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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0912Layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packages with metal line crack prevention design
- Patent number 11,862,606
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite IC chips including a chiplet embedded within metallizatio...
- Patent number 11,749,649
- Issue date Sep 5, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern decomposition lithography techniques
- Patent number 11,107,786
- Issue date Aug 31, 2021
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite IC chips including a chiplet embedded within metallizatio...
- Patent number 11,094,672
- Issue date Aug 17, 2021
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with metal line crack prevention design
- Patent number 11,056,464
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, chip on film, display panel and display device
- Patent number 10,784,187
- Issue date Sep 22, 2020
- BOE Technology Group Co., Ltd.
- Hong Li
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,784,256
- Issue date Sep 22, 2020
- Fuji Electric Co., Ltd.
- Takashi Shiigi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,629,555
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern decomposition lithography techniques
- Patent number 10,490,519
- Issue date Nov 26, 2019
- Intel Corporation
- Charles H. Wallace
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Film product, film packages and package modules using the same
- Patent number 10,304,764
- Issue date May 28, 2019
- Samsung Electronics Co., Ltd.
- Yechung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 10,269,733
- Issue date Apr 23, 2019
- Realtek Semiconductor Corp.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous ball pattern package
- Patent number 10,177,107
- Issue date Jan 8, 2019
- Xilinx, Inc.
- Rafael C. Camarota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a redistribution line structure
- Patent number 10,115,708
- Issue date Oct 30, 2018
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,037,955
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,002,841
- Issue date Jun 19, 2018
- Denso Corporation
- Shotaro Miyawaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a solder-on-pad structure
- Patent number 9,972,590
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Deog Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,966,364
- Issue date May 8, 2018
- Samsung Electronics Co., Ltd.
- Gun Ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with metal line crack prevention design
- Patent number 9,929,126
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with through silicon via interconnect
- Patent number 9,870,980
- Issue date Jan 16, 2018
- Mediatek Inc.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow-cavity flip-chip package with reinforced interconnects and p...
- Patent number 9,793,237
- Issue date Oct 17, 2017
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having two substrates
- Patent number 9,721,928
- Issue date Aug 1, 2017
- NXP USA, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 9,666,236
- Issue date May 30, 2017
- SK Hynix Inc.
- Hyun-Bae Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip, flip chip package and wafer level package inclu...
- Patent number 9,640,499
- Issue date May 2, 2017
- Samsung Electronics Co., Ltd.
- Heung Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip with I/O pads on peripheries and method making the same
- Patent number 9,633,960
- Issue date Apr 25, 2017
- Sunasic Technologies Inc.
- Chi-Chou Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board having bypass pad
- Patent number 9,627,360
- Issue date Apr 18, 2017
- Samsung Electronics Co., Ltd.
- Sang-Guk Han
- G11 - INFORMATION STORAGE
Information Patent Grant
Film for semiconductor package, semiconductor package using film an...
- Patent number 9,576,865
- Issue date Feb 21, 2017
- Samsung Electronics Co., Ltd.
- Soyoung Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising improved via pad placement in bump area
- Patent number 9,466,578
- Issue date Oct 11, 2016
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die face-down stacking for two or more die
- Patent number 9,437,579
- Issue date Sep 6, 2016
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices and semiconductor packages
- Patent number 9,070,569
- Issue date Jun 30, 2015
- Samsung Electronics Co., Ltd.
- Ho-Cheol Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory devices and semiconductor packages
- Patent number 8,796,863
- Issue date Aug 5, 2014
- Samsung Electronics Co., Ltd.
- Ho-Cheol Lee
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...
- Publication number 20230402416
- Publication date Dec 14, 2023
- Airoha Technology (HK) Limited
- Huan-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230035026
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN DECOMPOSITION LITHOGRAPHY TECHNIQUES
- Publication number 20210375807
- Publication date Dec 2, 2021
- Intel Corporation
- CHARLES H. WALLACE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE IC CHIPS INCLUDING A CHIPLET EMBEDDED WITHIN METALLIZATIO...
- Publication number 20210375830
- Publication date Dec 2, 2021
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE IC CHIPS INCLUDING A CHIPLET EMBEDDED WITHIN METALLIZATIO...
- Publication number 20210098422
- Publication date Apr 1, 2021
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN DECOMPOSITION LITHOGRAPHY TECHNIQUES
- Publication number 20200091101
- Publication date Mar 19, 2020
- Intel Corporation
- CHARLES H. WALLACE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Packages with Metal Line Crack Prevention Design
- Publication number 20180197839
- Publication date Jul 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A REDISTRIBUTION LINE STRUCTURE
- Publication number 20180138150
- Publication date May 17, 2018
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-LESS SURFACE MOUNT SEMICONDUCTOR DEVICE
- Publication number 20180102287
- Publication date Apr 12, 2018
- Nexperia B.V.
- EUGENE PUMANES SANTOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, CHIP ON FILM, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20180047657
- Publication date Feb 15, 2018
- BOE TECHNOLOGY GROUP CO., LTD.
- Hong LI
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180040590
- Publication date Feb 8, 2018
- Samsung Electronics Co., Ltd.
- Gun Ho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS BALL PATTERN PACKAGE
- Publication number 20180033753
- Publication date Feb 1, 2018
- Xilinx, Inc.
- Rafael C. Camarota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SOLDER-ON-PAD STRUCTURE
- Publication number 20180012856
- Publication date Jan 11, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Deog Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PRODUCT, FILM PACKAGES AND PACKAGE MODULES USING THE SAME
- Publication number 20170372992
- Publication date Dec 28, 2017
- Samsung Electronics Co., Ltd.
- Yechung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170256510
- Publication date Sep 7, 2017
- Shotaro MIYAWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20170236791
- Publication date Aug 17, 2017
- Realtek Semiconductor Corp.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices and Methods of Manufacture Thereof
- Publication number 20170221845
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN DECOMPOSITION LITHOGRAPHY TECHNIQUES
- Publication number 20170207185
- Publication date Jul 20, 2017
- Intel Corporation
- CHARLES H. WALLACE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ARRAY FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20170125293
- Publication date May 4, 2017
- FREESCALE SEMICONDUCTOR, INC.
- ZHIJIE WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...
- Publication number 20170110434
- Publication date Apr 20, 2017
- TriQuint Semiconductor, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170111037
- Publication date Apr 20, 2017
- Fuji Electric Co., Ltd.
- Takashi SHIIGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE
- Publication number 20170103786
- Publication date Apr 13, 2017
- SK HYNIX INC.
- Hyun-Bae LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING A PLURALITY OF PADS
- Publication number 20170098624
- Publication date Apr 6, 2017
- Samsung Electronics Co., Ltd.
- Kwanyeob CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD HAVING BYPASS PAD
- Publication number 20170018535
- Publication date Jan 19, 2017
- Samsung Electronics Co., Ltd.
- Sang-Guk Han
- G11 - INFORMATION STORAGE
Information Patent Application
CHIP WITH I/O PADS ON PERIPHERIES AND METHOD MAKING THE SAME
- Publication number 20170005050
- Publication date Jan 5, 2017
- SUNASIC TECHNOLOGIES, INC.
- Chi-Chou LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP, FLIP CHIP PACKAGE AND WAFER LEVEL PACKAGE INCLU...
- Publication number 20160284655
- Publication date Sep 29, 2016
- Samsung Electronics Co., Ltd.
- Heung Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AN...
- Publication number 20160197020
- Publication date Jul 7, 2016
- Samsung Electronics Co., Ltd.
- Soyoung LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160133601
- Publication date May 12, 2016
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF TESTING SEMICONDUCTOR DEVICE
- Publication number 20160043029
- Publication date Feb 11, 2016
- Fujitsu Limited
- Takahiro SHIKIBU
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM-IN-PACKAGE
- Publication number 20160005726
- Publication date Jan 7, 2016
- MEDIATEK INC.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packages with metal line crack prevention design

Composite IC chips including a chiplet embedded within metallizatio...

Pattern decomposition lithography techniques

Composite IC chips including a chiplet embedded within metallizatio...

Packages with metal line crack prevention design

Array substrate, chip on film, display panel and display device

Semiconductor device and method of manufacturing semiconductor device

Packaging devices and methods of manufacture thereof

Pattern decomposition lithography techniques

Film product, film packages and package modules using the same

Integrated circuit device

Heterogeneous ball pattern package

Semiconductor package having a redistribution line structure

Packaging devices and methods of manufacture thereof

Semiconductor device

Semiconductor package having a solder-on-pad structure

Semiconductor package and method for fabricating the same

Packages with metal line crack prevention design

Semiconductor package with through silicon via interconnect

Hollow-cavity flip-chip package with reinforced interconnects and p...

Integrated circuit package having two substrates

Multi-chip package

Semiconductor chip, flip chip package and wafer level package inclu...

Chip with I/O pads on peripheries and method making the same

Circuit board having bypass pad

Film for semiconductor package, semiconductor package using film an...

Substrate comprising improved via pad placement in bump area

Multiple die face-down stacking for two or more die

Semiconductor memory devices and semiconductor packages

Semiconductor memory devices and semiconductor packages

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...

SEMICONDUCTOR PACKAGE

PATTERN DECOMPOSITION LITHOGRAPHY TECHNIQUES

COMPOSITE IC CHIPS INCLUDING A CHIPLET EMBEDDED WITHIN METALLIZATIO...

COMPOSITE IC CHIPS INCLUDING A CHIPLET EMBEDDED WITHIN METALLIZATIO...

PATTERN DECOMPOSITION LITHOGRAPHY TECHNIQUES

Packages with Metal Line Crack Prevention Design

SEMICONDUCTOR PACKAGE HAVING A REDISTRIBUTION LINE STRUCTURE

LEADFRAME-LESS SURFACE MOUNT SEMICONDUCTOR DEVICE

ARRAY SUBSTRATE, CHIP ON FILM, DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

HETEROGENEOUS BALL PATTERN PACKAGE

SEMICONDUCTOR PACKAGE HAVING A SOLDER-ON-PAD STRUCTURE

FILM PRODUCT, FILM PACKAGES AND PACKAGE MODULES USING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE

Packaging Devices and Methods of Manufacture Thereof

PATTERN DECOMPOSITION LITHOGRAPHY TECHNIQUES

SUBSTRATE ARRAY FOR PACKAGING INTEGRATED CIRCUITS

HOLLOW-CAVITY FLIP-CHIP PACKAGE WITH REINFORCED INTERCONNECTS AND P...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MULTI-CHIP PACKAGE

SEMICONDUCTOR CHIP INCLUDING A PLURALITY OF PADS

CIRCUIT BOARD HAVING BYPASS PAD

CHIP WITH I/O PADS ON PERIPHERIES AND METHOD MAKING THE SAME

SEMICONDUCTOR CHIP, FLIP CHIP PACKAGE AND WAFER LEVEL PACKAGE INCLU...

FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AN...

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF TESTING SEMICONDUCTOR DEVICE

SYSTEM-IN-PACKAGE