Lead [Pb] as principal constituent

Industry

CPC
H01L2224/29316

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29316Lead [Pb] as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and nanoparticle mounting material
- Patent number 11,515,280
- Issue date Nov 29, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kiyohiro Hine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radiation-hardened package for an electronic device
- Patent number 11,276,619
- Issue date Mar 15, 2022
- AMS International AG
- Jens Hofrichter
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material with ion scavenger
- Patent number 10,428,257
- Issue date Oct 1, 2019
- Honeywell International Inc.
- Ya Qun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Connection body and method of manufacturing connection body
- Patent number 10,373,927
- Issue date Aug 6, 2019
- Dexerials Corporation
- Reiji Tsukao
- G02 - OPTICS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection body, method for manufacturing a connection body, connec...
- Patent number 10,175,544
- Issue date Jan 8, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- G02 - OPTICS
Information Patent Grant
Thermal interface material with ion scavenger
- Patent number 10,155,894
- Issue date Dec 18, 2018
- Honeywell International Inc.
- Ya Qun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic device
- Patent number 10,141,084
- Issue date Nov 27, 2018
- Cheil Industries, Inc.
- Kyoung Soo Park
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Underfill material, laminated sheet and method for producing semico...
- Patent number 10,014,235
- Issue date Jul 3, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and light-emitting device
- Patent number 9,994,743
- Issue date Jun 12, 2018
- DEXERIALS CORPORATION
- Masaharu Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 9,960,139
- Issue date May 1, 2018
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 9,865,558
- Issue date Jan 9, 2018
- Samsung SDI Co., Ltd.
- Young Ju Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including conductive adhesive layer and...
- Patent number 9,490,228
- Issue date Nov 8, 2016
- Cheil Industries, Inc.
- Kyoung Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 9,252,117
- Issue date Feb 2, 2016
- Cheil Industries, Inc.
- Kyoung Hun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection device, method for manufacturing connection structure, m...
- Patent number 9,196,599
- Issue date Nov 24, 2015
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including thermal comp...
- Patent number 9,171,820
- Issue date Oct 27, 2015
- Cheil Industries, Inc.
- Kil Yong Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet for manufacturing semiconductor device, manufacturin...
- Patent number 9,153,556
- Issue date Oct 6, 2015
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film composition, anisotropic conductive fil...
- Patent number 8,766,443
- Issue date Jul 1, 2014
- Cheil Industries, Inc.
- Arum Yu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,673,688
- Issue date Mar 18, 2014
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a semiconductor device
- Patent number 8,592,260
- Issue date Nov 26, 2013
- Nitto Denko Corporation
- Masami Oikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 8,283,246
- Issue date Oct 9, 2012
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing/die bonding film
- Patent number 7,998,552
- Issue date Aug 16, 2011
- Nittok Denko Corporation
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,951,700
- Issue date May 31, 2011
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
- Publication number 20230005843
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL
- Publication number 20220399317
- Publication date Dec 15, 2022
- Seoul Semiconductor Co., Ltd.
- Woo Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND NANOPARTICLE MOUNTING MATERIAL
- Publication number 20200185347
- Publication date Jun 11, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOHIRO HINE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
RADIATION-HARDENED PACKAGE FOR AN ELECTRONIC DEVICE
- Publication number 20200176343
- Publication date Jun 4, 2020
- Jens Hofrichter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...
- Publication number 20190206831
- Publication date Jul 4, 2019
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMAL INTERFACE MATERIAL WITH ION SCAVENGER
- Publication number 20190048245
- Publication date Feb 14, 2019
- HONEYWELL INTERNATIONAL INC.
- Ya Qun Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES
- Publication number 20170271294
- Publication date Sep 21, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION BODY AND METHOD OF MANUFACTURING CONNECTION BODY
- Publication number 20170207190
- Publication date Jul 20, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...
- Publication number 20160327826
- Publication date Nov 10, 2016
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- G02 - OPTICS
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...
- Publication number 20140291834
- Publication date Oct 2, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140179065
- Publication date Jun 26, 2014
- Kil Yong LEE
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140159229
- Publication date Jun 12, 2014
- Kyoung Hun SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM ADHESIVE
- Publication number 20140120356
- Publication date May 1, 2014
- ORMET CIRCUITS, INC.
- Catherine Shearer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130292168
- Publication date Nov 7, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130213691
- Publication date Aug 22, 2013
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130157415
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM COMPOSITION, ANISOTROPIC CONDUCTIVE FIL...
- Publication number 20130154093
- Publication date Jun 20, 2013
- Arum YU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND BONDING METHOD OF HEAT DIFFUSION MEMBER, AND...
- Publication number 20120152510
- Publication date Jun 21, 2012
- NIPPON SOKEN, INC.
- Koji Noda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...
- Publication number 20120118480
- Publication date May 17, 2012
- Kyung-Wook PAIK
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor Package And Method Of Manufacturing The Same
- Publication number 20120100671
- Publication date Apr 26, 2012
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND M...
- Publication number 20110227228
- Publication date Sep 22, 2011
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20110201195
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Takashi KITAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20110084413
- Publication date Apr 14, 2011
- Yuichiro Shishido
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Lead [Pb] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayered transient liquid phase bonding

Mounting structure and nanoparticle mounting material

Alternative compositions for high temperature soldering applications

Radiation-hardened package for an electronic device

Alignment method, method for connecting electronic component, metho...

Low-temperature bonding with spaced nanorods and eutectic alloys

Thermal interface material with ion scavenger

Anisotropic conductive film, method for producing anisotropic condu...

Connection body and method of manufacturing connection body

Conductive connecting member and manufacturing method of same

Connection body, method for manufacturing a connection body, connec...

Thermal interface material with ion scavenger

Electronic device

Underfill material, laminated sheet and method for producing semico...

Adhesive and light-emitting device

Anisotropic conductive film, method for producing anisotropic condu...

Semiconductor device connected by anisotropic conductive film

Semiconductor packaging containing sintering die-attach material

Anisotropic conductive film including conductive adhesive layer and...

Semiconductor device connected by anisotropic conductive film

Connection device, method for manufacturing connection structure, m...

Method of manufacturing semiconductor device including thermal comp...

Adhesive sheet for manufacturing semiconductor device, manufacturin...

Anisotropic conductive film composition, anisotropic conductive fil...

Flip-chip mounting resin composition and bump forming resin composi...

Semiconductor package and method of manufacturing the same

Process for producing a semiconductor device

Flip chip mounting method and bump forming method

Dicing/die bonding film

Flip chip mounting method and bump forming method

Patents Applicationslast 30 patents

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...

METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL

MOUNTING STRUCTURE AND NANOPARTICLE MOUNTING MATERIAL

RADIATION-HARDENED PACKAGE FOR AN ELECTRONIC DEVICE

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...

THERMAL INTERFACE MATERIAL WITH ION SCAVENGER

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES

CONNECTION BODY AND METHOD OF MANUFACTURING CONNECTION BODY

CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL M...

ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

CONDUCTIVE FILM ADHESIVE

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

ELECTRONIC DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

ANISOTROPIC CONDUCTIVE FILM COMPOSITION, ANISOTROPIC CONDUCTIVE FIL...

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

BONDING STRUCTURE AND BONDING METHOD OF HEAT DIFFUSION MEMBER, AND...

ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND E...

Semiconductor Package And Method Of Manufacturing The Same

FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND M...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

THERMOSETTING DIE-BONDING FILM