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H01L2224/4009

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4009Loop shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module
- Patent number 12,334,466
- Issue date Jun 17, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and semiconductor module
- Patent number 12,315,838
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,068,741
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,063,030
- Issue date Aug 13, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plate-shaped conductor
- Patent number 12,002,782
- Issue date Jun 4, 2024
- Kabushiki Kaisha Toshiba
- Shun Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,936,369
- Issue date Mar 19, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module comprising a first and second connecting eleme...
- Patent number 11,837,571
- Issue date Dec 5, 2023
- Siemens Aktiengesellschaft
- Georg Zaiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,728,801
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
- Patent number 11,706,852
- Issue date Jul 18, 2023
- Illinois Tool Works Inc.
- Marco Carcano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,931
- Issue date Jun 13, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared base plate and semiconductor module provided with same
- Patent number 11,626,347
- Issue date Apr 11, 2023
- Mitsubishi Electric Corporation
- Takashi Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,462,504
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Koichi Tokubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching device and electronic circuit
- Patent number 11,336,275
- Issue date May 17, 2022
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,273
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,270,969
- Issue date Mar 8, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,201,121
- Issue date Dec 14, 2021
- Fuji Electric Co., Ltd.
- Kohei Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power module
- Patent number 11,195,778
- Issue date Dec 7, 2021
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,916,491
- Issue date Feb 9, 2021
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA
- Publication number 20250183221
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Yi Ting Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION
- Publication number 20250096094
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TAB FOR POWER SEMICONDUCTOR MODULE
- Publication number 20250062270
- Publication date Feb 20, 2025
- LITTELFUSE, INC.
- Thomas Lachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE DEVICE
- Publication number 20250022846
- Publication date Jan 16, 2025
- FORCE MOS TECHNOLOGY CO., LTD.
- YUAN-SHUN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240397633
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20240275373
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONN...
- Publication number 20240222311
- Publication date Jul 4, 2024
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240170441
- Publication date May 23, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
- Publication number 20240120308
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS
- Publication number 20240113064
- Publication date Apr 4, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
- Publication number 20240096775
- Publication date Mar 21, 2024
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-In-One Lead Frame Package
- Publication number 20240071878
- Publication date Feb 29, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230411339
- Publication date Dec 21, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230402421
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED STRUCTURE, ELECTRIC POWER CONTROL SYSTEM, AND MANUFACTURIN...
- Publication number 20230395556
- Publication date Dec 7, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Zhihua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230307411
- Publication date Sep 28, 2023
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20230268914
- Publication date Aug 24, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20230268915
- Publication date Aug 24, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC CIRCUIT
- Publication number 20230261647
- Publication date Aug 17, 2023
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230078823
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Shun TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Accessible Metal Clips
- Publication number 20230048878
- Publication date Feb 16, 2023
- Hitachi Energy Switzerland AG
- Juergen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220344253
- Publication date Oct 27, 2022
- Rohm Co., Ltd.
- Maiko HATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220320054
- Publication date Oct 6, 2022
- Rohm Co., Ltd.
- Hiroyuki SAKAIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...
- Publication number 20220302073
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module

Wiring structure and semiconductor module

Switching device and electronic circuit

Semiconductor module with a first substrate, a second substrate and...

Switching device and electronic circuit

Switching device and electronic circuit

Semiconductor module

Semiconductor device

Semiconductor device with plate-shaped conductor

Semiconductor device

Semiconductor module

Semiconductor module

Switching device and electronic circuit

Semiconductor module comprising a first and second connecting eleme...

Semiconductor device

Switching device and electronic circuit

Ribbon bond solution for reducing thermal stress on an intermittent...

Semiconductor package

Shared base plate and semiconductor module provided with same

Power module package and method of manufacturing the same

Semiconductor apparatus

Switching device and electronic circuit

Electronic module

Semiconductor package

Semiconductor device

Electronic power module

Semiconductor device

Power module package

Semiconductor module

Solid top terminal for discrete power devices

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING A LEADFRAME WITH A METAL-PLATED BOND AREA

IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

METAL TAB FOR POWER SEMICONDUCTOR MODULE

MULTI-CHIP PACKAGE DEVICE

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONN...

SEMICONDUCTOR MODULE

STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM

POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE

Two-In-One Lead Frame Package

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

PACKAGED STRUCTURE, ELECTRIC POWER CONTROL SYSTEM, AND MANUFACTURIN...

SEMICONDUCTOR MODULE

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SWITCHING DEVICE AND ELECTRONIC CIRCUIT

SEMICONDUCTOR DEVICE

Power Semiconductor Module with Accessible Metal Clips

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR DEVICE

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...