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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/5446Located in scribe lines

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laser processing device, laser processing system and laser processi...
- Patent number 12,191,168
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Hirotoshi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and manufacturing method of semiconductor s...
- Patent number 12,191,263
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining overlay error during semiconductor fabrication
- Patent number 12,117,735
- Issue date Oct 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Template, workpiece, and alignment method
- Patent number 12,078,922
- Issue date Sep 3, 2024
- Kioxia Corporation
- Takashi Sato
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor substrate and method of sawing the same
- Patent number 12,062,626
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,672
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer having an auxiliary structure positioned in a s...
- Patent number 12,046,563
- Issue date Jul 23, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and semiconductor chip
- Patent number 12,046,514
- Issue date Jul 23, 2024
- Kioxia Corporation
- Mika Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark structure and method for making
- Patent number 12,033,951
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Marks for overlay measurement and overlay error correction
- Patent number 12,002,765
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Shih-Yuan Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device, semiconductor package, a...
- Patent number 11,990,373
- Issue date May 21, 2024
- SOCIONEXT INC.
- Toyoji Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,948,896
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 11,929,285
- Issue date Mar 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system, memory chip unit, and wafer
- Patent number 11,923,325
- Issue date Mar 5, 2024
- Kioxia Corporation
- Yasuhito Yoshimizu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Protective coating for plasma dicing
- Patent number 11,908,741
- Issue date Feb 20, 2024
- Plasma-Therm LLC
- Russell Westerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structure having alignment mar...
- Patent number 11,901,305
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Kuo-Hung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having vias on a scribe lane region
- Patent number 11,876,043
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Jooncheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite and transistor
- Patent number 11,869,980
- Issue date Jan 9, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die cleaning systems and related methods
- Patent number 11,854,889
- Issue date Dec 26, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 11,824,015
- Issue date Nov 21, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 11,823,941
- Issue date Nov 21, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding method for workpiece
- Patent number 11,823,942
- Issue date Nov 21, 2023
- Disco Corporation
- Naoko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,817,399
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatuses and methods including patterns in scribe regions of sem...
- Patent number 11,810,822
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,804,446
- Issue date Oct 31, 2023
- SK Hynix Inc.
- Hyung Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scribe structure for memory device
- Patent number 11,769,736
- Issue date Sep 26, 2023
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20250022807
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Joon Seuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TEST PATTERN
- Publication number 20250006654
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Seunghye BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240429093
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED DRAIN
- Publication number 20240395868
- Publication date Nov 28, 2024
- NEXPERIA B.V.
- Shih-Hsuan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
- Publication number 20240387312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY
- Publication number 20240379578
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongyu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICING FOR SEMICONDUCTOR DEVICE FABRICATION
- Publication number 20240371824
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Yichen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20240363743
- Publication date Oct 31, 2024
- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- XIAOFENG QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240347506
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240321766
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Manhee HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MARK STRUCTURE AND METHOD FOR MAKING
- Publication number 20240321767
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATING METHOD, MEMORY DEVICE AND DEVICE...
- Publication number 20240312925
- Publication date Sep 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Ping Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED LASER AND PLASMA ETCH DICING
- Publication number 20240266220
- Publication date Aug 8, 2024
- Jonathan Bryant MELLEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR MECHANICAL SELF-ALIGNMENT AND SLIP-RESISTANCE IN BONDIN...
- Publication number 20240258244
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Joanna Nassar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258173
- Publication date Aug 1, 2024
- Mitsuboshi Diamond Industrial Co., Ltd.
- Mitsuru KITAICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, Memory Circuitry Comprising Strings Of Memory...
- Publication number 20240243072
- Publication date Jul 18, 2024
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243102
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240234330
- Publication date Jul 11, 2024
- Power Master Semiconductor Co., Ltd.
- Sangwoo PAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240203906
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS
- Publication number 20240186182
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCRIBE LANE REINFORCEMENT
- Publication number 20240170411
- Publication date May 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE PACKAGE HAVING SCRIBE LINE AND METHOD FOR MANUFACTURI...
- Publication number 20240170410
- Publication date May 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE PACKAGE HAVING SCRIBE LINE AND METHOD FOR MANUFACTURI...
- Publication number 20240170412
- Publication date May 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT OF SCRIBE LINE FEATURES
- Publication number 20240145401
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Ching Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER INCLUDING MONITORING PATTERN STRUCTURE WITH COV...
- Publication number 20240145399
- Publication date May 2, 2024
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136301
- Publication date Apr 25, 2024
- Power Master Semiconductor Co., Ltd.
- Sangwoo PAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE AND TRANSISTOR
- Publication number 20240113231
- Publication date Apr 4, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME
- Publication number 20240096813
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- KAZUKO YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS

Located in scribe lines

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laser processing device, laser processing system and laser processi...

Semiconductor structure and manufacturing method of semiconductor s...

Through-substrate via structure and method of manufacture

Method of determining overlay error during semiconductor fabrication

Apparatus for stacking substrates and method for the same

Template, workpiece, and alignment method

Semiconductor substrate and method of sawing the same

Semiconductor device and method for manufacturing semiconductor device

Package structure and method of forming the same

Semiconductor wafer having an auxiliary structure positioned in a s...

Semiconductor wafer and semiconductor chip

Alignment mark structure and method for making

Marks for overlay measurement and overlay error correction

Method for producing semiconductor device, semiconductor package, a...

Package structure

Backside metal patterning die singulation system and related methods

Storage system, memory chip unit, and wafer

Protective coating for plasma dicing

Method for fabricating semiconductor structure having alignment mar...

Semiconductor devices having vias on a scribe lane region

Composite and transistor

Die cleaning systems and related methods

Structure and method for sealing a silicon IC

Method of processing a substrate

Thermocompression bonding method for workpiece

Semiconductor device

Semiconductor structure including buffer layer

Apparatuses and methods including patterns in scribe regions of sem...

Semiconductor device

Scribe structure for memory device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE HAVING TEST PATTERN

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

SEMICONDUCTOR DEVICE WITH ENHANCED DRAIN

SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS

SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY

PLASMA DICING FOR SEMICONDUCTOR DEVICE FABRICATION

IGBT DEVICE AND PREPARATION METHOD THEREOF

METHOD OF FORMING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

ALIGNMENT MARK STRUCTURE AND METHOD FOR MAKING

SEMICONDUCTOR DEVICE, FABRICATING METHOD, MEMORY DEVICE AND DEVICE...

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

INTEGRATED LASER AND PLASMA ETCH DICING

METHODS FOR MECHANICAL SELF-ALIGNMENT AND SLIP-RESISTANCE IN BONDIN...

SEMICONDUCTOR DEVICE

Integrated Circuitry, Memory Circuitry Comprising Strings Of Memory...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEM AND RELATED METHODS

SCRIBE LANE REINFORCEMENT

MEMORY DEVICE PACKAGE HAVING SCRIBE LINE AND METHOD FOR MANUFACTURI...

MEMORY DEVICE PACKAGE HAVING SCRIBE LINE AND METHOD FOR MANUFACTURI...

LAYOUT OF SCRIBE LINE FEATURES

SEMICONDUCTOR WAFER INCLUDING MONITORING PATTERN STRUCTURE WITH COV...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

COMPOSITE AND TRANSISTOR

ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME