Lead [Pb] as principal constituent

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H01L2224/13316

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13316Lead [Pb] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture for P-through silicon via assembly
- Patent number 7,842,548
- Issue date Nov 30, 2010
- Taiwan Semconductor Manufacturing Co., Ltd.
- Chien-Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing micro bump
- Patent number 6,763,585
- Issue date Jul 20, 2004
- Pioneer Corporation
- Shinichi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder supplying method, solder supplying apparatus and soldering m...
- Patent number 5,950,908
- Issue date Sep 14, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140328032
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE FOR P-THROUGH SILICON VIA ASSEMBLY
- Publication number 20090263214
- Publication date Oct 22, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical display package and the method thereof
- Publication number 20070241435
- Publication date Oct 18, 2007
- Wintek Corporation
- Chih-Yuan Wang
- G02 - OPTICS
Information Patent Application
Method form producing micro bump
- Publication number 20020076912
- Publication date Jun 20, 2002
- Shinichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Lead [Pb] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive connecting member and manufacturing method of same

Magnetic intermetallic compound interconnect

Methods for forming pillar bumps on semiconductor wafers

Component built-in board and method of manufacturing the same, and...

Semiconductor device and method of making bumpless flipchip interco...

Fixture for P-through silicon via assembly

Method for producing micro bump

Solder supplying method, solder supplying apparatus and soldering m...

Patents Applicationslast 30 patents

CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

FIXTURE FOR P-THROUGH SILICON VIA ASSEMBLY

Optical display package and the method thereof

Method form producing micro bump