Lead-frames fixed on or encapsulated in insulating substrates

Industry

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H01L23/49861

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49861Lead-frames fixed on or encapsulated in insulating substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure with reduced vertical stress regions
- Patent number 12,131,982
- Issue date Oct 29, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Kyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extendable inner lead for leaded package
- Patent number 12,125,780
- Issue date Oct 22, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging with integrated ceramic substrate
- Patent number 12,125,799
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with deformable conductors
- Patent number 12,125,778
- Issue date Oct 22, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with reduced stress
- Patent number 12,119,280
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Gregory Thomas Ostrowicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package including lead frame and manufacturing m...
- Patent number 12,113,008
- Issue date Oct 8, 2024
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,107,038
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,094,819
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,094,826
- Issue date Sep 17, 2024
- Rohm Co., Ltd.
- Hirotaka Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure thereof
- Patent number 12,087,675
- Issue date Sep 10, 2024
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,080,635
- Issue date Sep 3, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated 3D semiconductor device package with transistors attached...
- Patent number 12,074,160
- Issue date Aug 27, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid coating for integrated circuit device
- Patent number 12,068,266
- Issue date Aug 20, 2024
- Raytheon Technologies Corporation
- Jarrod N. Vaillancourt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 12,062,549
- Issue date Aug 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,057,365
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN semiconductor package, semiconductor package and lead frame
- Patent number 12,051,642
- Issue date Jul 30, 2024
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,052,014
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method of the same, graphite plate, an...
- Patent number 12,046,532
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with a paddle and ele...
- Patent number 12,033,926
- Issue date Jul 9, 2024
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer structure with Chiplet Interposer
- Patent number 12,027,455
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure and electrical junction box
- Patent number 12,027,500
- Issue date Jul 2, 2024
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with thermal pad
- Patent number 12,021,019
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including an embedded semiconductor die
- Patent number 12,002,739
- Issue date Jun 4, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferrite electro-magnetic interference (EMI) shield between an integ...
- Patent number 11,990,422
- Issue date May 21, 2024
- High Tech Technology Limited
- Chik Wai (David) Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacture
- Patent number 11,984,388
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Stephen St. Germain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,978,700
- Issue date May 7, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240387385
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240371745
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE PACKAGE STRUCTURE AND HYBRID CERAMIC BOARD
- Publication number 20240363516
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIA-SHUAI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363533
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363506
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355638
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE
- Publication number 20240356501
- Publication date Oct 24, 2024
- ViaSat, Inc.
- Shih Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240348247
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...
- Publication number 20240332122
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240332139
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Taketo NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240332204
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...
- Publication number 20240321784
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER STRUCTURE WITH CHIPLET INTERPOSER
- Publication number 20240312898
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVIC...
- Publication number 20240312899
- Publication date Sep 19, 2024
- Fuji Electric Co., Ltd.
- Akito NAKAGOME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE, PACKAGE ARRANGEMENT, METHOD OF FORMING A CARRIER...
- Publication number 20240297111
- Publication date Sep 5, 2024
- INFINEON TECHNOLOGIES AG
- Martin MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT POWER MODULE
- Publication number 20240274584
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...
- Publication number 20240266300
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20240266270
- Publication date Aug 8, 2024
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures With Deformable Conductors
- Publication number 20240266275
- Publication date Aug 8, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE
- Publication number 20240258225
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
INVERTER POWER MODULE
- Publication number 20240258196
- Publication date Aug 1, 2024
- AMOSENSE CO., LTD.
- Kyungwhan WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...
- Publication number 20240250004
- Publication date Jul 25, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240250015
- Publication date Jul 25, 2024
- Fuji Electric Co., Ltd.
- Katsunori SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20240234246
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20240222242
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240222256
- Publication date Jul 4, 2024
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240222255
- Publication date Jul 4, 2024
- Power Master Semiconductor Co., Ltd.
- Jooyaung EOM
- H01 - BASIC ELECTRIC ELEMENTS

Lead-frames fixed on or encapsulated in insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Electronic package structure with reduced vertical stress regions

Extendable inner lead for leaded package

Embedded die packaging with integrated ceramic substrate

Structures with deformable conductors

Semiconductor device package with reduced stress

Semiconductor chip package including lead frame and manufacturing m...

Semiconductor packages

Method for forming package structure

Semiconductor device

Semiconductor device and mounting structure thereof

Power module

Isolated 3D semiconductor device package with transistors attached...

Hybrid coating for integrated circuit device

Semiconductor packages and related methods

Semiconductor package having routable encapsulated conductive subst...

Semiconductor module

Semiconductor device

QFN semiconductor package, semiconductor package and lead frame

Semiconductor device

Power module and fabrication method of the same, graphite plate, an...

Semiconductor device

Method of manufacturing semiconductor devices with a paddle and ele...

Chip-on-wafer structure with Chiplet Interposer

Circuit structure and electrical junction box

Semiconductor device package with thermal pad

Semiconductor device including an embedded semiconductor die

Ferrite electro-magnetic interference (EMI) shield between an integ...

Semiconductor package structures and methods of manufacture

Power semiconductor module arrangement

Patents Applicationslast 30 patents

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR PACKAGES

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

INTELLIGENT POWER MODULE PACKAGE STRUCTURE AND HYBRID CERAMIC BOARD

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND RELATED METHODS

MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

SEMICONDUCTOR DEVICE

POWER MODULE AND FABRICATION METHOD OF THE SAME, GRAPHITE PLATE, AN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

SEMICONDUCTOR MODULE

ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...

CHIP-ON-WAFER STRUCTURE WITH CHIPLET INTERPOSER

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVIC...

CARRIER STRUCTURE, PACKAGE ARRANGEMENT, METHOD OF FORMING A CARRIER...

COMPACT POWER MODULE

POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...

POWER OVERLAY PACKAGE FOR A SEMICONDUCTOR DEVICE

Structures With Deformable Conductors

METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE

INVERTER POWER MODULE

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED...

SEMICONDUCTOR MODULE

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE