Low temperature co-fired ceramic [LTCC]

Industry

CPC
H01L2924/09701

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/09701Low temperature co-fired ceramic [LTCC]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Illumination apparatus
- Patent number 11,994,268
- Issue date May 28, 2024
- Optovate Limited
- Jonathan Harrold
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Plurality of dies electrically connected to a printed circuit board...
- Patent number 11,935,807
- Issue date Mar 19, 2024
- Hamilton Sundstrand Corporation
- Karthik Debbadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fuse and anti-fuse structures
- Patent number 11,705,394
- Issue date Jul 18, 2023
- NANYA TECHNOLOGY CORPORATION
- Chin-Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination apparatus
- Patent number 11,629,847
- Issue date Apr 18, 2023
- Optovate Limited
- Jonathan Harrold
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device with fuse and anti-fuse structures and method...
- Patent number 11,521,924
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Chin-Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flip chip
- Patent number RE49286
- Issue date Nov 8, 2022
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Secure smart node and data concentrator for distributed engine control
- Patent number 11,414,201
- Issue date Aug 16, 2022
- University of Dayton
- Vamsy Chodavarapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic composite and production method for ceramic composite
- Patent number 11,390,568
- Issue date Jul 19, 2022
- Adamant Namiki Precision Jewel Co., Ltd.
- Hikaru Muto
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Millimeter wave LTCC filter
- Patent number 11,309,682
- Issue date Apr 19, 2022
- AAC Technologies Pte. Ltd.
- Zhimin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination apparatus
- Patent number 11,287,109
- Issue date Mar 29, 2022
- Optovate Limited
- Jonathan Harrold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules including stacked semiconductor dice
- Patent number 11,101,245
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,094,646
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof stretchable optoelectronics
- Patent number 11,057,991
- Issue date Jul 6, 2021
- The Board of Trustees of the University of Illinois
- John A. Rogers
- F21 - LIGHTING
Information Patent Grant
Method for manufacturing surge absorbing device
- Patent number 11,005,235
- Issue date May 11, 2021
- Ajou University Industry-Academic Cooperation Foundation
- Chang-Koo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density three-dimensional integrated capacitors
- Patent number 11,004,930
- Issue date May 11, 2021
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial adhesive ove...
- Patent number 10,998,248
- Issue date May 4, 2021
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package structure
- Patent number 10,991,681
- Issue date Apr 27, 2021
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a structured coating on a substrate, coated su...
- Patent number 10,954,591
- Issue date Mar 23, 2021
- MSG Lithoglas AG
- Jürgen Leib
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flip chip and method of making flip chip
- Patent number RE48421
- Issue date Feb 2, 2021
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Method of making flip chip
- Patent number RE48422
- Issue date Feb 2, 2021
- Research & Business Foundation SUNGKYUNKWAN UNIV
- Seung Boo Jung
Information Patent Grant
Electronic device
- Patent number 10,879,227
- Issue date Dec 29, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lower IC package structure for coupling with an upper IC package to...
- Patent number 10,879,219
- Issue date Dec 29, 2020
- Intel Corporation
- Shaw Fong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hermetic membranes with electrically conducting vias
- Patent number 10,857,368
- Issue date Dec 8, 2020
- Greatbatch Ltd.
- Keith W. Seitz
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor components having substantially rigid suppor...
- Patent number 10,763,185
- Issue date Sep 1, 2020
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination apparatus
- Patent number 10,718,492
- Issue date Jul 21, 2020
- Optovate Limited
- Jonathan Harrold
- F21 - LIGHTING
Information Patent Grant
Semiconductor device
- Patent number 10,672,750
- Issue date Jun 2, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including miniature antenna
- Patent number 10,644,405
- Issue date May 5, 2020
- Fractus, S.A.
- Jordi Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Illumination apparatus
- Publication number 20240019106
- Publication date Jan 18, 2024
- Optovate Limited
- Jonathan HARROLD
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Illumination apparatus
- Publication number 20230137296
- Publication date May 4, 2023
- Optovate Limited
- Jonathan HARROLD
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
LTCC ELECTRONIC DEVICE UNIT STRUCTURE
- Publication number 20220367363
- Publication date Nov 17, 2022
- ONANO INDUSTRIAL CORP.
- Chun-Hsia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20220205615
- Publication date Jun 30, 2022
- Optovate Limited
- Jonathan HARROLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20220026047
- Publication date Jan 27, 2022
- Optovate Limited
- Jonathan HARROLD
- F21 - LIGHTING
Information Patent Application
High Density Three-dimensional Integrated Capacitors
- Publication number 20210265460
- Publication date Aug 26, 2021
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20200355349
- Publication date Nov 12, 2020
- RealD Spark, LLC
- Jonathan HARROLD
- G02 - OPTICS
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20200295462
- Publication date Sep 17, 2020
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE LTCC FILTER
- Publication number 20200212648
- Publication date Jul 2, 2020
- AAC Technologies Pte. Ltd.
- Zhimin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER
- Publication number 20200185296
- Publication date Jun 11, 2020
- Samsung Electronics Co., Ltd.
- Dong Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20200028264
- Publication date Jan 23, 2020
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination apparatus
- Publication number 20200011510
- Publication date Jan 9, 2020
- Optovate Limited
- Jonathan HARROLD
- F21 - LIGHTING
Information Patent Application
Illumination apparatus
- Publication number 20190257497
- Publication date Aug 22, 2019
- Optovate Limited
- Jonathan HARROLD
- F21 - LIGHTING
Information Patent Application
Methods of Manufacturing an Integrated Circuit Having Stress Tuning...
- Publication number 20190252328
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20190252281
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS
- Publication number 20190237436
- Publication date Aug 1, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC COMPOSITE AND PRODUCTION METHOD FOR CERAMIC COMPOSITE
- Publication number 20190225554
- Publication date Jul 25, 2019
- Adamant Namiki Precision Jewel Co., Ltd.
- Hikaru MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Three-dimensional Integrated Capacitors
- Publication number 20190131387
- Publication date May 2, 2019
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER
- Publication number 20190122949
- Publication date Apr 25, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Dong Hun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20180331427
- Publication date Nov 15, 2018
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SMART NODE AND DATA CONCENTRATOR FOR DISTRIBUTED ENGINE CONTROL
- Publication number 20180319508
- Publication date Nov 8, 2018
- University of Dayton
- Vamsy Chodavarapu
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
LED SURFACE-MOUNT DEVICE AND LED DISPLAY INCORPORATING SUCH DEVICE
- Publication number 20180301438
- Publication date Oct 18, 2018
- CREE HUIZHOU OPTO LIMITED
- Alex Chi Keung Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Implantable Electrode Array Assembly Including A Carrier With Packa...
- Publication number 20180296823
- Publication date Oct 18, 2018
- Stryker Corporation
- Robert A. Brindley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE HERMETIC MEMBRANES WITH ELECTRICALLY CONDUCTING VIAS
- Publication number 20180272137
- Publication date Sep 27, 2018
- Greatbatch Ltd.
- Keith W. Seitz
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Compact Media Player
- Publication number 20180220542
- Publication date Aug 2, 2018
- Apple Inc.
- Christopher D. Prest
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...
- Publication number 20180211896
- Publication date Jul 26, 2018
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20180204781
- Publication date Jul 19, 2018
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...
- Publication number 20180123006
- Publication date May 3, 2018
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIGHT EMITTING DEVICE INCLUDING METAL PATTE...
- Publication number 20180069160
- Publication date Mar 8, 2018
- Nichia Corporation.
- Kazuhiro Kamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASED ELECTRICAL COMPONENT
- Publication number 20180054886
- Publication date Feb 22, 2018
- SnapTrack, Inc.
- Wolfgang PAHL
- H01 - BASIC ELECTRIC ELEMENTS

Low temperature co-fired ceramic [LTCC]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Illumination apparatus

Plurality of dies electrically connected to a printed circuit board...

Methods of manufacturing an integrated circuit having stress tuning...

Semiconductor device with fuse and anti-fuse structures

Semiconductor device and method of forming interposer with opening...

Illumination apparatus

Semiconductor device with fuse and anti-fuse structures and method...

Method of making flip chip

Secure smart node and data concentrator for distributed engine control

Ceramic composite and production method for ceramic composite

Millimeter wave LTCC filter

Illumination apparatus

Multi-chip modules including stacked semiconductor dice

Methods of manufacturing an integrated circuit having stress tuning...

Waterproof stretchable optoelectronics

Method for manufacturing surge absorbing device

High density three-dimensional integrated capacitors

Semiconductor device and method of forming sacrificial adhesive ove...

Three-dimensional package structure

Method for producing a structured coating on a substrate, coated su...

Flip chip and method of making flip chip

Method of making flip chip

Electronic device

Lower IC package structure for coupling with an upper IC package to...

Flexible hermetic membranes with electrically conducting vias

Semiconductor integrated circuit device

Packaged semiconductor components having substantially rigid suppor...

Illumination apparatus

Semiconductor device

Integrated circuit package including miniature antenna

Patents Applicationslast 30 patents

Illumination apparatus

Illumination apparatus

LTCC ELECTRONIC DEVICE UNIT STRUCTURE

Illumination apparatus

Illumination apparatus

High Density Three-dimensional Integrated Capacitors

Illumination apparatus

Integrated Circuit Package Including Miniature Antenna

MILLIMETER WAVE LTCC FILTER

SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER

Integrated Circuit Package Including Miniature Antenna

Illumination apparatus

Illumination apparatus

Methods of Manufacturing an Integrated Circuit Having Stress Tuning...

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS

CERAMIC COMPOSITE AND PRODUCTION METHOD FOR CERAMIC COMPOSITE

High Density Three-dimensional Integrated Capacitors

SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER

Integrated Circuit Package Including Miniature Antenna

SECURE SMART NODE AND DATA CONCENTRATOR FOR DISTRIBUTED ENGINE CONTROL

LED SURFACE-MOUNT DEVICE AND LED DISPLAY INCORPORATING SUCH DEVICE

Implantable Electrode Array Assembly Including A Carrier With Packa...

FLEXIBLE HERMETIC MEMBRANES WITH ELECTRICALLY CONDUCTING VIAS

Compact Media Player

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPOR...

HIGH-FREQUENCY MODULE

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...

METHOD OF MANUFACTURING LIGHT EMITTING DEVICE INCLUDING METAL PATTE...

CASED ELECTRICAL COMPONENT