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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure with twinned copper
- Patent number 11,114,405
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package structure with twinned cop...
- Patent number 10,515,923
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-pillar assisted semiconductor bonding
- Patent number 10,319,693
- Issue date Jun 11, 2019
- Skorpios Technologies, Inc.
- Damien Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for routing die signals using external interco...
- Patent number 9,871,012
- Issue date Jan 16, 2018
- QUALCOMM Incorporated
- Vaishnav Srinivas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,768,089
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a functional capping
- Patent number 9,620,390
- Issue date Apr 11, 2017
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer stack protection seal
- Patent number 9,406,577
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interposer package-on-package structure
- Patent number 9,406,636
- Issue date Aug 2, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a functional capping
- Patent number 9,362,139
- Issue date Jun 7, 2016
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Laser assisted transfer welding process
- Patent number 9,161,448
- Issue date Oct 13, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically bonded arrays of transfer printed active components
- Patent number 9,049,797
- Issue date Jun 2, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor chips having double adhesive insulating layer...
- Patent number 8,841,776
- Issue date Sep 23, 2014
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH CONDUCTIVE LINE AND METHOD FOR...
- Publication number 20180350765
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160351541
- Publication date Dec 1, 2016
- Kabushiki Kaisha Toshiba
- Shinya FUKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING
- Publication number 20140283982
- Publication date Sep 25, 2014
- Tingrui Pan
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140284817
- Publication date Sep 25, 2014
- Kabushiki Kaisha Toshiba
- Takao SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20140264762
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES SINGAPORE PTE LTD.
- Ranjan RAJOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ROUTING DIE SIGNALS USING EXTERNAL INTERCO...
- Publication number 20140061642
- Publication date Mar 6, 2014
- QUALCOMM Incorporated
- Vaishnav Srinivas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS
- Publication number 20130153277
- Publication date Jun 20, 2013
- Etienne Menard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER DEPOSITION SYSTEM AND METHOD FOR METAL BUMPS
- Publication number 20130026212
- Publication date Jan 31, 2013
- FLEXTRONICS AP, LLC
- Samuel Waising Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Functional Capping
- Publication number 20120267773
- Publication date Oct 25, 2012
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER ASSISTED TRANSFER WELDING PROCESS
- Publication number 20120115262
- Publication date May 10, 2012
- Semprius, Inc.
- Etienne Menard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20080150120
- Publication date Jun 26, 2008
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package structure with twinned copper

Method for forming semiconductor package structure with twinned cop...

Micro-pillar assisted semiconductor bonding

Laser assisted transfer welding process

Method for producing structured sintered connection layers, and sem...

Method and apparatus for routing die signals using external interco...

Wafer stack protection seal

Method of making a semiconductor device having a functional capping

Wafer stack protection seal

Interposer package-on-package structure

Method of making a semiconductor device having a functional capping

Laser assisted transfer welding process

Electrically bonded arrays of transfer printed active components

Stacked semiconductor chips having double adhesive insulating layer...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE WITH CONDUCTIVE LINE AND METHOD FOR...

SEMICONDUCTOR DEVICE

UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

WAFER STACK PROTECTION SEAL

Method for Producing Structured Sintered Connection Layers, and Sem...

METHOD AND APPARATUS FOR ROUTING DIE SIGNALS USING EXTERNAL INTERCO...

ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS

SOLDER DEPOSITION SYSTEM AND METHOD FOR METAL BUMPS

Functional Capping

LASER ASSISTED TRANSFER WELDING PROCESS

Semiconductor device and method of producing the same