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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/5446Located in scribe lines

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure with crack-blocking three-dimensional struc...
- Patent number 12,347,790
- Issue date Jul 1, 2025
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 12,341,069
- Issue date Jun 24, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy patterns in redundant region of double seal ring
- Patent number 12,341,071
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,341,067
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Meng-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large die wafer, large die and method of forming the same
- Patent number 12,322,707
- Issue date Jun 3, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,708
- Issue date Jun 3, 2025
- Renesas Electronics Corporation
- Takehirou Mariko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with fuse structure in scribe lane and method of...
- Patent number 12,315,800
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Donghwa Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Composite and transistor
- Patent number 12,283,633
- Issue date Apr 22, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming a chip package having first and...
- Patent number 12,272,712
- Issue date Apr 8, 2025
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,261,131
- Issue date Mar 25, 2025
- Fuji Electric Co., Ltd.
- Tsuneyuki Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 12,261,132
- Issue date Mar 25, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die cleaning systems and related methods
- Patent number 12,230,543
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and semiconductor dies formed therefrom includi...
- Patent number 12,224,248
- Issue date Feb 11, 2025
- SanDisk Technologies, Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece and system for processing a workpiece
- Patent number 12,224,207
- Issue date Feb 11, 2025
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing device, laser processing system and laser processi...
- Patent number 12,191,168
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Hirotoshi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and manufacturing method of semiconductor s...
- Patent number 12,191,263
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining overlay error during semiconductor fabrication
- Patent number 12,117,735
- Issue date Oct 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Template, workpiece, and alignment method
- Patent number 12,078,922
- Issue date Sep 3, 2024
- Kioxia Corporation
- Takashi Sato
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor substrate and method of sawing the same
- Patent number 12,062,626
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,672
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer having an auxiliary structure positioned in a s...
- Patent number 12,046,563
- Issue date Jul 23, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and semiconductor chip
- Patent number 12,046,514
- Issue date Jul 23, 2024
- Kioxia Corporation
- Mika Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark structure and method for making
- Patent number 12,033,951
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Marks for overlay measurement and overlay error correction
- Patent number 12,002,765
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Shih-Yuan Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device, semiconductor package, a...
- Patent number 11,990,373
- Issue date May 21, 2024
- SOCIONEXT INC.
- Toyoji Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,948,896
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250233021
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174556
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jitaek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE AND TRANSISTOR
- Publication number 20250169114
- Publication date May 22, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING OVERLAY MARKS
- Publication number 20250167130
- Publication date May 22, 2025
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250167054
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250149386
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Ensuring the Integrity of Semiconductor Devices From Waf...
- Publication number 20250125278
- Publication date Apr 17, 2025
- Tracer Validation Inc.
- Matt Bellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SILICON CARBIDE PORTION AND A GLASS STR...
- Publication number 20250096149
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Rudolf Elpelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...
- Publication number 20250098341
- Publication date Mar 20, 2025
- Canon Kabushiki Kaisha
- HIROSHI SEKINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...
- Publication number 20250096171
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE CHIP AND LIGHT-EMITTING DEVICE
- Publication number 20250087594
- Publication date Mar 13, 2025
- Xiamen San'An Optoelectronics Co., Ltd.
- Jenlung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079355
- Publication date Mar 6, 2025
- SK HYNIX INC.
- Woo Sung MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...
- Publication number 20250070052
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250054875
- Publication date Feb 13, 2025
- DENSO CORPORATION
- MASASHI UECHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BEFORE SEMICONDUCTOR PROCESS AND SEMICONDUCTOR CHIP MANUFACTU...
- Publication number 20250046727
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Jeongdu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS
- Publication number 20250046729
- Publication date Feb 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Hong Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE CHIPLET AND LIGHT-EMITTI...
- Publication number 20250029934
- Publication date Jan 23, 2025
- XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- Gong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20250022807
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Joon Seuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TEST PATTERN
- Publication number 20250006654
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Seunghye BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240429093
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED DRAIN
- Publication number 20240395868
- Publication date Nov 28, 2024
- NEXPERIA B.V.
- Shih-Hsuan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
- Publication number 20240387312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY
- Publication number 20240379578
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongyu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICING FOR SEMICONDUCTOR DEVICE FABRICATION
- Publication number 20240371824
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Yichen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20240363743
- Publication date Oct 31, 2024
- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- XIAOFENG QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240347506
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Located in scribe lines

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure with crack-blocking three-dimensional struc...

Backside metal patterning die singulation system and related methods

Dummy patterns in redundant region of double seal ring

Manufacturing method of semiconductor device

Large die wafer, large die and method of forming the same

Semiconductor device

Semiconductor chip with fuse structure in scribe lane and method of...

Composite and transistor

Chip package and method for forming a chip package having first and...

Semiconductor device and method of manufacturing semiconductor device

Structure and method for sealing a silicon IC

Die cleaning systems and related methods

Semiconductor device and method of forming micro interconnect struc...

Semiconductor wafer and semiconductor dies formed therefrom includi...

Method of processing a workpiece and system for processing a workpiece

Laser processing device, laser processing system and laser processi...

Semiconductor structure and manufacturing method of semiconductor s...

Method of determining overlay error during semiconductor fabrication

Through-substrate via structure and method of manufacture

Apparatus for stacking substrates and method for the same

Template, workpiece, and alignment method

Semiconductor substrate and method of sawing the same

Semiconductor device and method for manufacturing semiconductor device

Package structure and method of forming the same

Semiconductor wafer having an auxiliary structure positioned in a s...

Semiconductor wafer and semiconductor chip

Alignment mark structure and method for making

Marks for overlay measurement and overlay error correction

Method for producing semiconductor device, semiconductor package, a...

Package structure

Patents Applicationslast 30 patents

DIE CLEANING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

SEMICONDUCTOR PACKAGE

COMPOSITE AND TRANSISTOR

ELECTRONIC DEVICES COMPRISING OVERLAY MARKS

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

DIE CLEANING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

Method for Ensuring the Integrity of Semiconductor Devices From Waf...

SEMICONDUCTOR DEVICE WITH A SILICON CARBIDE PORTION AND A GLASS STR...

PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...

METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...

LIGHT-EMITTING DIODE CHIP AND LIGHT-EMITTING DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

WAFER BEFORE SEMICONDUCTOR PROCESS AND SEMICONDUCTOR CHIP MANUFACTU...

SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS

LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE CHIPLET AND LIGHT-EMITTI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE HAVING TEST PATTERN

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

SEMICONDUCTOR DEVICE WITH ENHANCED DRAIN

SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS

SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY

PLASMA DICING FOR SEMICONDUCTOR DEVICE FABRICATION

IGBT DEVICE AND PREPARATION METHOD THEREOF

METHOD OF FORMING PACKAGE STRUCTURE