Lower part of the bonding apparatus

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H01L2224/78801

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78801Lower part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for calibrating wire clamp device
- Patent number 11,257,781
- Issue date Feb 22, 2022
- Shinkawa Ltd.
- Noboru Fujino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonder and method of calibrating a wire bonder
- Patent number 9,620,477
- Issue date Apr 11, 2017
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, and bonding apparatus
- Patent number 8,292,160
- Issue date Oct 23, 2012
- Shinkawa Ltd.
- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive bumps, wire loops, and methods of forming the same
- Patent number 8,152,046
- Issue date Apr 10, 2012
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Work clamp and wire bonding apparatus
- Patent number 7,975,899
- Issue date Jul 12, 2011
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
XY stage
- Patent number 7,654,207
- Issue date Feb 2, 2010
- NEC Corporation
- Maho Shoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding system utilizing multiple positioning tables
- Patent number 7,654,436
- Issue date Feb 2, 2010
- ASM Assembly Automation Ltd.
- Wing Cheung James Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horn-holder pivot type bonding apparatus
- Patent number 7,578,421
- Issue date Aug 25, 2009
- Kabushiki Kaisha Shinkawa
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of measuring thickness of bonded ball in wire bonding
- Patent number 7,191,929
- Issue date Mar 20, 2007
- Kaijo Corporation
- Kimiji Nishimaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding device
- Patent number 6,669,076
- Issue date Dec 30, 2003
- NEC Electronics Corporation
- Jun Nogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 6,607,112
- Issue date Aug 19, 2003
- NEC Corporation
- Yasushi Toda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool position measurement method, offset measurement method, refere...
- Patent number 6,542,783
- Issue date Apr 1, 2003
- Kabushiki Kaisha Shinkawa
- Kuniyuki Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus
- Patent number 6,161,747
- Issue date Dec 19, 2000
- Kabushiki Kaisha Shinkawa
- Hiroshi Ushiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and apparatus for the...
- Patent number 5,950,100
- Issue date Sep 7, 1999
- NEC Corporation
- Tadayuki Shingai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding semiconductor electronic devices
- Patent number 5,735,449
- Issue date Apr 7, 1998
- SGS Thomson Microelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding semiconductor electronic devices
- Patent number 5,660,316
- Issue date Aug 26, 1997
- SGS Thomson Microelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated optical inspection apparatus
- Patent number 5,640,199
- Issue date Jun 17, 1997
- Cognex Corporation
- Arman Garakani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding coordinate teaching method and teaching means
- Patent number 5,579,984
- Issue date Dec 3, 1996
- Kabushiki Kaisha Shinkawa
- Toshiaki Sasano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 5,516,023
- Issue date May 14, 1996
- NEC Corporation
- Takashi Kono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fine pitch wire bonding using a shaved cap...
- Patent number 5,465,899
- Issue date Nov 14, 1995
- Texas Instruments Incorporated
- Roderick L. Quick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotational housing assembly for a lock assembly with a removable core
- Patent number 5,398,531
- Issue date Mar 21, 1995
- Chao C. Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
X-Y table for bonding devices
- Patent number 5,157,985
- Issue date Oct 27, 1992
- Kabushiki Kaisha Shinkawa
- Nobuto Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 5,158,223
- Issue date Oct 27, 1992
- Kabushiki Kaisha Toshiba
- Yasuhiko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonder and wire bonding method
- Patent number 5,156,320
- Issue date Oct 20, 1992
- Kaijo Corporation
- Katsuro Yanagida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
wire bonding method and apparatus and method of producing semicondu...
- Patent number 5,060,841
- Issue date Oct 29, 1991
- Hitachi, Ltd.
- Yoshio Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonds and electrical contacts of an integrated circuit device
- Patent number 4,771,330
- Issue date Sep 13, 1988
- LSI Logic Corporation
- Jon Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus with means and method for automatic calibration u...
- Patent number 4,759,073
- Issue date Jul 19, 1988
- Kulicke & Soffa Industries, Inc.
- Gautam N. Shah
- G05 - CONTROLLING REGULATING
Information Patent Grant
Wire bonding apparatus
- Patent number 4,571,688
- Issue date Feb 18, 1986
- Tokyo Shibaura Denki Kabushiki Kaisha
- Tomio Kashihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making fine wire interconnections
- Patent number 4,437,604
- Issue date Mar 20, 1984
- Kulicke & Soffa Industries, Inc.
- Ely Razon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 4,347,964
- Issue date Sep 7, 1982
- Hitachi, Ltd.
- Nobuhiro Takasugi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDER AND METHOD OF CALIBRATING A WIRE BONDER
- Publication number 20140209663
- Publication date Jul 31, 2014
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETECTING WIRE BONDING FAILURES
- Publication number 20140131425
- Publication date May 15, 2014
- ASM Technology Singapore Pte Ltd
- Wei LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME
- Publication number 20120006882
- Publication date Jan 12, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND BONDING APPARATUS
- Publication number 20110315743
- Publication date Dec 29, 2011
- SHINKAWA LTD.
- Yusuke MARUYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Horn-holder pivot type bonding apparatus
- Publication number 20090272498
- Publication date Nov 5, 2009
- KABUSHIKI KAISHA SHINKAWA
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Work Clamp and Wire Bonding Apparatus
- Publication number 20090134201
- Publication date May 28, 2009
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING SYSTEM UTILIZING MULTIPLE POSITIONING TABLES
- Publication number 20090078743
- Publication date Mar 26, 2009
- Wing Cheung James HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Imaging device and method for a bonding apparatus
- Publication number 20090059361
- Publication date Mar 5, 2009
- KABUSHIKI KAISHA SHINKAWA
- Shigeru Hayata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method, wire bonding apparatus and semiconductor device
- Publication number 20080054440
- Publication date Mar 6, 2008
- FUJITSU LIMITED
- Takayoshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Horn-holder pivot type bonding apparatus
- Publication number 20070205252
- Publication date Sep 6, 2007
- KABUSHIKI KAISHA SHINKAWA
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of measuring thickness of bonded ball in wire bonding
- Publication number 20060054662
- Publication date Mar 16, 2006
- Kimiji Nishimaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding device
- Publication number 20020104870
- Publication date Aug 8, 2002
- NEC Corporation
- Jun Nogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus
- Publication number 20020014512
- Publication date Feb 7, 2002
- NEC Corporation
- Yasushi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tool position measurement method, offset measurement method, refere...
- Publication number 20010016786
- Publication date Aug 23, 2001
- KABUSHIKI KAISHA SHINKAWA
- Kuniyuki Takahashi
- G05 - CONTROLLING REGULATING

Lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for calibrating wire clamp device

Wire bonder and method of calibrating a wire bonder

Method of manufacturing semiconductor device, and bonding apparatus

Conductive bumps, wire loops, and methods of forming the same

Work clamp and wire bonding apparatus

XY stage

Wire bonding system utilizing multiple positioning tables

Horn-holder pivot type bonding apparatus

Method of measuring thickness of bonded ball in wire bonding

Wire bonding device

Wire bonding apparatus

Tool position measurement method, offset measurement method, refere...

Bonding apparatus

Method of manufacturing semiconductor device and apparatus for the...

Method and apparatus for bonding semiconductor electronic devices

Method and apparatus for bonding semiconductor electronic devices

Automated optical inspection apparatus

Bonding coordinate teaching method and teaching means

Wire bonding apparatus

Method and apparatus for fine pitch wire bonding using a shaved cap...

Rotational housing assembly for a lock assembly with a removable core

X-Y table for bonding devices

Wire bonding apparatus

Wire bonder and wire bonding method

wire bonding method and apparatus and method of producing semicondu...

Wire bonds and electrical contacts of an integrated circuit device

Bonding apparatus with means and method for automatic calibration u...

Wire bonding apparatus

Method of making fine wire interconnections

Wire bonding apparatus

Patents Applicationslast 30 patents

WIRE BONDER AND METHOD OF CALIBRATING A WIRE BONDER

METHOD OF DETECTING WIRE BONDING FAILURES

CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND BONDING APPARATUS

Horn-holder pivot type bonding apparatus

Work Clamp and Wire Bonding Apparatus

WIRE BONDING SYSTEM UTILIZING MULTIPLE POSITIONING TABLES

Imaging device and method for a bonding apparatus

Wire bonding method, wire bonding apparatus and semiconductor device

Horn-holder pivot type bonding apparatus

Method of measuring thickness of bonded ball in wire bonding

Wire bonding device

Wire bonding apparatus

Tool position measurement method, offset measurement method, refere...