Liquid cooling without phase change

Industry

CPC
H05K7/20763

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20763Liquid cooling without phase change

Industries

Patents Grantslast 30 patents

Information Patent Grant
Rack system for housing at least one immersion case
- Patent number 12,167,568
- Issue date Dec 10, 2024
- OVH
- Gregory Francis Louis Bauchart
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Manifold for liquid cooled computing systems
- Patent number 12,156,374
- Issue date Nov 26, 2024
- ZT GROUP INT'L, INC.
- Sruti Chigullapalli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rack system for housing an electronic device
- Patent number 12,156,370
- Issue date Nov 26, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid submerged, horizontal computer server rack and systems and m...
- Patent number 12,150,282
- Issue date Nov 19, 2024
- GREEN REVOLUTION COOLING, INC.
- Christiaan Scott Best
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Adjustable fluid coupling in datacenter cooling systems
- Patent number 12,114,469
- Issue date Oct 8, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart cold plate for redundant liquid cooling loops
- Patent number 12,092,405
- Issue date Sep 17, 2024
- Dell Products, L.P.
- Yuan Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated server flow-through fixture with state sensor for datace...
- Patent number 12,089,378
- Issue date Sep 10, 2024
- NVIDIA Corporation
- Marc E. Davis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Space-saving high-density modular data systems and energy-efficient...
- Patent number 12,048,128
- Issue date Jul 23, 2024
- Inertech IP LLC
- Earl Keisling
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooled electronic system
- Patent number 12,022,638
- Issue date Jun 25, 2024
- ICEOTOPE GROUP LIMITED
- Daniel Chester
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coolant-cooled heat sink(s) with associated ultra-violet light asse...
- Patent number 12,005,148
- Issue date Jun 11, 2024
- International Business Machines Corporation
- Hongqing Zhang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Liquid collection, detection and containment system for liquid cool...
- Patent number 12,007,305
- Issue date Jun 11, 2024
- ZT GROUP INT'L, INC.
- Sruti Chigullapalli
- G01 - MEASURING TESTING
Information Patent Grant
Leakage detection system
- Patent number 12,000,756
- Issue date Jun 4, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chien-Yu Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interfaces for coupling a memory module to a circuit board, and ass...
- Patent number 12,004,314
- Issue date Jun 4, 2024
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive cascade cooling method for datacenters
- Patent number 11,991,866
- Issue date May 21, 2024
- Hewlett Packard Enterprise Development LP
- Munther Salim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server device
- Patent number 11,956,929
- Issue date Apr 9, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chun-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimization of thermal management control of lithium-ion battery s...
- Patent number 11,929,477
- Issue date Mar 12, 2024
- BAIDU USA LLC
- Shuai Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redundant isolation of rack manifolds for datacenter cooling systems
- Patent number 11,882,678
- Issue date Jan 23, 2024
- NVIDIA Corporation
- Harold Miyamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion cooling system in miniaturized form
- Patent number 11,877,382
- Issue date Jan 16, 2024
- Shenzhen Fulian Fugui Precision Industry Co., Ltd.
- Jia-Hong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-compartment electrical apparatus with shared cooling assembly
- Patent number 11,864,358
- Issue date Jan 2, 2024
- EATON INTELLIGENT POWER LIMITED
- Franz S. Domurath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rack liquid distribution system with redundant design
- Patent number 11,839,064
- Issue date Dec 5, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid single-phase/two-phase cooling loop to enhance cooling of co...
- Patent number 11,822,400
- Issue date Nov 21, 2023
- Lenovo Global Technology (United States) Inc.
- Arvind Modekurti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Server design with high reliability cooling hardware
- Patent number 11,785,746
- Issue date Oct 10, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Constant temperature closed-loop airflow containment
- Patent number 11,778,789
- Issue date Oct 3, 2023
- International Business Machines Corporation
- Christopher M. Marroquin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Providing continuous cooling to a storage rack
- Patent number 11,729,954
- Issue date Aug 15, 2023
- Dell Products L.P.
- Weidong Zuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling system of server
- Patent number 11,729,947
- Issue date Aug 15, 2023
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Kai-Yang Tung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Row based thermal management system
- Patent number 11,716,835
- Issue date Aug 1, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Disconnects
- Patent number 11,711,907
- Issue date Jul 25, 2023
- Hewlett Packard Enterprise Development LP
- John Franz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Redundant module and systems for high density servers
- Patent number 11,700,709
- Issue date Jul 11, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hot plug redundant pump for cooling system
- Patent number 11,683,910
- Issue date Jun 20, 2023
- Quanta Computer Inc.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COOLANT FLOW PARTITION FOR COOLING 3U BOARDS IN 6U CHASSIS
- Publication number 20240381584
- Publication date Nov 14, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Richard E. Berkenbush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLOW MANAGEMENT IN A HEAT-GENERATING DEVICE
- Publication number 20240373589
- Publication date Nov 7, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240365506
- Publication date Oct 31, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Danny J. Lohan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC HEAT TRANSFER SYSTEM, METHOD AND FLUID
- Publication number 20240365516
- Publication date Oct 31, 2024
- The Lubrizol Corporation
- William D. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL USE FOR COOLANTS WITH LOW ELECTRICAL CONDUCTIVITY
- Publication number 20240343962
- Publication date Oct 17, 2024
- BASF SE
- Masayuki Hirosue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART COLD PLATE FOR REDUNDANT LIQUID COOLING LOOPS
- Publication number 20240344787
- Publication date Oct 17, 2024
- Dell Products L.P.
- Yuan Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PRESSURE PROTECTION DEVICE AND IMMERSION COOLING DEVICE
- Publication number 20240344626
- Publication date Oct 17, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TSUNG-LIN LIU
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...
- Publication number 20240314973
- Publication date Sep 19, 2024
- Intel Corporation
- Chen ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACES FOR COUPLING A MEMORY MODULE TO A CIRCUIT BOARD, AND ASS...
- Publication number 20240306331
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-POWER COOLING DEVICE FOR UNDERWATER DATACENTER
- Publication number 20240284638
- Publication date Aug 22, 2024
- KOREA INSTITUTE OF OCEAN SCIENCE & TECHNOLOGY
- Taek Hee HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Immersion Cooling Reservoir Level Control
- Publication number 20240251531
- Publication date Jul 25, 2024
- GREEN REVOLUTION COOLING, INC.
- John H. BEAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOP COVER STRUCTURE FOR LIQUID COOLING BOX BODY OF DATA ROOM
- Publication number 20240244791
- Publication date Jul 18, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR PER-TENANT REDUNDANT THERMAL MANAGEMENT USING...
- Publication number 20240237298
- Publication date Jul 11, 2024
- Dell Products L.P.
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENVIRONMENTALLY HARDENED COLD PLATE FOR USE IN LIQUID COOLING OF EL...
- Publication number 20240237300
- Publication date Jul 11, 2024
- STRATEGIC THERMAL LABS, LLC
- AUSTIN MICHAEL SHELNUTT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STANDALONE AND SCALABLE LIQUID COOLING MODULES
- Publication number 20240237299
- Publication date Jul 11, 2024
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DETECTING CIRCUIT BOARD, POWER DETECTING SYSTEM, AND IMMERSED...
- Publication number 20240223099
- Publication date Jul 4, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- DUO QIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID-COOLING SYSTEM INCLUDING MONITORING AND ALERTING MODULE, MON...
- Publication number 20240188251
- Publication date Jun 6, 2024
- WISTRON CORP.
- CHIH CHENG LEE
- G08 - SIGNALLING
Information Patent Application
COOLING DEVICE AND COOLING METHOD APPLIED TO RACK SERVER
- Publication number 20240147673
- Publication date May 2, 2024
- SUPER MICRO COMPUTER, INC.
- Chia-Wei CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STANDALONE AND SCALABLE LIQUID COOLING MODULES
- Publication number 20240138120
- Publication date Apr 25, 2024
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR PER-TENANT REDUNDANT THERMAL MANAGEMENT USING...
- Publication number 20240138119
- Publication date Apr 25, 2024
- Dell Products L.P.
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENVIRONMENTALLY HARDENED COLD PLATE FOR USE IN LIQUID COOLING OF EL...
- Publication number 20240138121
- Publication date Apr 25, 2024
- STRATEGIC THERMAL LABS, LLC
- AUSTIN MICHAEL SHELNUTT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID COOLING SYSTEM FOR COMPUTER CABINETS
- Publication number 20240130088
- Publication date Apr 18, 2024
- POLINKE INTERNATIONAL CO., LTD.
- CHUN-LIN CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBMERSIBLE DATA CENTER MOUNTABLE ON A SUBMERSIBLE PLATFORM
- Publication number 20240125078
- Publication date Apr 18, 2024
- KAI LI
- E02 - HYDRAULIC ENGINEERING FOUNDATIONS SOIL SHIFTING
Information Patent Application
ADAPTIVE CASCADE COOLING METHOD FOR DATACENTERS
- Publication number 20240130089
- Publication date Apr 18, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Munther Salim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR A COOLING SYSTEM
- Publication number 20240130078
- Publication date Apr 18, 2024
- Microsoft Technology Licensing, LLC
- Fang DONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SERVER APPARATUS AND SOLID-STATE STORAGE DEVICE THEREOF
- Publication number 20240121921
- Publication date Apr 11, 2024
- SHANNON SYSTEMS LTD.
- Jiangshan LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANIFOLD FOR LIQUID COOLED COMPUTING SYSTEMS
- Publication number 20240114649
- Publication date Apr 4, 2024
- ZT Group Int’l, Inc. dba ZT Systems
- Sruti Chigullapalli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID COOLING APPARATUS
- Publication number 20240081020
- Publication date Mar 7, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Xuefeng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND MOBILE UNIT FOR FLEXIBLE ENERGY OPTIMISATION BETWEEN COM...
- Publication number 20240074117
- Publication date Feb 29, 2024
- Sustainable Data Farming B.V.
- Jacob Jan Ten Wolde
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM WITH FIRST AND SECOND PRIMARY LOOPS
- Publication number 20240064931
- Publication date Feb 22, 2024
- Intel Corporation
- Jimmy CHUANG
- G06 - COMPUTING CALCULATING COUNTING

Liquid cooling without phase change

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Rack system for housing at least one immersion case

Manifold for liquid cooled computing systems

Rack system for housing an electronic device

Liquid submerged, horizontal computer server rack and systems and m...

Data center rack system with integrated liquid and dielectric immer...

Adjustable fluid coupling in datacenter cooling systems

Smart cold plate for redundant liquid cooling loops

Integrated server flow-through fixture with state sensor for datace...

Space-saving high-density modular data systems and energy-efficient...

Cooled electronic system

Coolant-cooled heat sink(s) with associated ultra-violet light asse...

Liquid collection, detection and containment system for liquid cool...

Leakage detection system

Interfaces for coupling a memory module to a circuit board, and ass...

Adaptive cascade cooling method for datacenters

Server device

Optimization of thermal management control of lithium-ion battery s...

Redundant isolation of rack manifolds for datacenter cooling systems

Immersion cooling system in miniaturized form

Multi-compartment electrical apparatus with shared cooling assembly

Rack liquid distribution system with redundant design

Hybrid single-phase/two-phase cooling loop to enhance cooling of co...

Server design with high reliability cooling hardware

Constant temperature closed-loop airflow containment

Providing continuous cooling to a storage rack

Cooling system of server

Row based thermal management system

Disconnects

Redundant module and systems for high density servers

Hot plug redundant pump for cooling system

Patents Applicationslast 30 patents

COOLANT FLOW PARTITION FOR COOLING 3U BOARDS IN 6U CHASSIS

FLOW MANAGEMENT IN A HEAT-GENERATING DEVICE

SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES

ORGANIC HEAT TRANSFER SYSTEM, METHOD AND FLUID

NOVEL USE FOR COOLANTS WITH LOW ELECTRICAL CONDUCTIVITY

SMART COLD PLATE FOR REDUNDANT LIQUID COOLING LOOPS

PRESSURE PROTECTION DEVICE AND IMMERSION COOLING DEVICE

IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...

INTERFACES FOR COUPLING A MEMORY MODULE TO A CIRCUIT BOARD, AND ASS...

NON-POWER COOLING DEVICE FOR UNDERWATER DATACENTER

Immersion Cooling Reservoir Level Control

TOP COVER STRUCTURE FOR LIQUID COOLING BOX BODY OF DATA ROOM

SYSTEM AND METHOD FOR PER-TENANT REDUNDANT THERMAL MANAGEMENT USING...

ENVIRONMENTALLY HARDENED COLD PLATE FOR USE IN LIQUID COOLING OF EL...

STANDALONE AND SCALABLE LIQUID COOLING MODULES

POWER DETECTING CIRCUIT BOARD, POWER DETECTING SYSTEM, AND IMMERSED...

LIQUID-COOLING SYSTEM INCLUDING MONITORING AND ALERTING MODULE, MON...

COOLING DEVICE AND COOLING METHOD APPLIED TO RACK SERVER

STANDALONE AND SCALABLE LIQUID COOLING MODULES

SYSTEM AND METHOD FOR PER-TENANT REDUNDANT THERMAL MANAGEMENT USING...

ENVIRONMENTALLY HARDENED COLD PLATE FOR USE IN LIQUID COOLING OF EL...

FLUID COOLING SYSTEM FOR COMPUTER CABINETS

SUBMERSIBLE DATA CENTER MOUNTABLE ON A SUBMERSIBLE PLATFORM

ADAPTIVE CASCADE COOLING METHOD FOR DATACENTERS

DEVICES, SYSTEMS, AND METHODS FOR A COOLING SYSTEM

SERVER APPARATUS AND SOLID-STATE STORAGE DEVICE THEREOF

MANIFOLD FOR LIQUID COOLED COMPUTING SYSTEMS

LIQUID COOLING APPARATUS

METHOD AND MOBILE UNIT FOR FLEXIBLE ENERGY OPTIMISATION BETWEEN COM...

IMMERSION COOLING SYSTEM WITH FIRST AND SECOND PRIMARY LOOPS