Magnesium [Mg] as principal constituent

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H01L2224/05623

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05623Magnesium [Mg] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Display panel and method of fabricating the same, display device
- Patent number 10,950,592
- Issue date Mar 16, 2021
- BOE Technology Group Co., Ltd.
- Xiaoliang Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of interconnect for high density 2.5D and 3D integration
- Patent number 10,593,638
- Issue date Mar 17, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having solder joint and method of forming the...
- Patent number 9,646,945
- Issue date May 9, 2017
- Samsung Electronics Co., Ltd.
- Soon-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, a power semiconductor device, and a method fo...
- Patent number 9,633,957
- Issue date Apr 25, 2017
- Infineon Technologies AG
- Jochen Hilsenbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor package and fabricating method th...
- Patent number 9,620,460
- Issue date Apr 11, 2017
- Samsung Electronics Co., Ltd.
- Hyun-Pil Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,553,060
- Issue date Jan 24, 2017
- Renesas Electronics Corporation
- Kazuyuki Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of fabricating the same
- Patent number 9,368,482
- Issue date Jun 14, 2016
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of fabricating the same
- Patent number 9,214,410
- Issue date Dec 15, 2015
- SK Hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate structure and manufacturing method...
- Patent number 8,269,354
- Issue date Sep 18, 2012
- Unimicron Technology Corp.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabricating method thereof
- Patent number 8,183,683
- Issue date May 22, 2012
- Amkor Technology, Inc.
- Joon Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and semiconductor package
- Patent number 8,110,931
- Issue date Feb 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board surface structure
- Patent number 8,058,564
- Issue date Nov 15, 2011
- Unimicron Technology Corp.
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package substrate structure and manufacturing method...
- Patent number 7,847,400
- Issue date Dec 7, 2010
- Unimicron Technology Corp.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device with shear stress compensation
- Patent number 6,888,246
- Issue date May 3, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device and method of formation
- Patent number 6,646,347
- Issue date Nov 11, 2003
- Motorola, Inc.
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of passivating a semiconductor device bonding pad by immers...
- Patent number 5,565,378
- Issue date Oct 15, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379639
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Myung Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND METHOD OF FABRICATING THE SAME, DISPLAY DEVICE
- Publication number 20200083205
- Publication date Mar 12, 2020
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiaoliang DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20170033075
- Publication date Feb 2, 2017
- Advanced Semiconductor, Inc.
- Min-Fong SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20160300804
- Publication date Oct 13, 2016
- RENESAS ELECTRONICS CORPORATION
- Kazuyuki OMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, A POWER SEMICONDUCTOR DEVICE, AND A METHOD FO...
- Publication number 20160155714
- Publication date Jun 2, 2016
- INFINEON TECHNOLOGIES AG
- Jochen HILSENBECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20110031617
- Publication date Feb 10, 2011
- UNIMICRON TECHONOLOGY COPR.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING ELEMENT, SEMICONDUCTOR LIGHT EMITTING...
- Publication number 20100237382
- Publication date Sep 23, 2010
- Hidenori Kamei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
- Publication number 20100007004
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE HAVING ELECTRICAL CONNECTING PADS
- Publication number 20080290528
- Publication date Nov 27, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20080272501
- Publication date Nov 6, 2008
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD SURFACE STRUCTURE
- Publication number 20080217047
- Publication date Sep 11, 2008
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor power device and method of formation
- Publication number 20030232493
- Publication date Dec 18, 2003
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE AND METHOD OF FORMATION
- Publication number 20030102563
- Publication date Jun 5, 2003
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS

Magnesium [Mg] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display panel and method of fabricating the same, display device

Methods of interconnect for high density 2.5D and 3D integration

Bonding structure for semiconductor package and method of manufactu...

Semiconductor device having solder joint and method of forming the...

Semiconductor device, a power semiconductor device, and a method fo...

Semiconductor chip, semiconductor package and fabricating method th...

Semiconductor device and manufacturing method therefor

Stack packages and methods of fabricating the same

Stack packages and methods of fabricating the same

Semiconductor package substrate structure and manufacturing method...

Semiconductor device and fabricating method thereof

Wafer and semiconductor package

Circuit board surface structure

Semiconductor package substrate structure and manufacturing method...

Semiconductor power device with shear stress compensation

Semiconductor power device and method of formation

Process of passivating a semiconductor device bonding pad by immers...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

DISPLAY PANEL AND METHOD OF FABRICATING THE SAME, DISPLAY DEVICE

BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE, A POWER SEMICONDUCTOR DEVICE, AND A METHOD FO...

SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...

SEMICONDUCTOR LIGHT EMITTING ELEMENT, SEMICONDUCTOR LIGHT EMITTING...

WAFER AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING ELECTRICAL CONNECTING PADS

SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...

CIRCUIT BOARD SURFACE STRUCTURE

Semiconductor power device and method of formation

SEMICONDUCTOR POWER DEVICE AND METHOD OF FORMATION