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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1412Layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density microbump and probe pad arrangement for semiconductor...
- Patent number 12,033,903
- Issue date Jul 9, 2024
- Amazon Technologies, Inc.
- Nikhil Jayakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip socket, testing fixture and chip testing method thereof
- Patent number 11,959,939
- Issue date Apr 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Shih-Ting Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package including stacked chip structure
- Patent number 11,961,824
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 11,688,685
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having a substrate comprising surface interconnects aligned...
- Patent number 11,682,607
- Issue date Jun 20, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,664,320
- Issue date May 30, 2023
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 11,631,648
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
- Patent number 11,626,378
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chiplets with connection posts
- Patent number 11,552,034
- Issue date Jan 10, 2023
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,495,560
- Issue date Nov 8, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with sealing resin
- Patent number 11,387,400
- Issue date Jul 12, 2022
- Murata Manufacturing Co., Ltd.
- Junpei Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,276,657
- Issue date Mar 15, 2022
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method for forming the same
- Patent number 11,264,342
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,257,776
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 11,257,725
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,158,578
- Issue date Oct 26, 2021
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 11,088,064
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures, packaged semiconductor devices, and method...
- Patent number 11,031,363
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages
- Patent number 11,018,121
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,011,482
- Issue date May 18, 2021
- Samsung Electronics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 10,923,447
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 10,923,417
- Issue date Feb 16, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having enhanced stiffener
- Patent number 10,840,192
- Issue date Nov 17, 2020
- Xilinx, Inc.
- Nael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,833,033
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor packages
- Patent number 10,797,030
- Issue date Oct 6, 2020
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...
- Publication number 20240405007
- Publication date Dec 5, 2024
- Huawei Technologies Co., Ltd
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST
- Publication number 20240213217
- Publication date Jun 27, 2024
- International Business Machines Corporation
- David Michael Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF
- Publication number 20240192252
- Publication date Jun 13, 2024
- NANYA TECHNOLOGY CORPORATION
- SHIH-TING LIN
- G01 - MEASURING TESTING
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240071971
- Publication date Feb 29, 2024
- LAPIS Technology Co., Ltd.
- Osamu KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240055420
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging Heterogeneous Area Array Interconnections
- Publication number 20230369267
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package with 3D Magnetic Core Inductor
- Publication number 20230298993
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20230253337
- Publication date Aug 10, 2023
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20230253355
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
- Publication number 20230087367
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoxuan Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF
- Publication number 20230069959
- Publication date Mar 9, 2023
- NANYA TECHNOLOGY CORPORATION
- SHIH-TING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIP STRUCTURE
- Publication number 20230028943
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- HYUNGGYUN NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING A SUBSTRATE COMPRISING SURFACE INTERCONNECTS ALIGNED...
- Publication number 20220246496
- Publication date Aug 4, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20220189866
- Publication date Jun 16, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20220028790
- Publication date Jan 27, 2022
- Intel Corporation
- MIHIR K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package with 3D Magnetic Core Inductor
- Publication number 20210193572
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS
- Publication number 20210175134
- Publication date Jun 10, 2021
- Samsung Electronics Co., Ltd.
- Taehyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package with 3D Magnetic Core Inductor
- Publication number 20210167011
- Publication date Jun 3, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20210167030
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082853
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20210035938
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20200335460
- Publication date Oct 22, 2020
- Samsung Electronics Co., Ltd.
- Doo Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20200243467
- Publication date Jul 30, 2020
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
- Publication number 20200219802
- Publication date Jul 9, 2020
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Millimeter Wave Integrated Circuit and System with a Low Loss Packa...
- Publication number 20200161257
- Publication date May 21, 2020
- STERADIAN SEMICONDUCTORS PRIVATE LIMITED
- Apu Sivadas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200152587
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20190326240
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20190295999
- Publication date Sep 26, 2019
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Semiconductor package including test bumps

High density interconnect device and method

Bump structure having a side recess and semiconductor structure inc...

High-density microbump and probe pad arrangement for semiconductor...

Chiplets with connection posts

Chip socket, testing fixture and chip testing method thereof

Semiconductor package including stacked chip structure

Integrated fan-out package with 3D magnetic core inductor

Package having a substrate comprising surface interconnects aligned...

High density interconnect device and method

Bump structure having a side recess and semiconductor structure inc...

Interconnect structures, packaged semiconductor devices, and method...

Chiplets with connection posts

Chiplets with connection posts

Electronic module with sealing resin

Chiplets with connection posts

Package on package structure and method for forming the same

Semiconductor package structure and method for manufacturing the same

Semiconductor package including test bumps

High density interconnect device and method

Fine pitch copper pillar package and method

Interconnect structures, packaged semiconductor devices, and method...

Semiconductor packages

Fan-out semiconductor package

Semiconductor device assembly with die support structures

Integrated fan-out package with 3D magnetic core inductor

Stacked silicon package assembly having enhanced stiffener

Bump structure having a side recess and semiconductor structure inc...

Semiconductor packages

Patents Applicationslast 30 patents

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...

CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST

CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF

CHIPLETS WITH CONNECTION POSTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

3D Packaging Heterogeneous Area Array Interconnections

Integrated Fan-Out Package with 3D Magnetic Core Inductor

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS

CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIP STRUCTURE

PACKAGE HAVING A SUBSTRATE COMPRISING SURFACE INTERCONNECTS ALIGNED...

FINE PITCH COPPER PILLAR PACKAGE AND METHOD

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

Integrated Fan-Out Package with 3D Magnetic Core Inductor

SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS

Integrated Fan-Out Package with 3D Magnetic Core Inductor

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

FAN-OUT SEMICONDUCTOR PACKAGE

CHIPLETS WITH CONNECTION POSTS

FINE PITCH COPPER PILLAR PACKAGE AND METHOD

Millimeter Wave Integrated Circuit and System with a Low Loss Packa...

PACKAGE ON PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

SEMICONDUCTOR PACKAGES