Magnesium [Mg] as principal constituent

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device

    • Patent number 11,862,598
    • Issue date Jan 2, 2024
    • Rohm Co., Ltd.
    • Katsuhiko Yoshihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-layered composite bonding materials and power electronics ass...

    • Patent number 10,886,251
    • Issue date Jan 5, 2021
    • Toyota Motor Engineering & Manufacturing North America, Inc.
    • Shailesh N. Joshi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Display device and manufacturing method thereof

    • Patent number 10,879,492
    • Issue date Dec 29, 2020
    • Japan Display Inc.
    • Masakazu Gunji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for applying a bonding layer

    • Patent number 10,438,925
    • Issue date Oct 8, 2019
    • EV Group E. Thallner GmbH
    • Markus Wimplinger
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Low temperature high reliability alloy for solder hierarchy

    • Patent number 10,322,471
    • Issue date Jun 18, 2019
    • Alpha Assembly Solutions Inc.
    • Pritha Choudhury
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Power module

    • Patent number 9,818,716
    • Issue date Nov 14, 2017
    • Mitsubishi Electric Corporation
    • Junji Fujino
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for applying a bonding layer

    • Patent number 9,627,349
    • Issue date Apr 18, 2017
    • EV Group E. Thallner GmbH
    • Markus Wimplinger
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    3755882

    • Patent number 3,755,882
    • Issue date Sep 4, 1973
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents