Layout of power planes, ground planes or power supply conductors

Industry

CPC
H05K2201/093

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/093Layout of power planes, ground planes or power supply conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 11,982,704
- Issue date May 14, 2024
- E Ink Holdings Inc.
- Ruei-Huan Rao
- G01 - MEASURING TESTING
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for circuit interconnects
- Patent number 11,937,368
- Issue date Mar 19, 2024
- OpenLight Photonics, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including flexible printed circuit board
- Patent number 11,930,592
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Seonghun Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 11,924,959
- Issue date Mar 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for galvanic effect reduction
- Patent number 11,924,964
- Issue date Mar 5, 2024
- Western Digital Technologies, Inc.
- Lin Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-interference circuit board and terminal
- Patent number 11,903,122
- Issue date Feb 13, 2024
- Huawei Technologies Co., Ltd.
- Dong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed wiring board, joined body, pressure sensor and mas...
- Patent number 11,895,776
- Issue date Feb 6, 2024
- Hitachi Metals, Ltd.
- Takahiro Umeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging module and imaging device
- Patent number 11,877,728
- Issue date Jan 23, 2024
- Canon Kabushiki Kaisha
- Takahiro Furuya
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Inductor component and inductor component mounting substrate
- Patent number 11,869,688
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Rikiya Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnection structure of a multi-layer substrate
- Patent number 11,864,315
- Issue date Jan 2, 2024
- Mediatek Inc.
- Yi-Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection device
- Patent number 11,818,848
- Issue date Nov 14, 2023
- Japan Display Inc.
- Koji Ishizaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Breakout structure for an integrated circuit device
- Patent number 11,812,544
- Issue date Nov 7, 2023
- Xilinx, Inc.
- Shad Shepston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection of electronics in negative pressure wound therapy systems
- Patent number 11,800,638
- Issue date Oct 24, 2023
- Smith & Nephew PLC
- Ben Alan Askem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 11,798,875
- Issue date Oct 24, 2023
- Innolux Corporation
- Chung-Chun Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reference metal layer for setting the impedance of metal contacts o...
- Patent number 11,800,637
- Issue date Oct 24, 2023
- Super Micro Computer, Inc.
- Manhtien V. Phan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector attached multi-conductor cable
- Patent number 11,784,438
- Issue date Oct 10, 2023
- Sumitomo Electric Industries, Ltd.
- Naoshige Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device for measuring current in electrical circuit
- Patent number 11,785,708
- Issue date Oct 10, 2023
- Keysight Technologies, Inc.
- Ryo Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless power transmitter and wireless power receiver including mu...
- Patent number 11,777,341
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Chong-Min Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Axial field rotary energy device having PCB stator with non-linear...
- Patent number 11,777,354
- Issue date Oct 3, 2023
- Infinitum Electric, Inc.
- Paulo Guedes-Pinto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic card comprising a first ground plane and a second ground...
- Patent number 11,751,324
- Issue date Sep 5, 2023
- SAFRAN ELECTRONICS & DEFENSE
- Thierry Segond
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overlap joint flex circuit board mating
- Patent number 11,751,333
- Issue date Sep 5, 2023
- Google LLC
- John Martinis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective ground flood around reduced land pad on package base laye...
- Patent number 11,737,227
- Issue date Aug 22, 2023
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern-edged metal-plane resonance-suppression
- Patent number 11,729,900
- Issue date Aug 15, 2023
- Intel Corporation
- Stephen Harvey Hall
- G05 - CONTROLLING REGULATING
Information Patent Grant
Axial field rotary energy device with segmented PCB stator having t...
- Patent number 11,710,995
- Issue date Jul 25, 2023
- Infinitum Electric, Inc.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,696,399
- Issue date Jul 4, 2023
- ZTE Corporation
- Changgang Yin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,690,174
- Issue date Jun 27, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and electronic device including same
- Patent number 11,690,167
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Flexible Printed Wiring Board and Method for Manufacturing Same
- Publication number 20240155763
- Publication date May 9, 2024
- Nippon Mektron, Ltd.
- Yoshihiko Narisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING ARRANGEMENT
- Publication number 20240155766
- Publication date May 9, 2024
- ROBERT BOSCH GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20240147621
- Publication date May 2, 2024
- Hitachi Astemo, Ltd.
- Narutoshi YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240136294
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE
- Publication number 20240136740
- Publication date Apr 25, 2024
- NIPPON MEKTRON, LTD.
- Shuzo YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240130033
- Publication date Apr 18, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240130042
- Publication date Apr 18, 2024
- Murata Manufacturing Co., Ltd.
- Kumiko ISHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240114620
- Publication date Apr 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS
- Publication number 20240107661
- Publication date Mar 28, 2024
- KYOCERA DOCUMENT SOLUTIONS INC.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...
- Publication number 20240107665
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND PAD CONNECTOR FOR SECURING AN ELECTRONIC COMPONENT THEREON
- Publication number 20240098895
- Publication date Mar 21, 2024
- Jabil Inc.
- Lun Hao Tung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098896
- Publication date Mar 21, 2024
- PanelSemi Corporation
- Chin-Tang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240098912
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Jinhwan JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240090128
- Publication date Mar 14, 2024
- Nitto Denko Corporation
- Yusaku TAMAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS
- Publication number 20240080969
- Publication date Mar 7, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD
- Publication number 20240074034
- Publication date Feb 29, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME
- Publication number 20240074058
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- JAEKWANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING PAD STRUCTURE
- Publication number 20240049387
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Hansu CHEON
- G04 - HOROLOGY
Information Patent Application
Overlap Joint Flex Circuit Board Interconnection
- Publication number 20240049392
- Publication date Feb 8, 2024
- Google LLC
- John Martinis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240040695
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Tomoya OOSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DC-DC STEP UP CONVERTER SYSTEMS AND METHODS
- Publication number 20240030818
- Publication date Jan 25, 2024
- Tiger Tool International Incorporated
- Michael Andrews
- B60 - VEHICLES IN GENERAL
Information Patent Application
LIGHT EMITTING DEVICE AND KEYBOARD STRUCTURE
- Publication number 20240028134
- Publication date Jan 25, 2024
- Lite-On Technology Corporation
- SHAN-HUI CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND A DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20240015897
- Publication date Jan 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYO-CHUL LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240006295
- Publication date Jan 4, 2024
- InnoLux Corporation
- Chung-Chun CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE...
- Publication number 20230422398
- Publication date Dec 28, 2023
- Global Unichip Corporation
- Chih-Chieh LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD FOR ANTENNA, ANTENNA PACKAGE INCLUDING THE SAME AND I...
- Publication number 20230422409
- Publication date Dec 28, 2023
- DONGWOO FINE-CHEM CO., LTD.
- Dae Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230413425
- Publication date Dec 21, 2023
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20230380059
- Publication date Nov 23, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD
- Publication number 20230380075
- Publication date Nov 23, 2023
- Murata Manufacturing Co., Ltd.
- Kenji MATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Control Device
- Publication number 20230380068
- Publication date Nov 23, 2023
- Hitachi Astemo, Ltd.
- Takeshi IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS

Layout of power planes, ground planes or power supply conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Array substrate and method of mounting integrated circuit using the...

Mating backplane for high speed, high density electrical connector

Structure for circuit interconnects

Electronic device including flexible printed circuit board

Heatsink based power delivery for CPUs

Printed circuit board for galvanic effect reduction

Edge connector, circuit board, and connector component

Anti-interference circuit board and terminal

Flexible printed wiring board, joined body, pressure sensor and mas...

Imaging module and imaging device

Inductor component and inductor component mounting substrate

Vertical interconnection structure of a multi-layer substrate

Detection device

Breakout structure for an integrated circuit device

Protection of electronics in negative pressure wound therapy systems

Electronic device and manufacturing method thereof

Reference metal layer for setting the impedance of metal contacts o...

Connector attached multi-conductor cable

Sensor device for measuring current in electrical circuit

Wireless power transmitter and wireless power receiver including mu...

Axial field rotary energy device having PCB stator with non-linear...

Electronic card comprising a first ground plane and a second ground...

Overlap joint flex circuit board mating

Selective ground flood around reduced land pad on package base laye...

Pattern-edged metal-plane resonance-suppression

Axial field rotary energy device with segmented PCB stator having t...

Circuit board

Display device and manufacturing method thereof

Printed circuit board and electronic device including same

Patents Applicationslast 30 patents

Flexible Printed Wiring Board and Method for Manufacturing Same

CONNECTING ARRANGEMENT

METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE

WIRING SUBSTRATE

FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE

HEATSINK BASED POWER DELIVERY FOR CPUS

CIRCUIT BOARD

PRINTED CIRCUIT BOARD

SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS

PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...

BOND PAD CONNECTOR FOR SECURING AN ELECTRONIC COMPONENT THEREON

ELECTRONIC DEVICE

CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

WIRING CIRCUIT BOARD

PROTECTION OF ELECTRONICS IN NEGATIVE PRESSURE WOUND THERAPY SYSTEMS

ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD

MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME

ELECTRONIC DEVICE HAVING PAD STRUCTURE

Overlap Joint Flex Circuit Board Interconnection

ELECTRONIC COMPONENT

DC-DC STEP UP CONVERTER SYSTEMS AND METHODS

LIGHT EMITTING DEVICE AND KEYBOARD STRUCTURE

CIRCUIT BOARD AND A DISPLAY DEVICE INCLUDING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE...

CIRCUIT BOARD FOR ANTENNA, ANTENNA PACKAGE INCLUDING THE SAME AND I...

CIRCUIT BOARD

MODULE

CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD

Electronic Control Device