CIRCUIT BOARD
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Publication number 20250125269
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Publication date Apr 17, 2025
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LG Innotek Co., Ltd.
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Se Woong NA
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H01 - BASIC ELECTRIC ELEMENTS
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COMPUTING NODE AND COMPUTING DEVICE
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Publication number 20250089169
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Publication date Mar 13, 2025
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xFusion Digital Technologies Co., Ltd
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Guoqiang Liu
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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DAMPENING GOLD FINGER RESONANCE
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Publication number 20250048547
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Publication date Feb 6, 2025
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Dell Products L.P.
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Arun Chada
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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CIRCUIT BOARD
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Publication number 20250040042
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Publication date Jan 30, 2025
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LG Innotek Co., Ltd.
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Hae Sik KIM
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD
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Publication number 20250031300
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Publication date Jan 23, 2025
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Cisco Technology, Inc.
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Mike Sapozhnikov
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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PRINTED CIRCUIT BOARD
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Publication number 20250016917
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Publication date Jan 9, 2025
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Samsung Electro-Mechanics Co., Ltd.
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Jin Uk LEE
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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PRINTED WIRING BOARD
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Publication number 20240431030
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Publication date Dec 26, 2024
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SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
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Michi OGATA
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H01 - BASIC ELECTRIC ELEMENTS
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CIRCUIT MODULE AND CIRCUIT BOARD
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Publication number 20240422913
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Publication date Dec 19, 2024
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Murata Manufacturing Co., Ltd.
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Ryutatsu MIZUKAMI
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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