Located in a dummy or reference die

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H01L2223/54466

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/54466Located in a dummy or reference die

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Template, workpiece, and alignment method
- Patent number 12,078,922
- Issue date Sep 3, 2024
- Kioxia Corporation
- Takashi Sato
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Dummy patterns in redundant region of double seal ring
- Patent number 11,728,229
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recognition method for photolithography process and semiconductor d...
- Patent number 11,682,557
- Issue date Jun 20, 2023
- Winbond Electronics Corp.
- Chih-Yu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing MEMS transducer, MEMS transducer, ultrasound p...
- Patent number 11,369,345
- Issue date Jun 28, 2022
- Konica Minolta, Inc.
- Yuta Nakayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mirror die image recognition system, reference die setting system,...
- Patent number 11,030,734
- Issue date Jun 8, 2021
- FUJI CORPORATION
- Tomonori Iwase
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for hierarchical exposure of an integrated circ...
- Patent number 10,923,456
- Issue date Feb 16, 2021
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay structures
- Patent number 10,483,214
- Issue date Nov 19, 2019
- GLOBALFOUNDRIES Inc.
- Xintuo Dai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and system for achieving semiconductor-based circuits or sys...
- Patent number 10,141,227
- Issue date Nov 27, 2018
- NXP USA, INC.
- Jose Luis Suarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer
- Patent number 9,589,902
- Issue date Mar 7, 2017
- SII Semiconductor Corporation
- Yasunobu Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing apparatus using charged particles and device manufacturing...
- Patent number 9,406,480
- Issue date Aug 2, 2016
- Ebara Corporation
- Nobuharu Noji
- G01 - MEASURING TESTING
Information Patent Grant
Electronic assembly with detachable components
- Patent number 9,253,894
- Issue date Feb 2, 2016
- Wintec Industries, Inc.
- Kong-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer and a method of dicing a wafer
- Patent number 9,041,162
- Issue date May 26, 2015
- Infineon Technologies AG
- Giuseppe Miccoli
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for producing a two-chip assembly and corresponding two-chip...
- Patent number 8,835,222
- Issue date Sep 16, 2014
- Robert Bosch GmbH
- Mathias Bruendel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Testing apparatus using charged particles and device manufacturing...
- Patent number 8,742,341
- Issue date Jun 3, 2014
- Ebara Corporation
- Nobuharu Noji
- G01 - MEASURING TESTING
Information Patent Grant
Orientation of an electronic CMOS structure with respect to a burie...
- Patent number 8,691,658
- Issue date Apr 8, 2014
- X-Fab Semiconductor Foundries AG.
- Holger Klingner
- G01 - MEASURING TESTING
Information Patent Grant
Wafer and a method of dicing a wafer
- Patent number 8,680,653
- Issue date Mar 25, 2014
- Infineon Technologies AG
- Giuseppe Miccoli
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus for generating reticle data
- Patent number 8,513,777
- Issue date Aug 20, 2013
- Fujitsu Semiconductor Limited
- Kenji Suzuki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integrated circuits on a wafer and method for separating integrated...
- Patent number 8,415,769
- Issue date Apr 9, 2013
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-segmented alignment mark arrangement
- Patent number 8,203,692
- Issue date Jun 19, 2012
- ASML Netherlands B.V.
- Sami Musa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for producing a semiconductor wafer with rear side identific...
- Patent number 8,173,534
- Issue date May 8, 2012
- Infineon Technologies AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate including alignment columnar member and plural protection...
- Patent number 8,053,910
- Issue date Nov 8, 2011
- Oki Semiconductor Co., Ltd.
- Tomoyuki Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having alignment post electrode and method of...
- Patent number 7,944,064
- Issue date May 17, 2011
- Casio Computer Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark and method of getting position reference for wafer
- Patent number 7,916,295
- Issue date Mar 29, 2011
- Macronix International Co., Ltd.
- Chiao-Wen Yeh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor wafer with rear side identification and method
- Patent number 7,911,036
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for indexing dice
- Patent number 7,868,474
- Issue date Jan 11, 2011
- STMicroelectronics, SRL
- Daniele Alfredo Brambilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Network electronic component, semiconductor device incorporating ne...
- Patent number 7,808,073
- Issue date Oct 5, 2010
- Casio Computer Co., Ltd.
- Shinji Wakisaka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Testing apparatus using charged particles and device manufacturing...
- Patent number 7,741,601
- Issue date Jun 22, 2010
- Ebara Corporation
- Nobuharu Noji
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor substrate having reference semiconductor chip and met...
- Patent number 7,618,832
- Issue date Nov 17, 2009
- Samsung Electronics Co., Ltd.
- Sang-moon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attaching method
- Patent number 7,582,542
- Issue date Sep 1, 2009
- Samsung Electronics Co., Ltd.
- Dae-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer registration and dimensional test mark for scatterometr...
- Patent number 7,492,049
- Issue date Feb 17, 2009
- LSI Corporation
- Phong Thanh Do
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dummy Patterns in Redundant Region of Double Seal Ring
- Publication number 20230369148
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR FABRICATING A SEMICONDUCTOR WAFER
- Publication number 20230282596
- Publication date Sep 7, 2023
- Infineon Technologies Austria AG
- Andreas Kleinbichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20220399282
- Publication date Dec 15, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Patterns in Redundant Region of Double Seal Ring
- Publication number 20220310464
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOGNITION METHOD FOR PHOTOLITHOGRAPHY PROCESS AND SEMICONDUCTOR D...
- Publication number 20210391167
- Publication date Dec 16, 2021
- WINBOND ELECTRONICS CORP.
- Chih-Yu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HIERARCHICAL EXPOSURE OF AN INTEGRATED CIRC...
- Publication number 20210167037
- Publication date Jun 3, 2021
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIRROR DIE IMAGE RECOGNITION SYSTEM, REFERENCE DIE SETTING SYSTEM,...
- Publication number 20190392574
- Publication date Dec 26, 2019
- FUJI CORPORATION
- Tomonori IWASE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OVERLAY STRUCTURES
- Publication number 20190206802
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES INC.
- Xintuo DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer and a Method of Dicing a Wafer
- Publication number 20140167226
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Giuseppe Miccoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING APPARATUS USING CHARGED PARTICLES AND DEVICE MANUFACTURING...
- Publication number 20140158885
- Publication date Jun 12, 2014
- EBARA CORPORATION
- Nobuharu Noji
- G01 - MEASURING TESTING
Information Patent Application
Electronic Assembly with Detachable Components
- Publication number 20130342998
- Publication date Dec 26, 2013
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer Adapted to Support Transparency in Partial Wafe...
- Publication number 20130214388
- Publication date Aug 22, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Balamurugan Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a two-chip assembly and corresponding two-chip...
- Publication number 20130082406
- Publication date Apr 4, 2013
- ROBERT BOSCH GmbH
- Mathias BRUENDEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MARKING SiC SEMICONDUCTOR WAFER AND SiC SEMICONDUCTOR WAFER
- Publication number 20120223335
- Publication date Sep 6, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Noriaki TSUCHIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORIENTATION OF AN ELECTRONIC CMOS STRUCTURE WITH RESPECT TO A BURIE...
- Publication number 20110250732
- Publication date Oct 13, 2011
- Holger Klingner
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR WAFER WITH REAR SIDE IDENTIFIC...
- Publication number 20110147471
- Publication date Jun 23, 2011
- INFINEON TECHNOLOGIES AG
- Stephan Bradl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuits On A Wafer and Method For Separating Integrated...
- Publication number 20100270655
- Publication date Oct 28, 2010
- NXP B.V.
- Heimo Scheucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Testing apparatus using charged particles and device manufacturing...
- Publication number 20100237243
- Publication date Sep 23, 2010
- EBARA CORPORATION
- Nobuharu Noji
- G01 - MEASURING TESTING
Information Patent Application
ALIGNMENT MARK AND METHOD OF GETTING POSITION REFERENCE FOR WAFER
- Publication number 20100053616
- Publication date Mar 4, 2010
- Macronix International Co., Ltd.
- Chiao-Wen Yeh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD AND APPARATUS FOR GENERATING RETICLE DATA
- Publication number 20090321891
- Publication date Dec 31, 2009
- Fujitsu Microelectronics Limited
- Kenji Suzuki
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SUB-SEGMENTED ALIGNMENT MARK ARRANGEMENT
- Publication number 20090310113
- Publication date Dec 17, 2009
- ASML NETHERLANDS B.V.
- Sami Musa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20090302486
- Publication date Dec 10, 2009
- Oki Semiconductor Co., Ltd.
- Tomoyuki Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structures for Indexing Dice
- Publication number 20090146326
- Publication date Jun 11, 2009
- STMicroelectronics S.r.l.
- Daniele Alfredo Brambilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer and a Method of Dicing a Wafer
- Publication number 20090121321
- Publication date May 14, 2009
- Giuseppe Miccoli
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Testing apparatus using charged particles and device manufacturing...
- Publication number 20090101816
- Publication date Apr 23, 2009
- EBARA CORPORATION
- Nobuharu Noji
- G01 - MEASURING TESTING
Information Patent Application
Structure and Method for Device-Specific Fill for Improved Anneal U...
- Publication number 20090096066
- Publication date Apr 16, 2009
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate processing method and apparatus
- Publication number 20090000549
- Publication date Jan 1, 2009
- Xinming Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and structures for indexing dice
- Publication number 20080153250
- Publication date Jun 26, 2008
- STMicroelectronics S.r.l.
- Daniele Alfredo Brambilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER REGISTRATION AND DIMENSIONAL TEST MARK FOR SCATTEROMETR...
- Publication number 20070246844
- Publication date Oct 25, 2007
- Phong Thanh Do
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Electronic assembly with detachable components
- Publication number 20070187844
- Publication date Aug 16, 2007
- Wintec Industries, Inc.
- Kong-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Located in a dummy or reference die

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Template, workpiece, and alignment method

Dummy patterns in redundant region of double seal ring

Recognition method for photolithography process and semiconductor d...

Method for producing MEMS transducer, MEMS transducer, ultrasound p...

Mirror die image recognition system, reference die setting system,...

Systems and methods for hierarchical exposure of an integrated circ...

Overlay structures

Method and system for achieving semiconductor-based circuits or sys...

Semiconductor wafer

Testing apparatus using charged particles and device manufacturing...

Electronic assembly with detachable components

Wafer and a method of dicing a wafer

Method for producing a two-chip assembly and corresponding two-chip...

Testing apparatus using charged particles and device manufacturing...

Orientation of an electronic CMOS structure with respect to a burie...

Wafer and a method of dicing a wafer

Method and apparatus for generating reticle data

Integrated circuits on a wafer and method for separating integrated...

Sub-segmented alignment mark arrangement

Method for producing a semiconductor wafer with rear side identific...

Substrate including alignment columnar member and plural protection...

Semiconductor device having alignment post electrode and method of...

Alignment mark and method of getting position reference for wafer

Semiconductor wafer with rear side identification and method

Method and structures for indexing dice

Network electronic component, semiconductor device incorporating ne...

Testing apparatus using charged particles and device manufacturing...

Semiconductor substrate having reference semiconductor chip and met...

Die attaching method

Multi-layer registration and dimensional test mark for scatterometr...

Patents Applicationslast 30 patents

Dummy Patterns in Redundant Region of Double Seal Ring

SEMICONDUCTOR WAFER AND METHOD FOR FABRICATING A SEMICONDUCTOR WAFER

LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME

Dummy Patterns in Redundant Region of Double Seal Ring

RECOGNITION METHOD FOR PHOTOLITHOGRAPHY PROCESS AND SEMICONDUCTOR D...

SYSTEMS AND METHODS FOR HIERARCHICAL EXPOSURE OF AN INTEGRATED CIRC...

MIRROR DIE IMAGE RECOGNITION SYSTEM, REFERENCE DIE SETTING SYSTEM,...

OVERLAY STRUCTURES

Wafer and a Method of Dicing a Wafer

TESTING APPARATUS USING CHARGED PARTICLES AND DEVICE MANUFACTURING...

Electronic Assembly with Detachable Components

Semiconductor Wafer Adapted to Support Transparency in Partial Wafe...

Method for producing a two-chip assembly and corresponding two-chip...

METHOD OF MARKING SiC SEMICONDUCTOR WAFER AND SiC SEMICONDUCTOR WAFER

ORIENTATION OF AN ELECTRONIC CMOS STRUCTURE WITH RESPECT TO A BURIE...

METHOD FOR PRODUCING A SEMICONDUCTOR WAFER WITH REAR SIDE IDENTIFIC...

Integrated Circuits On A Wafer and Method For Separating Integrated...

Testing apparatus using charged particles and device manufacturing...

ALIGNMENT MARK AND METHOD OF GETTING POSITION REFERENCE FOR WAFER

METHOD AND APPARATUS FOR GENERATING RETICLE DATA

SUB-SEGMENTED ALIGNMENT MARK ARRANGEMENT

SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF

Method and Structures for Indexing Dice

Wafer and a Method of Dicing a Wafer

Testing apparatus using charged particles and device manufacturing...

Structure and Method for Device-Specific Fill for Improved Anneal U...

Substrate processing method and apparatus

Method and structures for indexing dice

MULTI-LAYER REGISTRATION AND DIMENSIONAL TEST MARK FOR SCATTEROMETR...

Electronic assembly with detachable components