Localised curing of parts of the layer connector

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CPC
H01L2224/83859

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83859Localised curing of parts of the layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing electronic device
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- Issue date Aug 29, 2023
- Innolux Corporation
- Yi-An Chen
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Dielectric-dielectric and metallization bonding via plasma activati...
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Employing deformable contacts and pre-applied underfill for bonding...
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- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
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- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
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- Issue date Jan 17, 2023
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and its process for curing post-applied underfill ma...
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- Issue date Aug 2, 2022
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- Jeb Wu
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Dielectric-dielectric and metallization bonding via plasma activati...
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- Issue date Jun 28, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
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- Issue date Oct 13, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically bonded arrays of transfer printed active components
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- Issue date Jun 2, 2015
- Semprius, Inc.
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-engineered interconnect packages with activator-assisted molds
- Patent number 8,652,878
- Issue date Feb 18, 2014
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-engineered interconnect packages with activator-assisted molds
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- Issue date Mar 26, 2013
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device and method for manufacturing same
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- Kazuhiro Nishikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Information Patent Grant
Method for establishing anisotropic conductive connection and aniso...
- Patent number 7,655,107
- Issue date Feb 2, 2010
- Sony Corporation
- Misao Konishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 7,560,819
- Issue date Jul 14, 2009
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for stress reduction in flip chip microelectro...
- Patent number 7,498,198
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Sylvie S. Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting semiconductor chip
- Patent number 7,394,163
- Issue date Jul 1, 2008
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 7,332,371
- Issue date Feb 19, 2008
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 7,198,984
- Issue date Apr 3, 2007
- Seiko Epson Corporation
- Nobuaki Hasimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of reducing bleed-out of underfill and adhesive materials
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- Issue date Nov 28, 2006
- Intel Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
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System and method for accelerated detection of transient particle i...
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- Issue date Feb 7, 2006
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- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 6,972,381
- Issue date Dec 6, 2005
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing semiconductor device
- Patent number 6,966,964
- Issue date Nov 22, 2005
- Matsushita Electric Industrial Co., Ltd.
- Koujiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor device and semiconductor device
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- Issue date Aug 9, 2005
- Lintec Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof, circuit boa...
- Patent number 6,763,994
- Issue date Jul 20, 2004
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill process for flip-chip device
- Patent number 6,703,299
- Issue date Mar 9, 2004
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,583,512
- Issue date Jun 24, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- Publication number 20200402867
- Publication date Dec 24, 2020
- V TECHNOLOGY CO., LTD.
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- H01 - BASIC ELECTRIC ELEMENTS
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CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER
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- Publication date Dec 17, 2020
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
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SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER
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- Publication date Dec 17, 2020
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DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
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- Facebook Technologies, LLC
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- H01 - BASIC ELECTRIC ELEMENTS
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STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS
- Publication number 20130196471
- Publication date Aug 1, 2013
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS
- Publication number 20130153277
- Publication date Jun 20, 2013
- Etienne Menard
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LASER ASSISTED TRANSFER WELDING PROCESS
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- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
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STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS
- Publication number 20100295165
- Publication date Nov 25, 2010
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20090133900
- Publication date May 28, 2009
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Kazuhiro Nishikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
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- Publication number 20090039291
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STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRO...
- Publication number 20080265435
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- International Business Machines Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20070132099
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- Publication number 20070068622
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of reducing bleed-out of underfill and adhesive materials
- Publication number 20050118748
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- Mahesh Sambasivam
- H01 - BASIC ELECTRIC ELEMENTS
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Process for producing semiconductor device and semiconductor device
- Publication number 20050009241
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Semiconductor device and method of manufacture thereof, circuit boa...
- Publication number 20040256739
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Underfill process for flip-chip device
- Publication number 20040159945
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Semiconductor device and method for fabricating the same
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Semiconductor device and method for fabricating the same
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Semiconductor device and method for fabricating the same
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF, CIRCUIT BOA...
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Localised curing of parts of the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing electronic device

Dielectric-dielectric and metallization bonding via plasma activati...

Employing deformable contacts and pre-applied underfill for bonding...

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Display device and its process for curing post-applied underfill ma...

Dielectric-dielectric and metallization bonding via plasma activati...

Laser assisted transfer welding process

Flip-chip assembly process comprising pre-coating interconnect elem...

Laser assisted transfer welding process

Electrically bonded arrays of transfer printed active components

Stress-engineered interconnect packages with activator-assisted molds

Stress-engineered interconnect packages with activator-assisted molds

Electronic circuit device and method for manufacturing same

Semiconductor device and method of manufacture thereof, circuit boa...

Method for establishing anisotropic conductive connection and aniso...

Semiconductor device and method of manufacture thereof, circuit boa...

Structure and method for stress reduction in flip chip microelectro...

Method of mounting semiconductor chip

Semiconductor device and method of manufacture thereof, circuit boa...

Semiconductor device and method of manufacture thereof, circuit boa...

Methods of reducing bleed-out of underfill and adhesive materials

System and method for accelerated detection of transient particle i...

Semiconductor device, circuit board and electronic instrument that...

Semiconductor device and method of manufacture thereof, circuit boa...

Method and apparatus for manufacturing semiconductor device

Process for producing semiconductor device and semiconductor device

Semiconductor device and method of manufacture thereof, circuit boa...

Underfill process for flip-chip device

Semiconductor device and method for fabricating the same

Patents Applicationslast 30 patents

Method For Manufacturing Led Display

CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER

SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS

ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS

LASER ASSISTED TRANSFER WELDING PROCESS

STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS

ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME

Mounting method, electric part-mounted substrate and an electric de...

STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRO...

Semiconductor device and method of manufacture thereof, circuit boa...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF, CIRCUIT BOA...

Method for establishing anisotropic conductive connection and aniso...

Semiconductor device and method of manufacture thereof, circuit boa...

Semiconductor device and method of manufacture thereof, circuit boa...

Methods of reducing bleed-out of underfill and adhesive materials

Process for producing semiconductor device and semiconductor device

Semiconductor device and method of manufacture thereof, circuit boa...

Underfill process for flip-chip device

Method and apparatus for manufacturing semiconductor device

Semiconductor device and method for fabricating the same

Underfill process for flip-chip device

Semiconductor device and method of manufacture thereof, circuit boa...

Semiconductor device and method of manufacture thereof, circuit boa...

Method of mounting semiconductor chip

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF, CIRCUIT BOA...