Lead-frames fixed on or encapsulated in insulating substrates

Industry

CPC
H01L23/49861

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49861Lead-frames fixed on or encapsulated in insulating substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multiple conductive posts
- Patent number 11,973,043
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of overlapping power terminals in a semiconductor module
- Patent number 11,973,015
- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of vertical integrations of semiconductor chips...
- Patent number 11,973,029
- Issue date Apr 30, 2024
- Suzhou Qing Xin Fang Electronics Technology Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modularized power amplifier devices and architectures
- Patent number 11,967,937
- Issue date Apr 23, 2024
- Viasat, Inc.
- Shih Peng Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a molded substrate electronic package and structure
- Patent number 11,961,794
- Issue date Apr 16, 2024
- Amikor Technology Singapore Holding Pte. Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,955,410
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaged devices with thermal pad
- Patent number 11,955,456
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with deformable conductors
- Patent number 11,955,420
- Issue date Apr 9, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded board
- Patent number 11,948,849
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with leads having step surfaces
- Patent number 11,929,342
- Issue date Mar 12, 2024
- Shinko Electric Industries Co., Ltd.
- Futoshi Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact power module
- Patent number 11,923,344
- Issue date Mar 5, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,923,280
- Issue date Mar 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,916,009
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land structure for semiconductor package and method therefor
- Patent number 11,908,779
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with press-fit contacts
- Patent number 11,901,273
- Issue date Feb 13, 2024
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,901,272
- Issue date Feb 13, 2024
- Fuji Electric Co., Ltd.
- Yoshinori Uezato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 11,901,319
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, metal sheet for use in a semiconductor packa...
- Patent number 11,901,257
- Issue date Feb 13, 2024
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shielding structure
- Patent number 11,869,849
- Issue date Jan 9, 2024
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging extendable lead and method therefor
- Patent number 11,869,837
- Issue date Jan 9, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side cooling power module and manufacturing method of the same
- Patent number 11,862,542
- Issue date Jan 2, 2024
- Hyundai Mobis Co., Ltd.
- HanSin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,854,830
- Issue date Dec 26, 2023
- HAESUNG DS CO., LTD.
- Dong Jin Yoon
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Warpage control in microelectronic packages, and related assemblies...
- Patent number 11,855,002
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Christopher Glancey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,854,983
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,848,304
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for improving heat dissipation and mounting st...
- Patent number 11,842,951
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF
- Publication number 20240128185
- Publication date Apr 18, 2024
- PANJIT INTERNATIONAL INC.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240128180
- Publication date Apr 18, 2024
- Hyundai Motor Company
- Myung Ill You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120269
- Publication date Apr 11, 2024
- Hyundai Motor Company
- Kyoung Kook HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDABLE INNER LEAD FOR LEADED PACKAGE
- Publication number 20240105579
- Publication date Mar 28, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240105627
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
- Publication number 20240096775
- Publication date Mar 21, 2024
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL STAGGERED TERMINAL STRUCTURE AND SEMICONDUCTOR PACKAGE...
- Publication number 20240096780
- Publication date Mar 21, 2024
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE OR DEVICE WITH SEALING LAYER
- Publication number 20240088012
- Publication date Mar 14, 2024
- STMicroelectronics S.r.l.
- Francesca MILANESI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS
- Publication number 20240071892
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A GEL
- Publication number 20240071851
- Publication date Feb 29, 2024
- Microchip Technology Caldicot Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240071898
- Publication date Feb 29, 2024
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20240063177
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...
- Publication number 20240038439
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLD SUBSTRATE AND METHOD OF MANUFACTURING PRE-MOLD SUBSTRATE
- Publication number 20240038652
- Publication date Feb 1, 2024
- HAESUNG DS CO., LTD
- Kwang Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240038677
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF
- Publication number 20240030107
- Publication date Jan 25, 2024
- Rohm Co., Ltd.
- Ippei YASUTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE
- Publication number 20240032260
- Publication date Jan 25, 2024
- ZF Friedrichshafen AG
- Manuel Raimann
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...
- Publication number 20240014123
- Publication date Jan 11, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME
- Publication number 20240006403
- Publication date Jan 4, 2024
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT SEMICONDUCTOR PACKAGE
- Publication number 20230411265
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME
- Publication number 20230411170
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- BRADLEY GLASSCOCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230411339
- Publication date Dec 21, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME
- Publication number 20230402364
- Publication date Dec 14, 2023
- STMicroelectronics International N.V.
- Luca Maria Carlo DI DIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230402421
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395485
- Publication date Dec 7, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES HAVING MOISTURE BARRIERS
- Publication number 20230378010
- Publication date Nov 23, 2023
- Wolfspeed, Inc.
- Dev Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE INTEGRATED CIRCUIT PACKAGE
- Publication number 20230378022
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- KWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230369195
- Publication date Nov 16, 2023
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20230352370
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS

Lead-frames fixed on or encapsulated in insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multiple conductive posts

Plurality of overlapping power terminals in a semiconductor module

Devices and methods of vertical integrations of semiconductor chips...

Giga interposer integration through Chip-On-Wafer-On-Substrate

Modularized power amplifier devices and architectures

Integrated circuit direct cooling systems having substrates in cont...

Method of forming a molded substrate electronic package and structure

Electronic component apparatus having a first lead frame and a seco...

Semiconductor module

Flip chip packaged devices with thermal pad

Structures with deformable conductors

Semiconductor module

Package-embedded board

Semiconductor device with leads having step surfaces

Compact power module

Semiconductor device and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Land structure for semiconductor package and method therefor

Power module with press-fit contacts

Semiconductor module

Semiconductor package system and method

Semiconductor package, metal sheet for use in a semiconductor packa...

Semiconductor package with EMI shielding structure

Semiconductor device packaging extendable lead and method therefor

Dual side cooling power module and manufacturing method of the same

Method of manufacturing circuit board

Warpage control in microelectronic packages, and related assemblies...

Semiconductor devices and methods of manufacture

Semiconductor device and method of forming the same

Semiconductor device for improving heat dissipation and mounting st...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF

POWER MODULE

POWER MODULE AND MANUFACTURING METHOD THEREOF

EXTENDABLE INNER LEAD FOR LEADED PACKAGE

Semiconductor Devices and Methods of Manufacture

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE

MULTI-LEVEL STAGGERED TERMINAL STRUCTURE AND SEMICONDUCTOR PACKAGE...

POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES

SEMICONDUCTOR PACKAGE OR DEVICE WITH SEALING LAYER

MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS

ELECTRONIC DEVICE PACKAGE INCLUDING A GEL

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor Device and Method of Forming the Same

INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...

PRE-MOLD SUBSTRATE AND METHOD OF MANUFACTURING PRE-MOLD SUBSTRATE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

POWER ELECTRONICS MODULE

SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...

HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME

SPLIT SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT HAVING A ROUTABLE LEADFRAME

SEMICONDUCTOR MODULE

LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICES HAVING MOISTURE BARRIERS

POWER MODULE INTEGRATED CIRCUIT PACKAGE

POWER MODULE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...