maintaining a controlled atmosphere with techniques not provided for in B81B7/0038

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B81B7/0041

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0041maintaining a controlled atmosphere with techniques not provided for in B81B7/0038

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Micro electro mechanical system (MEMs) device having metal sealing...
- Patent number 12,202,724
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cavity with non-contaminating seal
- Patent number 12,187,606
- Issue date Jan 7, 2025
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component for a sensor device having a capacitor se...
- Patent number 12,163,851
- Issue date Dec 10, 2024
- Robert Bosch GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical shear weld wafer bonding
- Patent number 11,858,806
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming dielectric and metal sealing layers on capping st...
- Patent number 11,772,960
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with perimeter barometric relief pierce
- Patent number 11,772,961
- Issue date Oct 3, 2023
- Knowles Electronics, LLC
- Michael Kuntzman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cavity with non-contaminating seal
- Patent number 11,618,675
- Issue date Apr 4, 2023
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,459,226
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Yasuo Yamaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ultrasonic sensor
- Patent number 11,445,304
- Issue date Sep 13, 2022
- Denso Corporation
- Tatsuya Kamiya
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,434,129
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and manufacturing method of the same
- Patent number 11,365,117
- Issue date Jun 21, 2022
- Industrial Technology Research Institute
- Heng-chung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed package
- Patent number 11,264,296
- Issue date Mar 1, 2022
- Corning Incorporated
- Ming-Huang Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor encapsulated in elastomeric material, and system in...
- Patent number 11,254,561
- Issue date Feb 22, 2022
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cavity with non-contaminating seal
- Patent number 11,220,425
- Issue date Jan 11, 2022
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system cavity packaging
- Patent number 11,203,524
- Issue date Dec 21, 2021
- Texas Instruments Incorporated
- Jose Antonio Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming hermetic seals in MEMS devices
- Patent number 11,161,737
- Issue date Nov 2, 2021
- Elbit Systems of America, LLC
- Arlynn W. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Decoupling structure for accelerometer
- Patent number 11,161,733
- Issue date Nov 2, 2021
- SAFRAN COLIBRYS SA
- Stephan Gonseth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component and module including the same
- Patent number 11,139,795
- Issue date Oct 5, 2021
- Murata Manufacturing Co., Ltd.
- Koichiro Kawasaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for setting a pressure in a cavity formed with the aid of a...
- Patent number 11,084,714
- Issue date Aug 10, 2021
- Robert Bosch GmbH
- Peter Borwin Staffeld
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,078,075
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer sealing film for high seal yield
- Patent number 11,034,578
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method for the same
- Patent number 10,961,114
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching-Kai Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging a sealed cavity in an electronic device
- Patent number 10,913,654
- Issue date Feb 9, 2021
- Texas Instruments Incorporated
- Adam Joseph Fruehling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a micromechanical element
- Patent number 10,889,491
- Issue date Jan 12, 2021
- Robert Bosch GmbH
- Markus Kuhnke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and method for sealing through-hole, and transfer substra...
- Patent number 10,870,151
- Issue date Dec 22, 2020
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Hermetic vertical shear weld wafer bonding
- Patent number 10,759,658
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS cavity with non-contaminating seal
- Patent number 10,696,547
- Issue date Jun 30, 2020
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer sealing film for high seal yield
- Patent number 10,676,343
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system cavity packaging
- Patent number 10,611,631
- Issue date Apr 7, 2020
- Texas Instruments Incorporated
- Jose Antonio Martinez
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A BORE FOR A CAVITY ARRANGED WITHIN A SEMICONDUC...
- Publication number 20250136440
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH TEMPERATURE PIEZO-RESISTIVE PRESSURE SENSOR AND PACKAGING ASSE...
- Publication number 20240302237
- Publication date Sep 12, 2024
- Rosemount Aerospace Inc.
- Jun Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Ultrasonic Particle Reduction System for an Acoustic Micro-Valve
- Publication number 20240292139
- Publication date Aug 29, 2024
- Apple Inc.
- Scott C. Grinker
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
- Publication number 20240228267
- Publication date Jul 11, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR
- Publication number 20240208804
- Publication date Jun 27, 2024
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Encapsulated MEMS Switching Element, Device and Production Method
- Publication number 20240150166
- Publication date May 9, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Oliver Raab
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
- Publication number 20240132342
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Bo CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240083743
- Publication date Mar 14, 2024
- Vanguard International Semiconductor Corporation
- RAKESH CHAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package and Method for Encapsulating an MEMS Structure
- Publication number 20230382722
- Publication date Nov 30, 2023
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Frank SENGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230382719
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLUG FOR MEMS CAVITY
- Publication number 20230365399
- Publication date Nov 16, 2023
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20230357002
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CAVITY WITH NON-CONTAMINATING SEAL
- Publication number 20230286798
- Publication date Sep 14, 2023
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabrication Method of MEMS Transducer Element
- Publication number 20230146234
- Publication date May 11, 2023
- TE Connectivity Solutions GMBH
- Jean-Francois Le Neal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME
- Publication number 20230128755
- Publication date Apr 27, 2023
- SCHOTT AG
- Antti Määttänen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL MEASUREMENT UNIT
- Publication number 20230125187
- Publication date Apr 27, 2023
- SEIKO EPSON CORPORATION
- Shinji Nishio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH PERIMETER BAROMETRIC RELIEF PIERCE
- Publication number 20230062556
- Publication date Mar 2, 2023
- KNOWLES ELECTRONICS, LLC
- Michael Kuntzman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE
- Publication number 20220390311
- Publication date Dec 8, 2022
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220315414
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIPLY ENCAPSULATED MICRO ELECTRICAL MECHANICAL SYSTEMS DEVICE
- Publication number 20220219971
- Publication date Jul 14, 2022
- CAMBRIDGE ENTERPRISE LIMITED
- Ashwin SESHIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Signal Processing Circuit for Triple-Membrane MEMS Device
- Publication number 20220194784
- Publication date Jun 23, 2022
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CAVITY WITH NON-CONTAMINATING SEAL
- Publication number 20220162063
- Publication date May 26, 2022
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20220017363
- Publication date Jan 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL SHEAR WELD WAFER BONDING
- Publication number 20210371272
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE
- Publication number 20210229985
- Publication date Jul 29, 2021
- TOHOKU UNIVERSITY
- Yukio SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210206627
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210188626
- Publication date Jun 24, 2021
- Industrial Technology Research Institute
- Heng-chung CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL SHEAR WELD WAFER BONDING
- Publication number 20200391993
- Publication date Dec 17, 2020
- TEXAS INSTRUMENTS INCORPORATED
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CAVITY WITH NON-CONTAMINATING SEAL
- Publication number 20200391997
- Publication date Dec 17, 2020
- SiTime Corporation
- Michael Julian Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200377362
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHING-KAI SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY

maintaining a controlled atmosphere with techniques not provided for in B81B7/0038

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro electro mechanical system (MEMs) device having metal sealing...

MEMS cavity with non-contaminating seal

Micromechanical component for a sensor device having a capacitor se...

Vertical shear weld wafer bonding

Method of forming dielectric and metal sealing layers on capping st...

MEMS device with perimeter barometric relief pierce

Packaging method and associated packaging structure

MEMS cavity with non-contaminating seal

Semiconductor device and semiconductor device manufacturing method

Ultrasonic sensor

Semiconductor structure and method for fabricating the same

MEMS device and manufacturing method of the same

Hermetically sealed package

Pressure sensor encapsulated in elastomeric material, and system in...

MEMS cavity with non-contaminating seal

Microelectromechanical system cavity packaging

Method for forming hermetic seals in MEMS devices

Decoupling structure for accelerometer

Electronic component and module including the same

Method for setting a pressure in a cavity formed with the aid of a...

Packaging method and associated packaging structure

Multi-layer sealing film for high seal yield

Semiconductor structure and manufacturing method for the same

Packaging a sealed cavity in an electronic device

Method for producing a micromechanical element

Structure and method for sealing through-hole, and transfer substra...

Hermetic vertical shear weld wafer bonding

MEMS cavity with non-contaminating seal

Multi-layer sealing film for high seal yield

Microelectromechanical system cavity packaging

Patents Applicationslast 30 patents

METHOD FOR FORMING A BORE FOR A CAVITY ARRANGED WITHIN A SEMICONDUC...

HIGH TEMPERATURE PIEZO-RESISTIVE PRESSURE SENSOR AND PACKAGING ASSE...

Ultrasonic Particle Reduction System for an Acoustic Micro-Valve

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR

Encapsulated MEMS Switching Element, Device and Production Method

LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES

MICROELECTROMECHANICAL SYSTEMS PACKAGE AND METHOD FOR MANUFACTURING...

MEMS Package and Method for Encapsulating an MEMS Structure

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

PLUG FOR MEMS CAVITY

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

MEMS CAVITY WITH NON-CONTAMINATING SEAL

Fabrication Method of MEMS Transducer Element

HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME

INERTIAL MEASUREMENT UNIT

MEMS DEVICE WITH PERIMETER BAROMETRIC RELIEF PIERCE

MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

MULTIPLY ENCAPSULATED MICRO ELECTRICAL MECHANICAL SYSTEMS DEVICE

Signal Processing Circuit for Triple-Membrane MEMS Device

MEMS CAVITY WITH NON-CONTAMINATING SEAL

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

VERTICAL SHEAR WELD WAFER BONDING

METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

MEMS DEVICE AND MANUFACTURING METHOD OF THE SAME

VERTICAL SHEAR WELD WAFER BONDING

MEMS CAVITY WITH NON-CONTAMINATING SEAL

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME