Low-noise amplifier [LNA]

Industry

CPC
H01L2924/14215

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/14215Low-noise amplifier [LNA]

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,205,851
- Issue date Jan 21, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,040,238
- Issue date Jul 16, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
- Patent number 11,973,033
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,923,825
- Issue date Mar 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to radio-frequency switching devices having improve...
- Patent number 11,901,243
- Issue date Feb 13, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module and communication device
- Patent number 11,881,840
- Issue date Jan 23, 2024
- Murata Manufacturing Co., Ltd.
- Daisuke Miyazaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor-on-insulator transistor layout for radio frequency po...
- Patent number 11,804,435
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing electronic module
- Patent number 11,756,906
- Issue date Sep 12, 2023
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module and communication device
- Patent number 11,476,226
- Issue date Oct 18, 2022
- Murata Manufacturing Co., Ltd.
- Takanori Uejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with shielding struc...
- Patent number 11,270,953
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 11,069,645
- Issue date Jul 20, 2021
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 11,043,432
- Issue date Jun 22, 2021
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module
- Patent number 10,971,459
- Issue date Apr 6, 2021
- Murata Manufacturing Co., Ltd.
- Shinya Hitomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly integrated RF power and power conversion based on Ga2O3 tech...
- Patent number 10,784,245
- Issue date Sep 22, 2020
- United States of America as represented by the Secretary of the Air Force
- Gregg H Jessen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,784,233
- Issue date Sep 22, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,734,356
- Issue date Aug 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave module
- Patent number 10,707,910
- Issue date Jul 7, 2020
- Mitsubishi Electric Corporation
- Yukinobu Tarui
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,651,152
- Issue date May 12, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,593,646
- Issue date Mar 17, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency switches having impr...
- Patent number 10,580,705
- Issue date Mar 3, 2020
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with self-aligned stacked-die assembly
- Patent number 10,529,691
- Issue date Jan 7, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly integrated RF power and power conversion based on Ga2O3 tech...
- Patent number 10,461,068
- Issue date Oct 29, 2019
- The United States of America as represented by the Secretary of the Air Force
- Gregg H Jessen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 10,090,586
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,960,204
- Issue date May 1, 2018
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module component
- Patent number 9,923,542
- Issue date Mar 20, 2018
- Murata Manufacturing Co., Ltd.
- Kenichiro Kikuchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Devices and methods related to radio-frequency switches having impr...
- Patent number 9,837,324
- Issue date Dec 5, 2017
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 9,780,442
- Issue date Oct 3, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linearity performance for radio-frequency switches
- Patent number 9,620,424
- Issue date Apr 11, 2017
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,478,458
- Issue date Oct 25, 2016
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...
- Publication number 20250056880
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE AND MANUFACTURING METHOD OF RADIO FREQUENCY...
- Publication number 20250022816
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Takaya NEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
- Publication number 20250015020
- Publication date Jan 9, 2025
- MURATA MANUFACTURING CO., LTD.
- Atsushi ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE WITH ANISOTROPIC HEXAGONAL BORON NITRIDE THERMAL INT...
- Publication number 20250006670
- Publication date Jan 2, 2025
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Jinliang ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
- Publication number 20240404952
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...
- Publication number 20240363461
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsieh-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR SEMICONDUCTOR DE...
- Publication number 20240348046
- Publication date Oct 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mikito SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20240249982
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLDING CONTACT ENABLED EMI SHIELDING
- Publication number 20240203895
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED LAMINATE PACKAGE WITH 3D INTERCONNECTION STRUCTURE
- Publication number 20240170407
- Publication date May 23, 2024
- pSemi Corporation
- Yuan WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...
- Publication number 20240096817
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ANTENNA
- Publication number 20240088083
- Publication date Mar 14, 2024
- Fujitsu Limited
- Junya IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038693
- Publication date Feb 1, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE
- Publication number 20240030166
- Publication date Jan 25, 2024
- Murata Manufacturing Co., Ltd.
- Hiromichi KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20240030165
- Publication date Jan 25, 2024
- Murata Manufacturing Co., Ltd.
- Kiyoshi AIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT UNIT, AND METHOD...
- Publication number 20240021503
- Publication date Jan 18, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20240014121
- Publication date Jan 11, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20230253341
- Publication date Aug 10, 2023
- MURATA MANUFACTURING CO., LTD.
- Takahiro KITADUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20230170315
- Publication date Jun 1, 2023
- MURATA MANUFACTURING CO., LTD.
- Koji FURUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES
- Publication number 20230082743
- Publication date Mar 16, 2023
- RF360 Europe GmbH
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220415831
- Publication date Dec 29, 2022
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TO DIE HIGH-SPEED COMMUNICATION WITHOUT DISCRETE AMPLIFIERS BET...
- Publication number 20220406737
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20220166407
- Publication date May 26, 2022
- MURATA MANUFACTURING CO., LTD.
- Daisuke MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Semiconductor Transceiver Integrated Circuit
- Publication number 20220038066
- Publication date Feb 3, 2022
- David Scott Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20220013415
- Publication date Jan 13, 2022
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...
- Publication number 20220013414
- Publication date Jan 13, 2022
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND METHOD OF MANUFACTURING ELECTRONIC MODULE
- Publication number 20210366849
- Publication date Nov 25, 2021
- Murata Manufacturing Co., Ltd.
- Takashi IWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
- Publication number 20210210429
- Publication date Jul 8, 2021
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20210203371
- Publication date Jul 1, 2021
- Murata Manufacturing Co., Ltd.
- Kunitoshi HANAOKA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20200211998
- Publication date Jul 2, 2020
- MURATA MANUFACTURING CO., LTD.
- Takanori UEJIMA
- H01 - BASIC ELECTRIC ELEMENTS

Low-noise amplifier [LNA]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die to die high-speed communication without discrete amplifiers bet...

Radio-frequency switching devices having improved voltage handling...

Radio-frequency switching devices having improved voltage handling...

Flip-chip semiconductor-on-insulator transistor layout

Semiconductor device and method for manufacturing the same

Methods related to radio-frequency switching devices having improve...

Radio-frequency module and communication device

Semiconductor-on-insulator transistor layout for radio frequency po...

Electronic module and method of manufacturing electronic module

Radio-frequency module and communication device

Structure and formation method of chip package with shielding struc...

Electronic component module

Radio-frequency switching devices having improved voltage handling...

High-frequency module

Highly integrated RF power and power conversion based on Ga2O3 tech...

Microelectronics package with self-aligned stacked-die assembly

Microelectronics package with self-aligned stacked-die assembly

Microwave module

Microelectronics package with self-aligned stacked-die assembly

Microelectronics package with self-aligned stacked-die assembly

Devices and methods related to radio-frequency switches having impr...

Microelectronics package with self-aligned stacked-die assembly

Highly integrated RF power and power conversion based on Ga2O3 tech...

Wireless communication device with joined semiconductors

Waveguide and semiconductor packaging

Radio-frequency module component

Devices and methods related to radio-frequency switches having impr...

Wireless communication device with joined semiconductors

Linearity performance for radio-frequency switches

Waveguide and semiconductor packaging

Patents Applicationslast 30 patents

METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...

RADIO FREQUENCY MODULE AND MANUFACTURING METHOD OF RADIO FREQUENCY...

IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE

ANTENNA MODULE WITH ANISOTROPIC HEXAGONAL BORON NITRIDE THERMAL INT...

FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT

Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...

DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR SEMICONDUCTOR DE...

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

THROUGH MOLDING CONTACT ENABLED EMI SHIELDING

DOUBLE-SIDED LAMINATE PACKAGE WITH 3D INTERCONNECTION STRUCTURE

ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...

SEMICONDUCTOR DEVICE WITH ANTENNA

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

RADIO-FREQUENCY MODULE

HIGH-FREQUENCY MODULE

ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT UNIT, AND METHOD...

ELECTRONIC CIRCUIT MODULE

CIRCUIT MODULE

RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS

INTEGRATED PASSIVE DEVICES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

DIE TO DIE HIGH-SPEED COMMUNICATION WITHOUT DISCRETE AMPLIFIERS BET...

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

Heterogeneous Semiconductor Transceiver Integrated Circuit

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...

ELECTRONIC MODULE AND METHOD OF MANUFACTURING ELECTRONIC MODULE

FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT

RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE