Lead [Pb] as principal constituent

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H01L2224/81416

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81416Lead [Pb] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 11,276,630
- Issue date Mar 15, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 10,651,116
- Issue date May 12, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,546,836
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having a patterned conducting plate and a conducting p...
- Patent number 10,074,581
- Issue date Sep 11, 2018
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming fine-pitch copper bump structures
- Patent number 9,978,656
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by so...
- Patent number 9,806,045
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer and method for making the same
- Patent number 9,640,521
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure and method of forming same
- Patent number 9,559,070
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive pillars having recesses or pro...
- Patent number 9,478,513
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having a patterned conducting plate and method for for...
- Patent number 9,437,457
- Issue date Sep 6, 2016
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,373,526
- Issue date Jun 21, 2016
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-passivation interconnect structure AMD method of forming same
- Patent number 9,305,856
- Issue date Apr 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 9,136,167
- Issue date Sep 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a post-passivation i...
- Patent number 9,006,891
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bump formed on substrate to prevent ELK I...
- Patent number 8,884,339
- Issue date Nov 11, 2014
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with non-metal sidewall protection structure
- Patent number 8,841,766
- Issue date Sep 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming conductive pillars havin...
- Patent number 8,741,764
- Issue date Jun 3, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure with barrier layer on post-passivation interconnect
- Patent number 8,716,858
- Issue date May 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, manufacturing method of the wiring board, and semicon...
- Patent number 8,674,514
- Issue date Mar 18, 2014
- Shinko Electric Industries Co., Ltd.
- Tadashi Arai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Post-passivation interconnect structure
- Patent number 8,581,400
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bump formed on substrate to prevent...
- Patent number 8,519,536
- Issue date Aug 27, 2013
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230215791
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Jinmo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230119406
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd
- Pilsung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230068587
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Yae Jung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION PAD WITH ENHANCED SOLDERABILITY AND CORRESPON...
- Publication number 20220369455
- Publication date Nov 17, 2022
- TECHNISCHE HOCHSCHULE ASCHAFFENBURG
- Stefan Rung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20180082982
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180061798
- Publication date Mar 1, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20140363970
- Publication date Dec 11, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Conductive Pillars Having Recesses or Pro...
- Publication number 20140225256
- Publication date Aug 14, 2014
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING A POST-PASSIVATION I...
- Publication number 20140045326
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump on Substrate to Pre...
- Publication number 20130264705
- Publication date Oct 10, 2013
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PASSIVATION INTERCONNECT STRUCTURE AMD METHOD OF FORMING SAME
- Publication number 20130207258
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Pillars Havin...
- Publication number 20130146872
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Jen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING FINE-PITCH COPPER BUMP STRUCTURES
- Publication number 20130127045
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PASSIVATION INTERCONNECT STRUCTURE
- Publication number 20130093077
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump on Substrate to Pre...
- Publication number 20130087913
- Publication date Apr 11, 2013
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE WITH BARRIER LAYER ON POST-PASSIVATION INTERCONNECT
- Publication number 20120326298
- Publication date Dec 27, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC PARTICLE ATTACHMENT MATERIAL
- Publication number 20110278351
- Publication date Nov 17, 2011
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Bump on Substrate to Pre...
- Publication number 20110260316
- Publication date Oct 27, 2011
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20110233761
- Publication date Sep 29, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICON...
- Publication number 20110133342
- Publication date Jun 9, 2011
- Shinko Electric Industries Co., Ltd.
- Tadashi ARAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080251914
- Publication date Oct 16, 2008
- Shinichi Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS

Lead [Pb] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out interconnect integration processes and structures

Methods of manufacturing a semiconductor device including a joint a...

Fan-out interconnect integration processes and structures

Multi-die package with bridge layer

Planar integrated circuit package interconnects

Method of making a pillar structure having a non-metal sidewall pro...

Wafer level integration including design/co-design, structure proce...

Interconnection structure including a metal post encapsulated by a...

Planar integrated circuit package interconnects

Methods for making multi-die package with bridge layer

Wafer level integration including design/co-design, structure proce...

Chip package having a patterned conducting plate and a conducting p...

Mechanisms for forming fine-pitch copper bump structures

Interconnection structure including a metal post encapsulated by so...

Multi-die package with bridge layer and method for making the same

Post-passivation interconnect structure and method of forming same

Semiconductor device with conductive pillars having recesses or pro...

Chip package having a patterned conducting plate and method for for...

Chip package and method for forming the same

Post-passivation interconnect structure AMD method of forming same

Method of making a pillar structure having a non-metal sidewall pro...

Method of making a semiconductor device having a post-passivation i...

Semiconductor device with bump formed on substrate to prevent ELK I...

Cu pillar bump with non-metal sidewall protection structure

Semiconductor device and method of forming conductive pillars havin...

Bump structure with barrier layer on post-passivation interconnect

Wiring board, manufacturing method of the wiring board, and semicon...

Post-passivation interconnect structure

Semiconductor device including bump formed on substrate to prevent...

Integrated circuit device having die bonded to the polymer side of...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRICAL CONNECTION PAD WITH ENHANCED SOLDERABILITY AND CORRESPON...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Methods for Making Multi-Die Package With Bridge Layer

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...

Semiconductor Device with Conductive Pillars Having Recesses or Pro...

METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING A POST-PASSIVATION I...

Semiconductor Device and Method of Forming Bump on Substrate to Pre...

POST-PASSIVATION INTERCONNECT STRUCTURE AMD METHOD OF FORMING SAME

Semiconductor Device and Method of Forming Conductive Pillars Havin...

MECHANISMS FOR FORMING FINE-PITCH COPPER BUMP STRUCTURES

POST-PASSIVATION INTERCONNECT STRUCTURE

Semiconductor Device and Method of Forming Bump on Substrate to Pre...

BUMP STRUCTURE WITH BARRIER LAYER ON POST-PASSIVATION INTERCONNECT

INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...

MAGNETIC PARTICLE ATTACHMENT MATERIAL

Semiconductor Device and Method of Forming Bump on Substrate to Pre...

CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE

WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICON...

SEMICONDUCTOR DEVICE