Layout of power planes, ground planes or power supply conductors

Industry

CPC
H05K2201/093

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/093Layout of power planes, ground planes or power supply conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Skin care device providing micro current to a mask for promoting pr...
- Patent number 12,161,866
- Issue date Dec 10, 2024
- N&B LAB CO., LTD.
- Kwang Suk Hwang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 12,160,945
- Issue date Dec 3, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency filter
- Patent number 12,160,217
- Issue date Dec 3, 2024
- Mitsubishi Electric Corporation
- Motomi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching power supply including wiring layer
- Patent number 12,149,171
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Yutaka Mimino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electromagnetic interference shields having attentuation interfaces
- Patent number 12,133,322
- Issue date Oct 29, 2024
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 12,127,341
- Issue date Oct 22, 2024
- Thales
- Geoffroy Aupee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection of electronics in negative pressure wound therapy systems
- Patent number 12,127,333
- Issue date Oct 22, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Inductor component and inductor component mounting substrate
- Patent number 12,112,881
- Issue date Oct 8, 2024
- Murata Manufacturing Co., Ltd.
- Rikiya Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 12,082,346
- Issue date Sep 3, 2024
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board terminal electrode component
- Patent number 12,068,114
- Issue date Aug 20, 2024
- Murata Manufacturing Co., Ltd.
- Motonori Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,063,737
- Issue date Aug 13, 2024
- LG Innotek Co., Ltd
- Hae Sik Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,052,819
- Issue date Jul 30, 2024
- Ibiden Co., Ltd.
- Tomohiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Axial field rotary energy device with PCB stator with thermal expan...
- Patent number 12,046,966
- Issue date Jul 23, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,041,720
- Issue date Jul 16, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting structure for inductors
- Patent number 12,035,460
- Issue date Jul 9, 2024
- Murata Manufacturing Co., Ltd.
- Tarou Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implantable electronic devices
- Patent number 12,017,080
- Issue date Jun 25, 2024
- CURONIX LLC
- Laura Tyler Perryman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Setting the impedance of signal traces of a circuit board using a r...
- Patent number 12,016,114
- Issue date Jun 18, 2024
- Super Micro Computer, Inc.
- Manhtien V. Phan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 12,016,119
- Issue date Jun 18, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 11,991,826
- Issue date May 21, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Jongmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board, light bar, light source and display device
- Patent number 11,991,825
- Issue date May 21, 2024
- Beijing BOE Optoelectronics Technology Co., Ltd
- Yuanda Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,982,704
- Issue date May 14, 2024
- E Ink Holdings Inc.
- Ruei-Huan Rao
- G01 - MEASURING TESTING
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for circuit interconnects
- Patent number 11,937,368
- Issue date Mar 19, 2024
- OpenLight Photonics, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including flexible printed circuit board
- Patent number 11,930,592
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Seonghun Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 11,924,959
- Issue date Mar 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for galvanic effect reduction
- Patent number 11,924,964
- Issue date Mar 5, 2024
- Western Digital Technologies, Inc.
- Lin Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND CIRCUIT BOARD
- Publication number 20240422913
- Publication date Dec 19, 2024
- Murata Manufacturing Co., Ltd.
- Ryutatsu MIZUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES
- Publication number 20240422895
- Publication date Dec 19, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLANTABLE ELECTRONIC DEVICES
- Publication number 20240416134
- Publication date Dec 19, 2024
- CURONIX LLC
- Laura Tyler Perryman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240414836
- Publication date Dec 12, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB, PCB MOUNTING BOX, CASE ASSEMBLY, AND CASE
- Publication number 20240407078
- Publication date Dec 5, 2024
- ZTE CORPORATION
- Shoulong WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE
- Publication number 20240397621
- Publication date Nov 28, 2024
- Unimicron Technology Corp.
- Chin-Hsun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Slots for an Antenna and Printed Circuit Board Interface
- Publication number 20240357732
- Publication date Oct 24, 2024
- Aptiv Technologies Limited
- Yuxiao He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR NANOPLASMA SWITCHES
- Publication number 20240334584
- Publication date Oct 3, 2024
- Analog Devices International Unlimited Company
- Romulo Maggay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20240334603
- Publication date Oct 3, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren XIONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240314929
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Kiyokazu ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM
- Publication number 20240314920
- Publication date Sep 19, 2024
- MEDIATEK INC.
- Tso-Ju YI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
- Publication number 20240260188
- Publication date Aug 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Brian Mark Hostetler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240260172
- Publication date Aug 1, 2024
- Honor Device Co., Ltd.
- Puwei BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE
- Publication number 20240235072
- Publication date Jul 11, 2024
- NIPPON MEKTRON, LTD.
- Shuzo YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20240234443
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240234326
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215159
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang-min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20240206055
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Seonghun SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240196517
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Youngsun JO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY HAVING A SECURITY SHIELD
- Publication number 20240196525
- Publication date Jun 13, 2024
- Rolls-Royce North American Technologies Inc.
- Richard Joseph Skertic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD GROUNDING
- Publication number 20240196516
- Publication date Jun 13, 2024
- AES Global Holdings PTE Ltd.
- Yihong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240196538
- Publication date Jun 13, 2024
- TDK Corporation
- Akihiro MASUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Printed Wiring Board and Method for Manufacturing Same
- Publication number 20240155763
- Publication date May 9, 2024
- Nippon Mektron, Ltd.
- Yoshihiko Narisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING ARRANGEMENT
- Publication number 20240155766
- Publication date May 9, 2024
- ROBERT BOSCH GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20240147621
- Publication date May 2, 2024
- Hitachi Astemo, Ltd.
- Narutoshi YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240136294
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE
- Publication number 20240136740
- Publication date Apr 25, 2024
- NIPPON MEKTRON, LTD.
- Shuzo YAMADA
- H01 - BASIC ELECTRIC ELEMENTS

Layout of power planes, ground planes or power supply conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Skin care device providing micro current to a mask for promoting pr...

Providing a lower inductance path in a routing substrate for a capa...

Heatsink based power delivery for CPUs

High frequency filter

Switching power supply including wiring layer

Bus bar link for battery cell interconnections in a battery module

Electromagnetic interference shields having attentuation interfaces

Multilayer printed circuit board

Protection of electronics in negative pressure wound therapy systems

Inductor component and inductor component mounting substrate

Wiring board

Multi-level printed circuit boards and memory modules including the...

Board terminal electrode component

Circuit board

Printed wiring board and method for manufacturing printed wiring board

Axial field rotary energy device with PCB stator with thermal expan...

Display device and manufacturing method thereof

Mounting structure for inductors

Implantable electronic devices

Setting the impedance of signal traces of a circuit board using a r...

Method for manufacturing multilayer printed circuit board

Flexible printed circuit board

Flexible circuit board, light bar, light source and display device

Electronic device

Array substrate and method of mounting integrated circuit using the...

Mating backplane for high speed, high density electrical connector

Structure for circuit interconnects

Electronic device including flexible printed circuit board

Heatsink based power delivery for CPUs

Printed circuit board for galvanic effect reduction

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

CIRCUIT MODULE AND CIRCUIT BOARD

STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES

IMPLANTABLE ELECTRONIC DEVICES

HEATSINK BASED POWER DELIVERY FOR CPUS

PCB, PCB MOUNTING BOX, CASE ASSEMBLY, AND CASE

CIRCUIT BOARD DEVICE

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

Isolation Slots for an Antenna and Printed Circuit Board Interface

APPARATUS AND METHODS FOR NANOPLASMA SWITCHES

DISPLAY DEVICE

SEMICONDUCTOR STORAGE DEVICE

ELECTRONIC SYSTEM

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

CIRCUIT BOARD AND ELECTRONIC DEVICE

FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

WIRING SUBSTRATE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD

INTERPOSER AND ELECTRONIC DEVICE COMPRISING SAME

CIRCUIT BOARD ASSEMBLY HAVING A SECURITY SHIELD

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

PRINTED CIRCUIT BOARD GROUNDING

ELECTRONIC DEVICE

Flexible Printed Wiring Board and Method for Manufacturing Same

CONNECTING ARRANGEMENT

METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE

WIRING SUBSTRATE

FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE